ES2146989T3 - Procedimiento y dispositivo para el contacto de un conductor de hilo. - Google Patents
Procedimiento y dispositivo para el contacto de un conductor de hilo.Info
- Publication number
- ES2146989T3 ES2146989T3 ES97914139T ES97914139T ES2146989T3 ES 2146989 T3 ES2146989 T3 ES 2146989T3 ES 97914139 T ES97914139 T ES 97914139T ES 97914139 T ES97914139 T ES 97914139T ES 2146989 T3 ES2146989 T3 ES 2146989T3
- Authority
- ES
- Spain
- Prior art keywords
- wire conductor
- connection surface
- procedure
- contact
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
- Near-Field Transmission Systems (AREA)
- Credit Cards Or The Like (AREA)
- Coating With Molten Metal (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
LA INVENCION TRATA DE UN PROCEDIMIENTO Y UN DISPOSITIVO PARA CONTACTAR UN CONDUCTOR DE ALAMBRE (13) EN LA PRODUCCION DE UNA UNIDAD DE TRANSPONDER QUE MUESTRA UNA BOBINA DE ALAMBRE (12) Y UNA UNIDAD DE CHIP (15) Y QUE ESTA DISPUESTA SOBRE UN SUSTRATO (11). DURANTE UNA PRIMERA FASE DEL CONDUCTOR DE ALAMBRE (13), ESTA UNIDAD SE MUEVE POR LA SUPERFICIE DE CONEXION (18, 19) O A LO LARGO DE LA ZONA QUE ALOJA LA SUPERFICIE DE CONEXION, QUEDANDO FIJADA CON RESPECTO A LA SUPERFICIE DE CONEXION (18, 19) O LA ZONA ASOCIADA A LA SUPERFICIE DE CONEXION SOBRE EL SUSTRATO (11). EN UNA SEGUNDA FASE, TIENE LUGAR LA UNION DEL CONDUCTOR DE ALAMBRE (13) CON LA SUPERFICIE DE CONEXION (18, 19) MEDIANTE UN DISPOSITIVO DE UNION (25, 37).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19604840 | 1996-02-12 | ||
| DE19619771A DE19619771A1 (de) | 1996-02-12 | 1996-05-17 | Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate |
| DE1996120242 DE19620242C2 (de) | 1996-05-20 | 1996-05-20 | Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters bei der Herstellung einer Transpondereinheit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2146989T3 true ES2146989T3 (es) | 2000-08-16 |
Family
ID=27215898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES97914139T Expired - Lifetime ES2146989T3 (es) | 1996-02-12 | 1997-02-12 | Procedimiento y dispositivo para el contacto de un conductor de hilo. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6233818B1 (es) |
| EP (1) | EP0880754B1 (es) |
| JP (1) | JP3721520B2 (es) |
| CN (1) | CN1119768C (es) |
| AT (1) | ATE193136T1 (es) |
| AU (1) | AU709049B2 (es) |
| CA (1) | CA2245775C (es) |
| ES (1) | ES2146989T3 (es) |
| WO (1) | WO1997030418A2 (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
| US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
Families Citing this family (141)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
| US20110043430A1 (en) * | 1997-10-16 | 2011-02-24 | Oded Bashan | Manufacture of a smart card |
| DE19844089C2 (de) * | 1998-06-25 | 2001-04-05 | Pav Card Gmbh | Verfahren zur Herstellung von Transponderanordnungen |
| DE69919030T2 (de) * | 1998-12-14 | 2005-08-18 | Advanced Interconnection Technology, Inc. | Verbessertes verfahren zur verlegung eines drahtförmigen leiters auf ebenen und nicht ebenen flächen, verbesserte platten-verbindungskarten mit darin verlegten drähten und mit diesem verfahren hergestellte chipkarte |
| US6883714B2 (en) | 1998-12-14 | 2005-04-26 | Stratos Lightwave, Inc. | Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
| JP4494558B2 (ja) * | 1999-09-13 | 2010-06-30 | 古河電気工業株式会社 | Icカードの製造方法 |
| EP1100296A4 (en) * | 1999-05-07 | 2002-07-17 | Furukawa Electric Co Ltd | METHOD AND DEVICE FOR WIRING |
