ES2287814T3 - Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada. - Google Patents

Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada. Download PDF

Info

Publication number: ES2287814T3
Authority: ES; Spain
Prior art keywords: plate; assembly; isothermal; heat pipe; procedure
Prior art date: 2005-01-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

ES05000861T

Other languages

English (en)

Spanish (es)

Inventor

Kuo-Len Lin

Hui-Min Tsui

Ken Hsu

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CpuMate Inc

Original Assignee

CpuMate Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-01-17

Filing date

2005-01-17

Publication date

2007-12-16

2005-01-17 Application filed by CpuMate Inc filed Critical CpuMate Inc

2007-12-16 Application granted granted Critical

2007-12-16 Publication of ES2287814T3 publication Critical patent/ES2287814T3/es

2025-01-17 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 26
238000004519 manufacturing process Methods 0.000 title claims abstract description 17
238000005452 bending Methods 0.000 claims abstract description 10
230000004308 accommodation Effects 0.000 claims description 13
239000011230 binding agent Substances 0.000 claims description 12
239000012943 hotmelt Substances 0.000 claims description 3
238000001816 cooling Methods 0.000 claims description 2
239000003292 glue Substances 0.000 claims description 2
238000010992 reflux Methods 0.000 claims description 2
238000003466 welding Methods 0.000 claims description 2
238000007373 indentation Methods 0.000 description 5
230000017525 heat dissipation Effects 0.000 description 4
239000004020 conductor Substances 0.000 description 3
239000003795 chemical substances by application Substances 0.000 description 2
239000012467 final product Substances 0.000 description 2
239000012530 fluid Substances 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
238000006467 substitution reaction Methods 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
238000004026 adhesive bonding Methods 0.000 description 1
230000000712 assembly Effects 0.000 description 1
238000000429 assembly Methods 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
238000005336 cracking Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000000605 extraction Methods 0.000 description 1
238000007499 fusion processing Methods 0.000 description 1
230000003806 hair structure Effects 0.000 description 1
239000000047 product Substances 0.000 description 1

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

Engineering & Computer Science (AREA)
Sustainable Development (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Life Sciences & Earth Sciences (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Adornments (AREA)
Optical Elements Other Than Lenses (AREA)
Manufacture Or Reproduction Of Printing Formes (AREA)
Tunnel Furnaces (AREA)
Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Laminated Bodies (AREA)
Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Diaphragms For Electromechanical Transducers (AREA)

ES05000861T 2005-01-17 2005-01-17 Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada. Expired - Lifetime ES2287814T3 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
EP05000861A EP1681527B1 (en)	2005-01-17	2005-01-17	Method for manufacturing an isothermal plate assembly with predetemined shape

Publications (1)

Publication Number	Publication Date
ES2287814T3 true ES2287814T3 (es)	2007-12-16

Family

ID=34933339

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES05000861T Expired - Lifetime ES2287814T3 (es)	2005-01-17	2005-01-17	Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada.

Country Status (6)

Country	Link
EP (1)	EP1681527B1 (pl)
AT (1)	ATE362604T1 (pl)
DE (1)	DE602005001153T2 (pl)
DK (1)	DK1681527T3 (pl)
ES (1)	ES2287814T3 (pl)
PL (1)	PL1681527T3 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ES2657338B2 (es) *	2016-09-02	2019-01-29	Eidopia S L	Sistema opto-térmico basado en pletinas térmicas bidimensionales
WO2021249970A1 (en) *	2020-06-11	2021-12-16	Signify Holding B.V.	Vapor chamber assembly
CN114346021A (zh) *	2021-12-16	2022-04-15	南京航空航天大学	一种难变形材料管材的差温自由弯曲成形装置和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2947000C2 (de) *	1978-11-22	1985-04-18	Pioneer Electronic Corp., Tokio/Tokyo	Gehäuse für elektronische Vorrichtungen
US4461343A (en) *	1982-01-28	1984-07-24	Mcdonnell Douglas Corporation	Plated heat pipe
DE3543673A1 (de) *	1985-12-11	1987-06-19	Sueddeutsche Kuehler Behr	Einrichtung zum heizen
US4880052A (en) *	1989-02-27	1989-11-14	Thermacore, Inc.	Heat pipe cooling plate
JPH04366394A (ja) *	1991-06-11	1992-12-18	Akutoronikusu Kk	ハイブリッド型ヒートパイプ平板構造体
US6133631A (en) *	1997-05-30	2000-10-17	Hewlett-Packard Company	Semiconductor package lid with internal heat pipe
JP2981505B2 (ja) *	1998-04-10	1999-11-22	ダイヤモンド電機株式会社	ヒートパイプの加工方法
JP2001165584A (ja) *	1999-12-02	2001-06-22	Tokai Rubber Ind Ltd	シート状ヒートパイプ
JP2001241869A (ja) *	2000-02-24	2001-09-07	Toshiba Corp	ヒートパイプ構造
US6679318B2 (en) *	2002-01-19	2004-01-20	Allan P Bakke	Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability

2005
- 2005-01-17 DK DK05000861T patent/DK1681527T3/da active
- 2005-01-17 AT AT05000861T patent/ATE362604T1/de not_active IP Right Cessation
- 2005-01-17 ES ES05000861T patent/ES2287814T3/es not_active Expired - Lifetime
- 2005-01-17 EP EP05000861A patent/EP1681527B1/en not_active Expired - Lifetime
- 2005-01-17 PL PL05000861T patent/PL1681527T3/pl unknown
- 2005-01-17 DE DE602005001153T patent/DE602005001153T2/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP1681527A1 (en)	2006-07-19
PL1681527T3 (pl)	2007-10-31
DK1681527T3 (da)	2007-09-10
ATE362604T1 (de)	2007-06-15
EP1681527B1 (en)	2007-05-16
DE602005001153T2 (de)	2008-01-24
DE602005001153D1 (de)	2007-06-28

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US3680189A (en)	1972-08-01	Method of forming a heat pipe
JP4602714B2 (ja)	2010-12-22	熱交換器
US9103605B2 (en)	2015-08-11	Heat exchange device
WO2015098824A1 (ja)	2015-07-02	受熱部構造及びヒートシンク
US7322102B2 (en)	2008-01-29	Isothermal plate assembly with predetermined shape and method for manufacturing the same
ES2287814T3 (es)	2007-12-16	Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada.
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