UA40679C2 - Модуль чіп-картки (варіанти) - Google Patents

Модуль чіп-картки (варіанти)

Info

Publication number
UA40679C2
UA40679C2 UA99074039A UA99074039A UA40679C2 UA 40679 C2 UA40679 C2 UA 40679C2 UA 99074039 A UA99074039 A UA 99074039A UA 99074039 A UA99074039 A UA 99074039A UA 40679 C2 UA40679 C2 UA 40679C2
Authority
UA
Ukraine
Prior art keywords
chip card
card module
semiconductor chips
versions
adhesive layer
Prior art date
Application number
UA99074039A
Other languages
English (en)
Russian (ru)
Inventor
Детлеф Удо
Штефан Еммерт
Штефан ЭММЕРТ
Ханс-Георг МЕНШ
Original Assignee
Сіменс Акцієнгезельшафт
Сименс Акциенгезельшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Сіменс Акцієнгезельшафт, Сименс Акциенгезельшафт filed Critical Сіменс Акцієнгезельшафт
Publication of UA40679C2 publication Critical patent/UA40679C2/uk

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Винахід стосується модуля чіп-картки, в якому один або кілька напівпровідникових чіпів та/або рамка жорсткості закріплені за допомогою спеціального клею. Задачею винаходу є розробка модуля чіп-картки, в якому один або кілька напівпровідникових чіпів та/або рамок жорсткості наклеєні на підкладинці з дотриманням наперед заданої і, в основному, рівномірної по всій площі склеювання відстані при якомога меншій товщині клейового шару. До того ж, клейовий шар мусить у певних межах компенсувати деформації модуля чіп-картки, завдяки чому зменшується вірогідність пошкодження напівпровідникових чіпів і рамок жорсткості.
UA99074039A 1997-01-15 1997-11-18 Модуль чіп-картки (варіанти) UA40679C2 (uk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19701165A DE19701165C1 (de) 1997-01-15 1997-01-15 Chipkartenmodul
PCT/DE1997/002701 WO1998032098A1 (de) 1997-01-15 1997-11-18 Chipkartenmodul

Publications (1)

Publication Number Publication Date
UA40679C2 true UA40679C2 (uk) 2001-08-15

Family

ID=7817439

Family Applications (1)

Application Number Title Priority Date Filing Date
UA99074039A UA40679C2 (uk) 1997-01-15 1997-11-18 Модуль чіп-картки (варіанти)

Country Status (12)

Country Link
US (1) US6421248B1 (uk)
EP (1) EP0953186B1 (uk)
JP (1) JP3428657B2 (uk)
KR (1) KR20000070126A (uk)
CN (1) CN1137515C (uk)
AT (1) ATE213079T1 (uk)
BR (1) BR9714203A (uk)
DE (2) DE19701165C1 (uk)
ES (1) ES2172821T3 (uk)
RU (1) RU2189635C2 (uk)
UA (1) UA40679C2 (uk)
WO (1) WO1998032098A1 (uk)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2797075B1 (fr) * 1999-07-26 2001-10-12 Gemplus Card Int Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard
DE10204959A1 (de) * 2002-02-06 2003-08-14 Endress & Hauser Gmbh & Co Kg Leiterplatte mit einem Bauteil
US20030160311A1 (en) * 2002-02-28 2003-08-28 Aminuddin Ismail Stacked die semiconductor device
US6806309B2 (en) * 2002-02-28 2004-10-19 Henkel Corporation Adhesive compositions containing organic spacers and methods for use thereof
US7387259B2 (en) * 2002-09-17 2008-06-17 Axalto S.A. Hybrid card
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
US20060157866A1 (en) * 2005-01-20 2006-07-20 Le Thoai T Signal redistribution using bridge layer for multichip module
US20060202317A1 (en) * 2005-03-14 2006-09-14 Farid Barakat Method for MCP packaging for balanced performance
DE102006011734B4 (de) * 2006-03-14 2020-06-18 BSH Hausgeräte GmbH Haushaltgerät mit einem Laugenbehälter
KR102469266B1 (ko) 2020-12-23 2022-11-22 도림공업(주) 스티어링 컬럼 로어 쉬라우드 검사 장치
WO2025243529A1 (ja) * 2024-05-24 2025-11-27 株式会社レゾナック 半導体パッケージを製造する方法、半導体パッケージ用熱硬化性接着剤、半導体パッケージ、及び半導体モジュール