| US20020099473A1 (en) * | 2000-11-08 | 2002-07-25 | Paul Amadeo | Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards |
| US7108546B2 (en) * | 2001-06-20 | 2006-09-19 | Formfactor, Inc. | High density planar electrical interface |
| US20030060842A1 (en) * | 2001-09-27 | 2003-03-27 | Yem Chin | Method and apparatus for measuring and controlling blade depth of a tissue cutting apparatus in an endoscopic catheter |
| US6604686B1 (en) * | 2001-10-09 | 2003-08-12 | Vahid Taban | High speed system for embedding wire antennas in an array of smart cards |
| FR2868987B1 (fr) * | 2004-04-14 | 2007-02-16 | Arjo Wiggins Secutity Sas Soc | Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur |
| WO2006000068A1 (en) * | 2004-06-23 | 2006-01-05 | Global ID South América Ltda. | Process to manufacture transponder and the corresponding production equipment |
| JP4363647B2 (ja) * | 2004-09-09 | 2009-11-11 | 株式会社小糸製作所 | 車輌用灯具及び車輌用灯具の製造方法 |
| FR2877462B1 (fr) * | 2004-10-29 | 2007-01-26 | Arjowiggins Security Soc Par A | Structure comportant un dispositif electronique pour la fabrication d'un document de securite. |
| AU2005304141B2 (en) | 2004-11-02 | 2010-08-26 | Hid Global Gmbh | Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
| FR2892842B1 (fr) * | 2005-10-28 | 2008-02-15 | Oberthur Card Syst Sa | Procede de fabrication d'une pluralite de cartes a microcircuit |
| US20070176007A1 (en) * | 2006-01-31 | 2007-08-02 | Priya Suresh C | Variably sized mini card |
| US7546671B2 (en) | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
| US7581308B2 (en) * | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
| US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
| KR101346050B1 (ko) * | 2006-09-26 | 2013-12-31 | 에이치아이디 글로벌 게엠베하 | 트랜스폰더 칩 및 관련 인레이 기판에의 안테나 연결 방법 |
| US8322624B2 (en) | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
| US7979975B2 (en) | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
| US8240022B2 (en) * | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
| US8286332B2 (en) | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
| JP5167264B2 (ja) * | 2006-09-26 | 2013-03-21 | エイチアイディー グローバル ジーエムビーエイチ | 無線周波数インレイを作製する方法および装置 |
| EP2070017B2 (en) | 2006-09-26 | 2014-09-24 | Féinics AmaTech Teoranta | Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
| US8608080B2 (en) | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
| US7971339B2 (en) * | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
| ES2376760T3 (es) * | 2006-10-12 | 2012-03-16 | Hid Global Gmbh | Transpondedor empotrado en un soporte multicapa flexible |
| DE102006053823B4 (de) * | 2006-11-14 | 2009-02-05 | Bundesdruckerei Gmbh | Verfahren zum Verlegen eines Drahtes |
| US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
| EP2001077A1 (fr) | 2007-05-21 | 2008-12-10 | Gemplus | Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu |
| US7707706B2 (en) | 2007-06-29 | 2010-05-04 | Ruhlamat Gmbh | Method and arrangement for producing a smart card |
| DE102007030650B4 (de) * | 2007-07-02 | 2011-05-05 | Ruhlamat Automatisierungstechnik Gmbh | Verfahren zur Herstellung einer Chipkarte |
| MY159909A (en) * | 2007-09-14 | 2017-02-15 | Toppan Printing Co Ltd | Antenna sheet, transponder and book form |
| EP2040201B1 (en) | 2007-09-18 | 2010-11-17 | HID Global Ireland Teoranta | Method for bonding a wire conductor laid on a substrate |
| US20090123743A1 (en) * | 2007-11-14 | 2009-05-14 | Guy Shafran | Method of manufacture of wire imbedded inlay |
| US20110247197A1 (en) | 2008-01-09 | 2011-10-13 | Feinics Amatech Teoranta | Forming channels for an antenna wire of a transponder |
