ES2182119T3 - Modulo de chip, especialmente para el implante en un cuerpo de tarjeta de chip. - Google Patents

Modulo de chip, especialmente para el implante en un cuerpo de tarjeta de chip.

Info

Publication number
ES2182119T3
ES2182119T3 ES97942775T ES97942775T ES2182119T3 ES 2182119 T3 ES2182119 T3 ES 2182119T3 ES 97942775 T ES97942775 T ES 97942775T ES 97942775 T ES97942775 T ES 97942775T ES 2182119 T3 ES2182119 T3 ES 2182119T3
Authority
ES
Spain
Prior art keywords
chip
implant
card body
module
chip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97942775T
Other languages
English (en)
Inventor
Detlef Houdeau
Peter Stampka
Michael Huber
Josef Heitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of ES2182119T3 publication Critical patent/ES2182119T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

SE EXPONE UN MODULO DE CHIP, ESPECIALMENTE PARA INSTALACION EN EL CUERPO DE UNA TARJETA DE CHIP (25), QUE COMPRENDE UN SOPORTE (10) Y UN CHIP (13) COLOCADO SOBRE EL MISMO. EL MODULO DE CHIP EXPUESTO SE CARACTERIZA POR UNA ELEVACION TIPO BASE (23), QUE ABARCA EL CHIP DE FORMA TOTAL O PARCIAL.
ES97942775T 1996-09-30 1997-09-02 Modulo de chip, especialmente para el implante en un cuerpo de tarjeta de chip. Expired - Lifetime ES2182119T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19640304A DE19640304C2 (de) 1996-09-30 1996-09-30 Chipmodul insbesondere zur Implantation in einen Chipkartenkörper

Publications (1)

Publication Number Publication Date
ES2182119T3 true ES2182119T3 (es) 2003-03-01

Family

ID=7807447

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97942775T Expired - Lifetime ES2182119T3 (es) 1996-09-30 1997-09-02 Modulo de chip, especialmente para el implante en un cuerpo de tarjeta de chip.

Country Status (12)

