ES2193968T3 - Chip de memoria de semiconductores. - Google Patents

Chip de memoria de semiconductores.

Info

Publication number
ES2193968T3
ES2193968T3 ES00942097T ES00942097T ES2193968T3 ES 2193968 T3 ES2193968 T3 ES 2193968T3 ES 00942097 T ES00942097 T ES 00942097T ES 00942097 T ES00942097 T ES 00942097T ES 2193968 T3 ES2193968 T3 ES 2193968T3
Authority
ES
Spain
Prior art keywords
memory chip
semiconductor memory
chips
memory
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00942097T
Other languages
English (en)
Inventor
Thomas Grassl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke+Devrient GmbH
Original Assignee
Giesecke+Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke+Devrient GmbH filed Critical Giesecke+Devrient GmbH
Application granted granted Critical
Publication of ES2193968T3 publication Critical patent/ES2193968T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)
  • Read Only Memory (AREA)
  • Dram (AREA)

Abstract

Módulo de chips de memoria de semiconductores, que tiene un primer chip de memoria (4) de un primer tipo, un segundo chip de memoria (6) de un segundo tipo, y una conexión eléctrica (14, 16) entre el primer y segundo chips de memoria (4, 6), caracterizado porque los chips de memoria (4, 6) están dispuestos uno encima de otro en diferentes niveles y están conectados mediante interconexiones de chips verticales (14, 16).
ES00942097T 1999-06-23 2000-06-19 Chip de memoria de semiconductores. Expired - Lifetime ES2193968T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19928733A DE19928733A1 (de) 1999-06-23 1999-06-23 Halbleiterspeicher-Chipmodul

Publications (1)

Publication Number Publication Date
ES2193968T3 true ES2193968T3 (es) 2003-11-16

Family

ID=7912247

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00942097T Expired - Lifetime ES2193968T3 (es) 1999-06-23 2000-06-19 Chip de memoria de semiconductores.

Country Status (12)

Country Link
US (1) US6721196B1 (es)
EP (1) EP1198797B1 (es)
JP (1) JP2003503834A (es)
KR (1) KR100708597B1 (es)
CN (1) CN1203486C (es)
AT (1) ATE239296T1 (es)
AU (1) AU5683500A (es)
BR (1) BR0011868A (es)
CA (1) CA2377175C (es)
DE (2) DE19928733A1 (es)
ES (1) ES2193968T3 (es)
WO (1) WO2001001418A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139414A1 (de) * 2001-08-17 2003-02-27 Giesecke & Devrient Gmbh Halbleiterschaltungsanordnung mit biometrischem Sensor und Auswerteeinheit
KR100528464B1 (ko) * 2003-02-06 2005-11-15 삼성전자주식회사 스마트카드의 보안장치
DE10317147A1 (de) * 2003-04-14 2004-10-28 Nec Electronics (Europe) Gmbh Sicheres Speichersystem mit Flash-Speichern und Cache-Speicher
KR100689589B1 (ko) * 2004-12-30 2007-03-02 매그나칩 반도체 유한회사 반도체 소자 및 그 제조 방법
US7581678B2 (en) 2005-02-22 2009-09-01 Tyfone, Inc. Electronic transaction card
US7557597B2 (en) * 2005-06-03 2009-07-07 International Business Machines Corporation Stacked chip security
US7991158B2 (en) * 2006-12-13 2011-08-02 Tyfone, Inc. Secure messaging
US20080244208A1 (en) * 2007-03-30 2008-10-02 Narendra Siva G Memory card hidden command protocol
US9741027B2 (en) * 2007-12-14 2017-08-22 Tyfone, Inc. Memory card based contactless devices
US12147863B2 (en) 2008-08-08 2024-11-19 Icashe, Inc. Method and apparatus for transmitting data via NFC for mobile applications including mobile payments and ticketing
US8451122B2 (en) 2008-08-08 2013-05-28 Tyfone, Inc. Smartcard performance enhancement circuits and systems
US20100033310A1 (en) * 2008-08-08 2010-02-11 Narendra Siva G Power negotation for small rfid card
US7961101B2 (en) 2008-08-08 2011-06-14 Tyfone, Inc. Small RFID card with integrated inductive element
US8231061B2 (en) * 2009-02-24 2012-07-31 Tyfone, Inc Contactless device with miniaturized antenna
CN103633092B (zh) * 2012-08-22 2016-02-03 成都海存艾匹科技有限公司 存储、模拟和数字功能分离的三维存储器
TWI579856B (zh) 2014-09-12 2017-04-21 東芝股份有限公司 Semiconductor device
WO2019152877A1 (en) * 2018-02-04 2019-08-08 Hsu Fu Chang Methods and apparatus for memory cells that combine static ram and non-volatile memory

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908502A (en) * 1988-02-08 1990-03-13 Pitney Bowes Inc. Fault tolerant smart card
JPH025455A (ja) 1988-06-24 1990-01-10 Hitachi Ltd チップオンチップの半導体装置
JP2760062B2 (ja) * 1989-06-23 1998-05-28 自動車機器株式会社 液圧倍力装置
JP2591324B2 (ja) * 1990-10-29 1997-03-19 日本電気株式会社 半導体記憶集積回路
US5229647A (en) * 1991-03-27 1993-07-20 Micron Technology, Inc. High density data storage using stacked wafers
JP2622038B2 (ja) * 1991-06-03 1997-06-18 シャープ株式会社 半導体装置及びその製造方法
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
DE4219031C2 (de) * 1992-06-10 1994-11-10 Siemens Ag Multi-Chip-Modul mit Kondensator, der auf dem Träger aus Silizium (monokristalines Substrat) realisiert ist
JP2605968B2 (ja) 1993-04-06 1997-04-30 日本電気株式会社 半導体集積回路およびその形成方法
US5667884A (en) 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile
JPH09510813A (ja) 1995-07-05 1997-10-28 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン チップ・カードにおいて長いメッセージを処理する方法及び装置
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
JP4011695B2 (ja) * 1996-12-02 2007-11-21 株式会社東芝 マルチチップ半導体装置用チップおよびその形成方法
US6037661A (en) * 1996-12-20 2000-03-14 International Business Machines Multichip module
US5915167A (en) * 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
KR100328062B1 (ko) * 1997-12-13 2002-06-29 이구택 일산화탄소농도에따른극저탄소강의정련방법

Also Published As

Publication number Publication date
EP1198797A1 (de) 2002-04-24
CN1203486C (zh) 2005-05-25
AU5683500A (en) 2001-01-31
JP2003503834A (ja) 2003-01-28
KR100708597B1 (ko) 2007-08-10
DE19928733A1 (de) 2001-01-04
CA2377175C (en) 2007-01-09
CA2377175A1 (en) 2001-01-04
US6721196B1 (en) 2004-04-13
WO2001001418A1 (de) 2001-01-04
BR0011868A (pt) 2002-04-09
CN1358315A (zh) 2002-07-10
EP1198797B1 (de) 2003-05-02
KR20020021137A (ko) 2002-03-18
ATE239296T1 (de) 2003-05-15
DE50001991D1 (de) 2003-06-05

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