ES2287814T3 - Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada. - Google Patents
Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada. Download PDFInfo
- Publication number
- ES2287814T3 ES2287814T3 ES05000861T ES05000861T ES2287814T3 ES 2287814 T3 ES2287814 T3 ES 2287814T3 ES 05000861 T ES05000861 T ES 05000861T ES 05000861 T ES05000861 T ES 05000861T ES 2287814 T3 ES2287814 T3 ES 2287814T3
- Authority
- ES
- Spain
- Prior art keywords
- plate
- assembly
- isothermal
- heat pipe
- procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000005452 bending Methods 0.000 claims abstract description 10
- 230000004308 accommodation Effects 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000012943 hotmelt Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000010992 reflux Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000007373 indentation Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 230000003806 hair structure Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Landscapes
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Adornments (AREA)
- Optical Elements Other Than Lenses (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Tunnel Furnaces (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05000861A EP1681527B1 (de) | 2005-01-17 | 2005-01-17 | Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2287814T3 true ES2287814T3 (es) | 2007-12-16 |
Family
ID=34933339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES05000861T Expired - Lifetime ES2287814T3 (es) | 2005-01-17 | 2005-01-17 | Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1681527B1 (de) |
| AT (1) | ATE362604T1 (de) |
| DE (1) | DE602005001153T2 (de) |
| DK (1) | DK1681527T3 (de) |
| ES (1) | ES2287814T3 (de) |
| PL (1) | PL1681527T3 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2657338B2 (es) * | 2016-09-02 | 2019-01-29 | Eidopia S L | Sistema opto-térmico basado en pletinas térmicas bidimensionales |
| WO2021249970A1 (en) * | 2020-06-11 | 2021-12-16 | Signify Holding B.V. | Vapor chamber assembly |
| CN114346021A (zh) * | 2021-12-16 | 2022-04-15 | 南京航空航天大学 | 一种难变形材料管材的差温自由弯曲成形装置和方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2947000C2 (de) * | 1978-11-22 | 1985-04-18 | Pioneer Electronic Corp., Tokio/Tokyo | Gehäuse für elektronische Vorrichtungen |
| US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
| DE3543673A1 (de) * | 1985-12-11 | 1987-06-19 | Sueddeutsche Kuehler Behr | Einrichtung zum heizen |
| US4880052A (en) * | 1989-02-27 | 1989-11-14 | Thermacore, Inc. | Heat pipe cooling plate |
| JPH04366394A (ja) * | 1991-06-11 | 1992-12-18 | Akutoronikusu Kk | ハイブリッド型ヒートパイプ平板構造体 |
| US6133631A (en) * | 1997-05-30 | 2000-10-17 | Hewlett-Packard Company | Semiconductor package lid with internal heat pipe |
| JP2981505B2 (ja) * | 1998-04-10 | 1999-11-22 | ダイヤモンド電機株式会社 | ヒートパイプの加工方法 |
| JP2001165584A (ja) * | 1999-12-02 | 2001-06-22 | Tokai Rubber Ind Ltd | シート状ヒートパイプ |
| JP2001241869A (ja) * | 2000-02-24 | 2001-09-07 | Toshiba Corp | ヒートパイプ構造 |
| US6679318B2 (en) * | 2002-01-19 | 2004-01-20 | Allan P Bakke | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability |
-
2005
- 2005-01-17 DK DK05000861T patent/DK1681527T3/da active
- 2005-01-17 AT AT05000861T patent/ATE362604T1/de not_active IP Right Cessation
- 2005-01-17 ES ES05000861T patent/ES2287814T3/es not_active Expired - Lifetime
- 2005-01-17 EP EP05000861A patent/EP1681527B1/de not_active Expired - Lifetime
- 2005-01-17 PL PL05000861T patent/PL1681527T3/pl unknown
- 2005-01-17 DE DE602005001153T patent/DE602005001153T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1681527A1 (de) | 2006-07-19 |
| PL1681527T3 (pl) | 2007-10-31 |
| DK1681527T3 (da) | 2007-09-10 |
| ATE362604T1 (de) | 2007-06-15 |
| EP1681527B1 (de) | 2007-05-16 |
| DE602005001153T2 (de) | 2008-01-24 |
| DE602005001153D1 (de) | 2007-06-28 |
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