Country Link
US (1) US6288904B1 (es)
EP (1) EP0931343B1 (es)
JP (1) JP3230683B2 (es)
KR (1) KR100395843B1 (es)
CN (1) CN1143383C (es)
AT (1) ATE222026T1 (es)
BR (1) BR9712155A (es)
DE (2) DE19640304C2 (es)
ES (1) ES2182119T3 (es)
RU (1) RU2193231C2 (es)
UA (1) UA57036C2 (es)
WO (1) WO1998015004A1 (es)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
JP3180086B2 (ja) * 1998-08-31 2001-06-25 株式会社シーメディア 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触ｉｃメディア
FR2793069B1 (fr) * 1999-04-28 2003-02-14 Gemplus Card Int Procede de fabrication de dispositif electronique portable a circuit integre protege par resine photosensible
JP3461308B2 (ja) * 1999-07-30 2003-10-27 Ｎｅｃマイクロシステム株式会社 データ処理装置、その動作制御方法
US7638195B2 (en) * 1999-08-04 2009-12-29 Hybrid Plastics, Inc. Surface modification with polyhedral oligomeric silsesquioxanes silanols
US7888435B2 (en) * 1999-08-04 2011-02-15 Hybrid Plastics, Inc. Process for continuous production of olefin polyhedral oligomeric silsesquioxane cages
US6972312B1 (en) * 1999-08-04 2005-12-06 Hybrid Plastics Llc Process for the formation of polyhedral oligomeric silsesquioxanes
US7553904B2 (en) * 1999-08-04 2009-06-30 Hybrid Plastics, Inc. High use temperature nanocomposite resins
US20060194919A1 (en) * 1999-08-04 2006-08-31 Lichtenhan Joseph D Porosity control with polyhedral oligomeric silsesquioxanes
US7485692B2 (en) 1999-08-04 2009-02-03 Hybrid Plastics, Inc. Process for assembly of POSS monomers
TW445608B (en) * 2000-05-19 2001-07-11 Siliconware Precision Industries Co Ltd Semiconductor package and manufacturing method thereof of lead frame without flashing
JP3399453B2 (ja) * 2000-10-26 2003-04-21 松下電器産業株式会社 半導体装置およびその製造方法
DE10134989B4 (de) * 2001-07-18 2006-03-23 Infineon Technologies Ag Chipkarte mit einem Kartenkörper
DE10145752B4 (de) * 2001-09-17 2004-09-02 Infineon Technologies Ag Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist
US20030085288A1 (en) * 2001-11-06 2003-05-08 Luu Deniel V.H. Contactless SIM card carrier with detachable antenna and carrier therefore
DE10208168C1 (de) * 2002-02-26 2003-08-14 Infineon Technologies Ag Datenträgerkarte
US6915636B2 (en) * 2002-07-15 2005-07-12 Power Systems Mfg., Llc Dual fuel fin mixer secondary fuel nozzle
DE10237084A1 (de) * 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
FR2853434B1 (fr) * 2003-04-03 2005-07-01 Oberthur Card Syst Sa Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication
US7259678B2 (en) * 2003-12-08 2007-08-21 3M Innovative Properties Company Durable radio frequency identification label and methods of manufacturing the same
US20090085011A1 (en) * 2003-12-18 2009-04-02 Lichtenhan Joseph D Neutron shielding composition
US20050261839A1 (en) * 2004-05-18 2005-11-24 Shinde Ninad A Smart substance processing device and a system and method of monitoring thereof
CN101228539A (zh) * 2004-06-30 2008-07-23 Nxp股份有限公司 插入夹持器的芯片卡
US20060170079A1 (en) * 2005-02-02 2006-08-03 Brennan John M Integrated circuit device having encapsulant dam with chamfered edge
US7956459B2 (en) * 2005-02-28 2011-06-07 Infineon Technologies Ag Semiconductor device and method of assembly
DE102005044216A1 (de) * 2005-09-15 2007-03-29 Smartrac Technology Ltd. Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
JP2007098409A (ja) * 2005-09-30 2007-04-19 Toshiba Corp 板材分断方法、金型、プリント基板、および電子機器
ATE440346T1 (de) * 2005-11-14 2009-09-15 Tyco Electronics France Sas Smartcard-kírper, smartcard und herstellungsverfahren
US7682869B2 (en) * 2006-03-23 2010-03-23 Micron Technology, Inc. Method of packaging integrated circuit devices using preformed carrier
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
SG147330A1 (en) 2007-04-19 2008-11-28 Micron Technology Inc Semiconductor workpiece carriers and methods for processing semiconductor workpieces
DE102007019795B4 (de) * 2007-04-26 2012-10-04 Infineon Technologies Ag Chipmodul und Verfahren zum Herstellen dieses Chipmoduls
US8030746B2 (en) * 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package
DE102008016274A1 (de) * 2008-03-28 2009-10-01 Smartrac Ip B.V. Chipträger für ein Transpondermodul sowie Transpondermodul
US8110912B2 (en) * 2008-07-31 2012-02-07 Infineon Technologies Ag Semiconductor device
CN104392968B (zh) * 2008-11-21 2018-05-18 先进封装技术私人有限公司 半导体基板
DE102009023405A1 (de) 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
JP2011176112A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 半導体集積回路及びその製造方法
KR101687860B1 (ko) * 2010-05-12 2016-12-19 랑셍 홀딩 가요성 인쇄 회로의 제조 방법
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
FR3006551B1 (fr) * 2013-05-30 2016-12-09 Linxens Holding Procede de fabrication d'un circuit imprime, circuit imprime obtenu par ce procede et module electronique comportant un tel circuit imprime
JP6115505B2 (ja) * 2013-06-21 2017-04-19 株式会社デンソー 電子装置
US9196554B2 (en) 2013-10-01 2015-11-24 Infineon Technologies Austria Ag Electronic component, arrangement and method
CN106709557A (zh) * 2016-12-29 2017-05-24 郑州单点科技软件有限公司 一种芯片卡原型板
JP2020515074A (ja) 2017-03-24 2020-05-21 カードラブ・アンパルトセルスカブＣａｒｄＬａｂ ＡｐＳ キャリアのアセンブリとそれに固定された複数の電気回路、およびその製造方法
CN110615136B (zh) * 2019-10-23 2024-08-16 苏州领裕电子科技有限公司 一种无线充电配件贴膜设备
CN110729274A (zh) * 2019-11-11 2020-01-24 澄天伟业(宁波)芯片技术有限公司 智能卡模块及其封装工艺

