FR2437110A1 - Dispositif pour onde acoustique de surface capsule sous vide et methode de fabrication - Google Patents

Dispositif pour onde acoustique de surface capsule sous vide et methode de fabrication

Info

Publication number
FR2437110A1
FR2437110A1 FR7923180A FR7923180A FR2437110A1 FR 2437110 A1 FR2437110 A1 FR 2437110A1 FR 7923180 A FR7923180 A FR 7923180A FR 7923180 A FR7923180 A FR 7923180A FR 2437110 A1 FR2437110 A1 FR 2437110A1
Authority
FR
France
Prior art keywords
acoustic wave
surface acoustic
manufacturing
vacuum
capsule surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7923180A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RTX Corp
Original Assignee
United Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Technologies Corp filed Critical United Technologies Corp
Publication of FR2437110A1 publication Critical patent/FR2437110A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/36—Devices for manipulating acoustic surface waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

LA PRESENTE INVENTION CONCERNE LES DISPOSITIFS A ONDE ACOUSTIQUE DE SURFACE CAPSULES SOUS VIDE ET LEUR PROCEDE DE FABRICATION. LE DISPOSITIF A ONDE ACOUSTIQUE DE SURFACE COMPRENANT UN SUBSTRAT FORME D'UNE MATIERE DESIREE EST CAPSULE SOUS VIDE DANS UNE STRUCTURE FABRIQUEE DE LA MEME MATIERE QUE LEDIT SUBSTRAT ET DONT LES AXES CRISTALLOGRAPHIQUES SONT ORIENTES DE FACON A COINCIDER. LES DISPOSITIFS SONT PARTICULIEREMENT UTILES DANS DES LIGNES A RETARD.
FR7923180A 1978-09-25 1979-09-18 Dispositif pour onde acoustique de surface capsule sous vide et methode de fabrication Withdrawn FR2437110A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/945,359 US4213104A (en) 1978-09-25 1978-09-25 Vacuum encapsulation for surface acoustic wave (SAW) devices

Publications (1)

Publication Number Publication Date
FR2437110A1 true FR2437110A1 (fr) 1980-04-18

Family

ID=25482993

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7923180A Withdrawn FR2437110A1 (fr) 1978-09-25 1979-09-18 Dispositif pour onde acoustique de surface capsule sous vide et methode de fabrication

Country Status (5)

Country Link
US (1) US4213104A (fr)
JP (1) JPS5544300A (fr)
CA (1) CA1132719A (fr)
FR (1) FR2437110A1 (fr)
GB (1) GB2032214B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008012713A3 (fr) * 2006-07-20 2008-04-17 Nxp Bv Cadre et procédé de fabrication d'un assemblage