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US5124192A (en) * 1989-11-15 1992-06-23 General Electric Company Plastic mold structure and method of making
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
JPH04166396A (ja) 1990-10-30 1992-06-12 Hitachi Maxell Ltd Ｉｃカードモジユール
RU2011225C1 (ru) * 1990-12-25 1994-04-15 Губин Юрий Васильевич Абонентская карточка
JPH04269598A (ja) 1991-02-25 1992-09-25 Matsushita Electric Ind Co Ltd Ｉｃメモリカード
EP0511162A1 (de) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
KR0128251Y1 (ko) * 1992-08-21 1998-10-15 문정환 리드 노출형 반도체 조립장치
JPH06132462A (ja) 1992-10-15 1994-05-13 Mitsui High Tec Inc リードフレームおよびその製造方法
JPH06191184A (ja) 1992-12-25 1994-07-12 Toshiba Corp Ｉｃカード
FR2701139B1 (fr) * 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
DE69512137T2 (de) * 1994-06-15 2000-05-25 De La Rue Cartes Et Systemes, Paris Herstellungsverfahren und Montage für IC-Karte.
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
US5610442A (en) * 1995-03-27 1997-03-11 Lsi Logic Corporation Semiconductor device package fabrication method and apparatus
DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile
EP0827632B1 (en) * 1995-05-22 2002-01-09 Hitachi Chemical Co., Ltd. Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
RU96109412A (ru) * 1996-05-06 1997-01-10 Акционерное общество открытого типа "Никос Рисеч Корпорейшн" Бесконтактная электронная банковская карточка
US5912316A (en) * 1996-11-08 1999-06-15 Johnson Matthey, Inc. Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant

Also Published As

Publication number Publication date
ES2172821T3 (es) 2002-10-01
KR20000070126A (ko) 2000-11-25
DE59706344D1 (de) 2002-03-21
RU2189635C2 (ru) 2002-09-20
CN1137515C (zh) 2004-02-04
DE19701165C1 (de) 1998-04-09
US6421248B1 (en) 2002-07-16
EP0953186A1 (de) 1999-11-03
WO1998032098A1 (de) 1998-07-23
ATE213079T1 (de) 2002-02-15
CN1244935A (zh) 2000-02-16
EP0953186B1 (de) 2002-02-06
BR9714203A (pt) 2000-03-28
JP3428657B2 (ja) 2003-07-22
JP2000509864A (ja) 2000-08-02

Similar Documents

Publication Publication Date Title
UA40679C2 (uk) Модуль чіп-картки (варіанти)
KR100798685B1 (ko) 액정 표시부를 갖는 스마트디스플레이카드의 제조방법
DE50007516D1 (de) Kartenförmiger datenträger mit anzeigeeinrichtung
TW200608499A (en) Sensor package
EP0919950A4 (en) MODULE FOR IC CARD, IC CARD AND METHOD FOR THE PRODUCTION THEREOF
ATE335254T1 (de) Dünne elektronische chipkarte
WO2004059728A3 (en) Method of fabricating an integrated circuit and semiconductor chip
JP2009187564A (ja) 表面が拡張したモジュールを有するスマートカード
FR2720190B1 (fr) Procédé de raccordement des plages de sortie d'une puce à circuit intégré, et module multipuces ainsi obtenu.
EP0729644A4 (en) MULTIPLE CLIP ELECTRONIC HOUSING MODULE WITH ADHESIVE SHEET
EP1094512A4 (en) PLASTIC PACKAGING METHOD FOR SEMICONDUCTOR CHIP AND TAPE FOR GLUEING OF LATCH FRAMES OR SIMILAR
ATE186002T1 (de) Schleifband
DE59915153D1 (de) Verbundmaterialeinheiten mit transponder
DE59706247D1 (de) Verfahren zur herstellung eines trägerelements für halbleiterchips
CN213423653U (zh) 一种显示屏模组及显示装置
US20040099745A1 (en) Method of producing a module
DE50300526D1 (de) Klebeverbindung
DE59911518D1 (de) Integrierter Halbleiterchip mit über Bondpads voreingestellter Dateneingabe-/Datenausgabe-Organisationsform
KR100968140B1 (ko) 디스플레이카드의 제조방법
EP0325545A3 (en) Laminate for the formation of beam leads for ic chip bonding featuring improved positive-working resist
RU2004135206A (ru) Модуль для бесконтактных чип-карт или систем индентификации
WO2002003460A3 (de) Halbleiterchip-modul mit schutzfolie
WO2002047161A3 (fr) Barriere anti debordement de colle fixation d'une puce semi-conductrice
KR20080076322A (ko) 충격 흡수 패드 및 그 제조 방법
KR960043142A (ko) 반도체 리드프레임