ES2146768T3 - Un dispositivo de acoplamiento que presenta y/o domina una capacidad perteneciente a una placa con un circuito impreso. - Google Patents

Un dispositivo de acoplamiento que presenta y/o domina una capacidad perteneciente a una placa con un circuito impreso.

Info

Publication number
ES2146768T3
ES2146768T3 ES95930072T ES95930072T ES2146768T3 ES 2146768 T3 ES2146768 T3 ES 2146768T3 ES 95930072 T ES95930072 T ES 95930072T ES 95930072 T ES95930072 T ES 95930072T ES 2146768 T3 ES2146768 T3 ES 2146768T3
Authority
ES
Spain
Prior art keywords
printed circuit
coupling device
masters
presents
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95930072T
Other languages
English (en)
Inventor
Johnsen Helge Bodahl
Mats Olav Timgren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of ES2146768T3 publication Critical patent/ES2146768T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/14—Arrangements for reducing ripples from DC input or output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Logic Circuits (AREA)

Abstract

LA INVENCION SE REFIERE A UN DISPOSITIVO DE ACOPLAMIENTO QUE PRESENTA UN CONDENSADOR QUE PERTENECE A UNA TARJETA CON UN CIRCUITO IMPRESO, EN DONDE LA TARJETA (1) CONSTA DE VARIAS CAPAS ELECTRICAMENTE CONDUCTORAS (50E, 50G) CON CAPAS ELECTRICAMENTE AISLANTES ENTRE MEDIAS (50EG). UNA EXTENSION SUPERFICIAL DE LA CAPA RELACIONADA CON EL POTENCIAL DE REFERENCIA (50E), UNA EXTENSION SUPERFICIAL OPUESTA DE UNA CAPA RELACIONADA CON EL SUMINISTRO DE TENSION (50G) Y UNA DISTANCIA ESCOGIDA ENTRE LAS CAPAS SE ADAPTAN PARA FORMAR UNA FUNCION DE CONDENSADOR PARA ALLANAR LAS PUNTAS DE TENSION DE MANERA QUE LA TENSION DE ALIMENTACION DE CORRIENTE CONTINUA PUEDA SER CONSTANTE ALREDEDOR DE LOS CIRCUITOS (2) MONTADOS SOBRE LA TARJETA INCLUSO EN VARIACIONES RAPIDAS DE CORRIENTE A MEDIDA QUE LOS CIRCUITOS Y/O COMPONENTES SON ACTIVADOS.
ES95930072T 1994-08-22 1995-07-31 Un dispositivo de acoplamiento que presenta y/o domina una capacidad perteneciente a una placa con un circuito impreso. Expired - Lifetime ES2146768T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9402792A SE503166C2 (sv) 1994-08-22 1994-08-22 Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang

Publications (1)

Publication Number Publication Date
ES2146768T3 true ES2146768T3 (es) 2000-08-16

Family

ID=20394981

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95930072T Expired - Lifetime ES2146768T3 (es) 1994-08-22 1995-07-31 Un dispositivo de acoplamiento que presenta y/o domina una capacidad perteneciente a una placa con un circuito impreso.

Country Status (11)

Country Link
US (1) US5815373A (es)
EP (1) EP0777873B1 (es)
KR (1) KR100217514B1 (es)
AU (1) AU698863B2 (es)
CA (1) CA2190458A1 (es)
DE (1) DE69516879T2 (es)
ES (1) ES2146768T3 (es)
FI (1) FI970321A0 (es)
NO (1) NO970777L (es)
SE (1) SE503166C2 (es)
WO (1) WO1996006389A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
JP3610221B2 (ja) * 1998-01-27 2005-01-12 キヤノン株式会社 多層プリント配線基板
US6014319A (en) * 1998-05-21 2000-01-11 International Business Machines Corporation Multi-part concurrently maintainable electronic circuit card assembly
US20060179305A1 (en) * 2004-03-11 2006-08-10 Junbiao Zhang WLAN session management techniques with secure rekeying and logoff
WO2006104613A2 (en) 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
US8025634B1 (en) * 2006-09-18 2011-09-27 Baxter International Inc. Method and system for controlled infusion of therapeutic substances
CN109496057A (zh) * 2018-11-12 2019-03-19 晶晨半导体(上海)股份有限公司 一种印制电路板布局
FR3089341B1 (fr) * 2018-12-03 2022-04-22 Psa Automobiles Sa Dispositif de couplage à pièces assurant un couplage entre une liaison électrique et un élément conducteur

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441070A (en) * 1982-02-26 1984-04-03 Motorola, Inc. Voltage regulator circuit with supply voltage ripple rejection to transient spikes
DE3242023A1 (de) * 1982-11-12 1984-05-17 Siemens AG, 1000 Berlin und 8000 München Schaltungsanordnung zur speisung von elektrischen verbrauchern mit einer gleichspannung
US5065284A (en) * 1988-08-01 1991-11-12 Rogers Corporation Multilayer printed wiring board
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5161086A (en) * 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JPH03258101A (ja) * 1990-03-08 1991-11-18 Nec Corp 回路基板
US5198969A (en) * 1990-07-13 1993-03-30 Design Automation, Inc. Soft-switching full-bridge dc/dc converting
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
JPH05219729A (ja) * 1992-02-07 1993-08-27 Sony Corp 直流電源装置

Also Published As

Publication number Publication date
SE9402792L (sv) 1996-02-23
CA2190458A1 (en) 1996-02-29
AU3357695A (en) 1996-03-14
AU698863B2 (en) 1998-11-12
DE69516879T2 (de) 2000-11-09
EP0777873A1 (en) 1997-06-11
NO970777L (no) 1997-04-21
FI970321L (fi) 1997-01-24
FI970321A7 (fi) 1997-01-24
EP0777873B1 (en) 2000-05-10
WO1996006389A1 (en) 1996-02-29
NO970777D0 (no) 1997-02-20
FI970321A0 (fi) 1997-01-24
KR100217514B1 (ko) 1999-09-01
SE9402792D0 (sv) 1994-08-22
SE503166C2 (sv) 1996-04-15
US5815373A (en) 1998-09-29
DE69516879D1 (de) 2000-06-15

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