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US258650A (en) * 1882-05-30 Wind-engine
JPS58132954A (ja) * 1982-02-02 1983-08-08 Matsushita Electric Ind Co Ltd 混成集積回路の封止方法
JPS5916351A (ja) * 1982-07-19 1984-01-27 Matsushita Electric Ind Co Ltd 電子回路装置とその製造方法
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
JPS62154971A (ja) 1985-12-27 1987-07-09 Canon Inc カラ−画像処理方式
DE68927295T2 (de) * 1988-07-08 1997-05-07 Oki Electric Ind Co Ltd Kunstharzversiegeltes halbleiterbauelement
JP2519332B2 (ja) 1988-07-08 1996-07-31 沖電気工業株式会社 半導体装置
JPH0262297A (ja) 1988-08-29 1990-03-02 Matsushita Electric Ind Co Ltd 集積回路装置およびそれを用いたｉｃカード
US5184207A (en) * 1988-12-07 1993-02-02 Tribotech Semiconductor die packages having lead support frame
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
EP0472766A1 (de) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Verfahren zum Abdecken eines kontaktierten Halbleiterchips
FR2670930A1 (fr) * 1990-12-21 1992-06-26 Bull Cp8 Procede de realisation du module electronique d'un objet portatif tel qu'une carte a microcircuits, module et cartes obtenus par la mise en óoeuvre du procede.
RU2024110C1 (ru) * 1991-04-10 1994-11-30 Научно-исследовательский институт точной технологии Интегральная микросхема
US5258650A (en) * 1991-08-26 1993-11-02 Motorola, Inc. Semiconductor device having encapsulation comprising of a thixotropic fluorosiloxane material
US5311402A (en) * 1992-02-14 1994-05-10 Nec Corporation Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
CH686462A5 (de) * 1992-11-27 1996-03-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
JP3378338B2 (ja) * 1994-03-01 2003-02-17 新光電気工業株式会社 半導体集積回路装置
EP1213754A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
JP2820645B2 (ja) * 1994-08-30 1998-11-05 アナム インダストリアル カンパニー インコーポレーティド 半導体リードフレーム
JP3388921B2 (ja) 1994-11-29 2003-03-24 株式会社東芝 集積回路カードの製造方法
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
JP3176542B2 (ja) * 1995-10-25 2001-06-18 シャープ株式会社 半導体装置及びその製造方法
US5767447A (en) * 1995-12-05 1998-06-16 Lucent Technologies Inc. Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
US5672911A (en) * 1996-05-30 1997-09-30 Lsi Logic Corporation Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package
DE19632813C2 (de) 1996-08-14 2000-11-02 Siemens Ag Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte
US6088901A (en) 1997-06-10 2000-07-18 Siemens Aktiengesellschaft Method for producing a carrier element for semiconductor chips

Also Published As

Publication number Publication date
US6288904B1 (en) 2001-09-11
EP0931343A1 (de) 1999-07-28
CN1143383C (zh) 2004-03-24
WO1998015004A1 (de) 1998-04-09
KR100395843B1 (ko) 2003-08-27
EP0931343B1 (de) 2002-08-07
DE19640304A1 (de) 1998-04-02
RU2193231C2 (ru) 2002-11-20
JP2000503155A (ja) 2000-03-14
UA57036C2 (uk) 2003-06-16
JP3230683B2 (ja) 2001-11-19
KR20000048732A (ko) 2000-07-25
CN1231765A (zh) 1999-10-13
DE59707929D1 (de) 2002-09-12
DE19640304C2 (de) 2000-10-12
BR9712155A (pt) 1999-08-31
ATE222026T1 (de) 2002-08-15

Similar Documents

Publication Publication Date Title
ES2182119T3 (es) Modulo de chip, especialmente para el implante en un cuerpo de tarjeta de chip.
TW581325U (en) Semiconductor light emitting device
GB9811180D0 (en) Semiconductor light-emitting device
IS5692A (is) Tæki til að setja inn í nef á manni
PT1044032E (pt) Dispositivo de implantacao para implantes sebcutaneos
MA24408A1 (fr) Tensioactifs polyoxyalkylenes.
NL1015176A1 (nl) Lamp en lampvoetsamenstel.
NL1010321A1 (nl) Wafeldrager.
DE69832748D1 (de) Potentialtopf-Halbleiterbauelement
TW497759U (en) Semiconductor light emitting device
NL1015174A1 (nl) Lamp en lampvoetsamenstel.
NL1015175A1 (nl) Lamp en lampvoetsamenstel.
KR970701681A (ko) 피로 수명이 긴 질화규소 베어링 볼 (Silicon nitride bearing ball having high fatigue life)
BG106316A (en) Ambroxol-containing lozenge
EP0615963A3 (en) Sintered body of silicon nitride.
DE59809052D1 (de) Rückschlagventil
MX9909797A (es) Composiciones para el cuidado personal que comprenden un copolimero adhesivo.
NL1010520A1 (nl) Belichtingsinrichting.
IT1303229B1 (it) Dispositivo per lavorazione a truciolo e relativo sopporto perutensile.
SE9801340D0 (sv) Adapteranordning inrättad att anordnas på en lampa
IT1303097B1 (it) Dispositivo di supporto per utensili e relativo supporto multiplo.
BR0102206A (pt) Dispositivo para fixar um elemento de vedação em uma posição predeterminada
FR2705436B1 (fr) Dispositif de protection de luminaires contre le vandalisme.
IT1290107B1 (it) Urinometro con valvola di non-ritorno
ES1038540Y (es) Dispositivo para la evaluacion-pesado de cartas o envios postales.