| US8522431B2 (en) * | 2008-01-09 | 2013-09-03 | Féines Amatech Teoranta | Mounting and connecting an antenna wire in a transponder |
| CN101933034B (zh) * | 2008-01-23 | 2015-04-01 | 斯迈达Ip有限公司 | 用于制造智能卡嵌体的方法和系统 |
| ES2590339T3 (es) | 2008-02-22 | 2016-11-21 | Toppan Printing Co., Ltd. | Transpondedor y forma de libro |
| EP2138963A1 (fr) | 2008-06-27 | 2009-12-30 | Gemplus | Procédé de réalisation d'un dispositif ajustable en épaisseur comportant une antenne de transpondeur radiofréquence et dispositif obtenu |
| US20100090008A1 (en) * | 2008-10-13 | 2010-04-15 | Oded Bashan | Authentication seal |
| DE102009003312A1 (de) * | 2008-10-14 | 2010-04-15 | Hesse & Knipps Gmbh | Bondvorrichtung, Ultraschall-Transducer und Bondverfahren |
| US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
| FR2939935B1 (fr) | 2008-12-11 | 2010-12-17 | Oberthur Technologies | Procede de fabrication de masse de dispositifs electroniques portables permettant des communications sans contact. |
| DE102009005570B4 (de) * | 2009-01-21 | 2012-11-29 | Mühlbauer Ag | Verfahren zum Herstellen einer Antenne auf einem Substrat |
| JPWO2010087336A1 (ja) * | 2009-01-27 | 2012-08-02 | パナソニック株式会社 | 半導体チップの実装方法、該方法を用いて得られた半導体装置及び半導体チップの接続方法、並びに、表面に配線が設けられた立体構造物及びその製法 |
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| EP2216866A3 (en) | 2009-02-06 | 2011-07-13 | HID Global GmbH | Method to strip a portion of an insulated wire |
| WO2011024844A1 (ja) | 2009-08-26 | 2011-03-03 | 凸版印刷株式会社 | 非接触通信媒体 |
| KR101669309B1 (ko) | 2009-08-26 | 2016-10-25 | 도판 인사츠 가부시키가이샤 | 비접촉 통신 매체 |
| EP2302566B1 (en) | 2009-09-22 | 2013-03-27 | ats Automation Technology Services | Method for connecting at least one wire conductor disposed on a substrate with a chip of a transponder unit |
| DE102009043587A1 (de) | 2009-09-30 | 2011-05-19 | Smartrac Ip B.V. | Funktionelles Laminat |
| US8474726B2 (en) | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
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| IT1398079B1 (it) * | 2010-02-10 | 2013-02-07 | Lolli | Apparato per realizzare antenne per dispositivi di identificazione a radiofrequenza |
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-
1997
- 1997-02-12 AU AU28463/97A patent/AU709049B2/en not_active Expired
- 1997-02-12 EP EP97914139A patent/EP0880754B1/de not_active Expired - Lifetime
- 1997-02-12 CN CN97192030A patent/CN1119768C/zh not_active Expired - Lifetime
- 1997-02-12 US US09/117,970 patent/US6233818B1/en not_active Expired - Lifetime
- 1997-02-12 WO PCT/DE1997/000261 patent/WO1997030418A2/de not_active Ceased
- 1997-02-12 ES ES97914139T patent/ES2146989T3/es not_active Expired - Lifetime
- 1997-02-12 AT AT97914139T patent/ATE193136T1/de active
- 1997-02-12 CA CA002245775A patent/CA2245775C/en not_active Expired - Lifetime
- 1997-02-12 JP JP52888497A patent/JP3721520B2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
| US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0880754B1 (de) | 2000-05-17 |
| CN1210602A (zh) | 1999-03-10 |
| US6233818B1 (en) | 2001-05-22 |
| WO1997030418A3 (de) | 1997-10-02 |
| WO1997030418A2 (de) | 1997-08-21 |
| AU709049B2 (en) | 1999-08-19 |
| AU2846397A (en) | 1997-09-02 |
| JP3721520B2 (ja) | 2005-11-30 |
| CA2245775A1 (en) | 1997-08-21 |
| CA2245775C (en) | 2004-04-06 |
| ATE193136T1 (de) | 2000-06-15 |
| JP2000502477A (ja) | 2000-02-29 |
| CN1119768C (zh) | 2003-08-27 |
| EP0880754A2 (de) | 1998-12-02 |
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