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4398117A (en) * 1981-03-23 1983-08-09 Sperry Corporation Bellows support for surface acoustic wave device
US4422055A (en) * 1981-10-30 1983-12-20 United Technologies Corporation Strain relief technique for surface acoustic wave devices
US4454639A (en) * 1982-06-03 1984-06-19 Motorola, Inc. Method for tuning piezoelectric resonators
US5594979A (en) * 1984-09-13 1997-01-21 Raytheon Company Method for packaging a surface acoustic wave device
JPS6297418A (ja) * 1985-10-23 1987-05-06 Clarion Co Ltd 弾性表面波装置のパツケ−ジ方法
EP0270693B1 (fr) * 1986-11-07 1991-07-17 Kristal Instrumente AG Dynamomètre à plusieurs composantes de force
US5010270A (en) * 1986-12-22 1991-04-23 Raytheon Company Saw device
GB2199985B (en) * 1986-12-22 1991-09-11 Raytheon Co Surface acoustic wave device
US5091051A (en) * 1986-12-22 1992-02-25 Raytheon Company Saw device method
JPH01213018A (ja) * 1988-02-22 1989-08-25 Fujitsu Ltd 弾性表面波ディバイスの構造
JPH01233821A (ja) * 1988-03-15 1989-09-19 Fujitsu Ltd 弾性表面波デバイス
US5345201A (en) * 1988-06-29 1994-09-06 Raytheon Company Saw device and method of manufacture
US5095240A (en) * 1989-11-13 1992-03-10 X-Cyte, Inc. Inductively coupled saw device and method for making the same
US5059848A (en) * 1990-08-20 1991-10-22 The United States Of America As Represented By The Secretary Of The Army Low-cost saw packaging technique
US5208504A (en) * 1990-12-28 1993-05-04 Raytheon Company Saw device and method of manufacture
US5270574A (en) * 1991-08-01 1993-12-14 Texas Instruments Incorporated Vacuum micro-chamber for encapsulating a microelectronics device
US5237235A (en) * 1991-09-30 1993-08-17 Motorola, Inc. Surface acoustic wave device package
DE69426789T2 (de) * 1993-04-28 2001-08-02 Matsushita Electric Industrial Co., Ltd. Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür
CN1099158C (zh) 1994-05-02 2003-01-15 埃普科斯股份有限公司 电子部件的封闭装置
US5729185A (en) * 1996-04-29 1998-03-17 Motorola Inc. Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal
US6107910A (en) * 1996-11-29 2000-08-22 X-Cyte, Inc. Dual mode transmitter/receiver and decoder for RF transponder tags
US6060815A (en) * 1997-08-18 2000-05-09 X-Cyte, Inc. Frequency mixing passive transponder
US6114971A (en) * 1997-08-18 2000-09-05 X-Cyte, Inc. Frequency hopping spread spectrum passive acoustic wave identification device
US5986382A (en) * 1997-08-18 1999-11-16 X-Cyte, Inc. Surface acoustic wave transponder configuration
US6208062B1 (en) 1997-08-18 2001-03-27 X-Cyte, Inc. Surface acoustic wave transponder configuration
GB9902341D0 (en) * 1999-02-03 1999-03-24 Perry James A H Packaged device
NO322272B1 (no) * 1999-03-26 2006-09-04 Kongsberg Maritime As Sensor og system for overvaking av temperatur inne i vanskelig tilgjengelige, bevegelige deler
GB2361318A (en) * 2000-04-12 2001-10-17 Marconi Caswell Ltd A surface acoustic wave strain sensor
US6731180B1 (en) 2000-10-20 2004-05-04 Deleware Capital Formation Inc. Evacuated hybrid ovenized oscillator
TW200405395A (en) * 2002-05-29 2004-04-01 Tokyo Electron Ltd Method and apparatus for monitoring film deposition in a process chamber
US7425881B2 (en) * 2004-03-18 2008-09-16 Murata Manufacturing Co., Ltd. Surface acoustic wave device and method that prevents restoration of a pyroelectric effect
US7351641B2 (en) * 2004-08-12 2008-04-01 Tessera, Inc. Structure and method of forming capped chips
EP1830168A4 (fr) * 2004-12-15 2011-08-03 Nihon Dempa Kogyo Co Capteur a quartz et dispositif de detection
US7601287B2 (en) * 2005-02-22 2009-10-13 Raytheon Company Method and apparatus for preform consistency
US7302864B2 (en) * 2005-09-23 2007-12-04 Honeywell International Inc. Torque sensor
JP2009109495A (ja) * 2007-10-29 2009-05-21 Schott Ag ひずみセンサ用パッケージ
EP2056084A1 (fr) 2007-10-29 2009-05-06 Schott AG Emballage pour capteur de contraintes
US8059425B2 (en) * 2008-05-28 2011-11-15 Azurewave Technologies, Inc. Integrated circuit module with temperature compensation crystal oscillator
DE102013103494A1 (de) 2013-04-08 2014-10-09 Pro-Micron Gmbh & Co. Kg Dehnungsmesssensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3339091A (en) * 1964-05-25 1967-08-29 Hewlett Packard Co Crystal resonators
GB1389610A (en) * 1972-10-11 1975-04-03 Marconi Co Ltd Surfacewave devices
FR2353997A2 (fr) * 1976-01-16 1977-12-30 Commissariat Energie Atomique Resonateur a quartz a electrodes non adherentes au cristal

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1512593A (en) * 1975-03-13 1978-06-01 Murata Manufacturing Co Elastic surface wave filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3339091A (en) * 1964-05-25 1967-08-29 Hewlett Packard Co Crystal resonators
GB1389610A (en) * 1972-10-11 1975-04-03 Marconi Co Ltd Surfacewave devices
FR2353997A2 (fr) * 1976-01-16 1977-12-30 Commissariat Energie Atomique Resonateur a quartz a electrodes non adherentes au cristal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008012713A3 (fr) * 2006-07-20 2008-04-17 Nxp Bv Cadre et procédé de fabrication d'un assemblage

Also Published As

Publication number Publication date
CA1132719A (fr) 1982-09-28
GB2032214A (en) 1980-04-30
US4213104A (en) 1980-07-15
JPS5544300A (en) 1980-03-28
GB2032214B (en) 1982-12-22
JPS6313574B2 (fr) 1988-03-26

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Legal Events

Date Code Title Description
ST Notification of lapse