ES544944A0 - Un procedimiento para formar un material de termofraguado plastificado conductor - Google Patents

Un procedimiento para formar un material de termofraguado plastificado conductor

Info

Publication number
ES544944A0
ES544944A0 ES544944A ES544944A ES544944A0 ES 544944 A0 ES544944 A0 ES 544944A0 ES 544944 A ES544944 A ES 544944A ES 544944 A ES544944 A ES 544944A ES 544944 A0 ES544944 A0 ES 544944A0
Authority
ES
Spain
Prior art keywords
plastified
conductive
procedure
forming
setting material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES544944A
Other languages
English (en)
Other versions
ES8605009A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WR Grace and Co
Original Assignee
WR Grace and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WR Grace and Co filed Critical WR Grace and Co
Publication of ES544944A0 publication Critical patent/ES544944A0/es
Publication of ES8605009A1 publication Critical patent/ES8605009A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
ES544944A 1984-07-09 1985-07-08 Un procedimiento para formar un material de termofraguado plastificado conductor Expired ES8605009A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/629,085 US4575432A (en) 1984-07-09 1984-07-09 Conductive thermosetting compositions and process for using same

Publications (2)

Publication Number Publication Date
ES544944A0 true ES544944A0 (es) 1986-03-01
ES8605009A1 ES8605009A1 (es) 1986-03-01

Family

ID=24521515

Family Applications (1)

Application Number Title Priority Date Filing Date
ES544944A Expired ES8605009A1 (es) 1984-07-09 1985-07-08 Un procedimiento para formar un material de termofraguado plastificado conductor

Country Status (8)

Country Link
US (1) US4575432A (es)
EP (1) EP0167905B1 (es)
JP (1) JPH0668040B2 (es)
AU (1) AU4410285A (es)
BR (1) BR8503139A (es)
CA (1) CA1269189A (es)
DE (1) DE3582826D1 (es)
ES (1) ES8605009A1 (es)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695508A (en) * 1985-09-06 1987-09-22 The Yokohama Rubber Co., Ltd. Adhesive composition
US4732702A (en) * 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
GB8621094D0 (en) * 1986-09-01 1986-10-08 Ici Plc Loading of polymer additives
EP0275171B1 (en) * 1987-01-13 1995-03-22 RAYCHEM CORPORATION (a California corporation) A gasket for E.M.I. shielding and for sealing
DK89087A (da) * 1987-02-20 1988-08-21 Nordiske Kabel Traad Fremgangsmaade til fremstilling af en elektrisk halvledende, stripbar plastblending
US5286952A (en) * 1987-06-11 1994-02-15 Raychem Corporation Methods and devices which make use of conductive polymers to join articles
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5272216A (en) * 1990-12-28 1993-12-21 Westinghouse Electric Corp. System and method for remotely heating a polymeric material to a selected temperature
US5338497A (en) * 1992-04-03 1994-08-16 Ford Motor Company Induction heating method for forming composite articles
JPH06267784A (ja) * 1992-11-04 1994-09-22 Du Pont Kk 導電性樹脂ペースト及びそれにより成る端子電極を有した積層セラミックチップコンデンサ
GB9308062D0 (en) * 1993-04-16 1993-06-02 Romaniec K C C Conductive composite materials
US5858160A (en) * 1994-08-08 1999-01-12 Congoleum Corporation Decorative surface coverings containing embossed-in-register inlaids
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5785913A (en) * 1996-05-30 1998-07-28 Westinghouse Electric Corporation Method of magnetically forming a particle filled polymer having enhanced material characteristics
US6541561B1 (en) * 1997-10-22 2003-04-01 Trip Industries Holding, B.V. Resin reinforced cross-linkable printing inks and coatings
US5968419A (en) * 1997-12-08 1999-10-19 Westinghouse Electric Company Llc Conductive polymer compositions, electrical devices and methods of making
JP3346376B2 (ja) * 1999-11-05 2002-11-18 ソニーケミカル株式会社 異方性導電接続用導電性粒子及び異方性導電接続材料
US6644395B1 (en) 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear
WO2002015302A2 (en) 2000-08-14 2002-02-21 World Properties Inc. Thermosetting composition for electrochemical cell components and methods of making thereof
US7138203B2 (en) * 2001-01-19 2006-11-21 World Properties, Inc. Apparatus and method of manufacture of electrochemical cell components
WO2002080295A2 (en) * 2001-01-19 2002-10-10 World Properties Inc. Apparatus and method for electrochemical cell components
MXPA03006498A (es) 2001-01-22 2003-10-15 Parker Hannifin Corp Entrecara termica de cambio de fase, de liberacion limpia.
US7105594B2 (en) * 2001-04-11 2006-09-12 Xerox Corporation Conductive carbon filled polyvinyl butyral adhesive
DE60229072D1 (de) * 2002-02-06 2008-11-06 Parker Hannifin Corp Wärmesteuerungsmaterialien mit phasenumwandlungsdispersion
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
US7163117B2 (en) * 2002-05-01 2007-01-16 Stant Manufacturing Inc. Static charge dissipater for filler neck closure
US7208192B2 (en) * 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
US6956739B2 (en) 2002-10-29 2005-10-18 Parker-Hannifin Corporation High temperature stable thermal interface material
WO2007062131A2 (en) * 2005-11-22 2007-05-31 Ndsu Research Foundation Conductive ink compositions
US9567426B2 (en) * 2009-05-29 2017-02-14 Cytec Technology Corp. Engineered crosslinked thermoplastic particles for interlaminar toughening
US9482473B2 (en) * 2011-07-27 2016-11-01 Sharp Kabushiki Kaisha Gelatinous latent heat storage member with benard cell regions
JP5725559B2 (ja) * 2011-12-28 2015-05-27 信越化学工業株式会社 液状導電性樹脂組成物及び電子部品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30274A (en) * 1860-10-02 Water-wheel
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
US3609104A (en) * 1968-02-15 1971-09-28 Ercon Inc Electrically conductive gasket and material thereof
US3708387A (en) * 1970-09-11 1973-01-02 Univ Drexel Metallic modified plastic compositions and method for the preparation thereof
US3746662A (en) * 1971-08-09 1973-07-17 Du Pont Conductive systems
US3968056A (en) * 1974-09-27 1976-07-06 General Electric Company Radiation curable inks
USRE30274E (en) 1974-09-27 1980-05-13 General Electric Company Method for making a circuit board and article made thereby
JPS56160706A (en) * 1980-04-17 1981-12-10 Grace W R & Co Conductive plastic product, composition therefore and method of improving conductivity thereof
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste

Also Published As

Publication number Publication date
EP0167905A2 (en) 1986-01-15
DE3582826D1 (de) 1991-06-20
JPH0668040B2 (ja) 1994-08-31
EP0167905B1 (en) 1991-05-15
ES8605009A1 (es) 1986-03-01
AU4410285A (en) 1986-01-16
BR8503139A (pt) 1986-03-18
CA1269189A (en) 1990-05-15
EP0167905A3 (en) 1987-01-07
US4575432A (en) 1986-03-11
JPS6195070A (ja) 1986-05-13

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20001009