ES2172821T3 - Modulo de tarjeta con microplaca de circuito integrado (chip). - Google Patents

Modulo de tarjeta con microplaca de circuito integrado (chip).

Info

Publication number
ES2172821T3
ES2172821T3 ES97949946T ES97949946T ES2172821T3 ES 2172821 T3 ES2172821 T3 ES 2172821T3 ES 97949946 T ES97949946 T ES 97949946T ES 97949946 T ES97949946 T ES 97949946T ES 2172821 T3 ES2172821 T3 ES 2172821T3
Authority
ES
Spain
Prior art keywords
chip
card module
chips
tail
framework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97949946T
Other languages
English (en)
Inventor
Detlef Houdeau
Stefan Emmert
Hans-Georg Mensch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of ES2172821T3 publication Critical patent/ES2172821T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

SE EXPONE UN MODULO DE TARJETA DE CHIP QUE COMPRENDE, APARTE DE LOS CONDUCTORES IMPRESOS (4) Y UN BASTIDOR DE TARJETA (2), UNO O MAS CHIPS SEMI - CONDUCTORES (3, 3''), Y POSIBLEMENTE UN MARCO PARA DAR RIGIDEZ (5). EL CHIP O CHIPS SEMICONDUCTORES Y/O EL MARCO DE REFUERZO SE FIJAN CON EL USO DE UNA COLA (6) A LA QUE SE AÑADEN PARTICULAS DE UN DIAMETRO ESTABLECIDO COMO SEPARADOR. LA COLA (6) ES PREFERENTEMENTE ELASTICA Y, EN LA REALIZACION PREFERIDA, EL MATERIAL PARTICULADO ES DEFORMABLE. LA VENTAJA DE LA PRESENTE INVENCION ES QUE EL CHIP O LOS CHIPS Y/O EL MARCO PARA DAR RIGIDEZ SE ENCOLAN CON UNA SEPARACION REGULAR DADA EN RELACION CON LA BASE. LA COLA ELASTICA Y LAS PARTICULAS DEFORMABLES SE ADAPTAN A LAS DEFORMACIONES DEL MODULO DE LA TARJETA DE CHIP, IMPIDIENDO ASI QUE SUFRAN DAÑOS LAS SUPERFICIES ENCOLADAS ENTRE SI.
ES97949946T 1997-01-15 1997-11-18 Modulo de tarjeta con microplaca de circuito integrado (chip). Expired - Lifetime ES2172821T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19701165A DE19701165C1 (de) 1997-01-15 1997-01-15 Chipkartenmodul

Publications (1)

Publication Number Publication Date
ES2172821T3 true ES2172821T3 (es) 2002-10-01

Family

ID=7817439

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97949946T Expired - Lifetime ES2172821T3 (es) 1997-01-15 1997-11-18 Modulo de tarjeta con microplaca de circuito integrado (chip).

Country Status (12)

Country Link
US (1) US6421248B1 (es)
EP (1) EP0953186B1 (es)
JP (1) JP3428657B2 (es)
KR (1) KR20000070126A (es)
CN (1) CN1137515C (es)
AT (1) ATE213079T1 (es)
BR (1) BR9714203A (es)
DE (2) DE19701165C1 (es)
ES (1) ES2172821T3 (es)
RU (1) RU2189635C2 (es)
UA (1) UA40679C2 (es)
WO (1) WO1998032098A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2797075B1 (fr) * 1999-07-26 2001-10-12 Gemplus Card Int Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard
DE10204959A1 (de) * 2002-02-06 2003-08-14 Endress & Hauser Gmbh & Co Kg Leiterplatte mit einem Bauteil
US6806309B2 (en) * 2002-02-28 2004-10-19 Henkel Corporation Adhesive compositions containing organic spacers and methods for use thereof
US20030160311A1 (en) * 2002-02-28 2003-08-28 Aminuddin Ismail Stacked die semiconductor device
JP2006507569A (ja) * 2002-09-17 2006-03-02 アクサルト ソシエテ アノニム ハイブリッドカード
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
US20060157866A1 (en) * 2005-01-20 2006-07-20 Le Thoai T Signal redistribution using bridge layer for multichip module
US20060202317A1 (en) * 2005-03-14 2006-09-14 Farid Barakat Method for MCP packaging for balanced performance
DE102006011734B4 (de) * 2006-03-14 2020-06-18 BSH Hausgeräte GmbH Haushaltgerät mit einem Laugenbehälter
KR102469266B1 (ko) 2020-12-23 2022-11-22 도림공업(주) 스티어링 컬럼 로어 쉬라우드 검사 장치
WO2025243529A1 (ja) * 2024-05-24 2025-11-27 株式会社レゾナック 半導体パッケージを製造する方法、半導体パッケージ用熱硬化性接着剤、半導体パッケージ、及び半導体モジュール

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US5124192A (en) * 1989-11-15 1992-06-23 General Electric Company Plastic mold structure and method of making
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
JPH04166396A (ja) 1990-10-30 1992-06-12 Hitachi Maxell Ltd Ｉｃカードモジユール
RU2011225C1 (ru) * 1990-12-25 1994-04-15 Губин Юрий Васильевич Абонентская карточка
JPH04269598A (ja) 1991-02-25 1992-09-25 Matsushita Electric Ind Co Ltd Ｉｃメモリカード
EP0511162A1 (de) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
KR0128251Y1 (ko) * 1992-08-21 1998-10-15 문정환 리드 노출형 반도체 조립장치
JPH06132462A (ja) 1992-10-15 1994-05-13 Mitsui High Tec Inc リードフレームおよびその製造方法
JPH06191184A (ja) 1992-12-25 1994-07-12 Toshiba Corp Ｉｃカード
FR2701139B1 (fr) * 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
DE69512137T2 (de) * 1994-06-15 2000-05-25 De La Rue Cartes Et Systemes, Paris Herstellungsverfahren und Montage für IC-Karte.
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
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DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile
KR100273499B1 (ko) * 1995-05-22 2001-01-15 우찌가사끼 이사오 배선기판에전기접속된반도체칩을갖는반도체장치
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Also Published As

Publication number Publication date
EP0953186A1 (de) 1999-11-03
BR9714203A (pt) 2000-03-28
RU2189635C2 (ru) 2002-09-20
DE59706344D1 (de) 2002-03-21
WO1998032098A1 (de) 1998-07-23
UA40679C2 (uk) 2001-08-15
CN1244935A (zh) 2000-02-16
KR20000070126A (ko) 2000-11-25
DE19701165C1 (de) 1998-04-09
JP3428657B2 (ja) 2003-07-22
CN1137515C (zh) 2004-02-04
US6421248B1 (en) 2002-07-16
JP2000509864A (ja) 2000-08-02
ATE213079T1 (de) 2002-02-15
EP0953186B1 (de) 2002-02-06

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