FR2448140A1 - Capteur de pression a diaphragme - Google Patents

Capteur de pression a diaphragme

Info

Publication number
FR2448140A1
FR2448140A1 FR8002042A FR8002042A FR2448140A1 FR 2448140 A1 FR2448140 A1 FR 2448140A1 FR 8002042 A FR8002042 A FR 8002042A FR 8002042 A FR8002042 A FR 8002042A FR 2448140 A1 FR2448140 A1 FR 2448140A1
Authority
FR
France
Prior art keywords
type
integrated
resistors
pressure sensor
epitaxial layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8002042A
Other languages
English (en)
Other versions
FR2448140B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Publication of FR2448140A1 publication Critical patent/FR2448140A1/fr
Application granted granted Critical
Publication of FR2448140B1 publication Critical patent/FR2448140B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

CE CAPTEUR DE PRESSION COMPREND UN BLOC 12 A MEMBRANE CONSTITUE D'UN SOCLE 140 DE SILICIUM DU TYPE N, DE RESISTANCES INTEGREES 18 DU TYPE P ET DE BARRETTES CONDUCTRICES INTEGREES 146 DU TYPE P. UNE COUCHE EPITAXIALE 148 DE SILICIUM DU TYPE N, FORMEE SUR LE SOCLE 140, RECOUVRE LES RESISTANCES INTEGREES ET LES BARRETTES CONDUCTRICES. UNE COUCHE 150 DE SILICE ELECTRIQUEMENT ISOLANTE EST FORMEE SUR LA COUCHE EPITAXIALE. DES REGIONS DIFFUSEES 152 DU TYPE P RELIENT ELECTRIQUEMENT LES BARRETTES CONDUCTRICES INTEGREES A DES CONNEXIONS 154 D'ALUMINIUM FORMEES SUR LA COUCHE DE SILICE. LES RESISTANCES INTEGREES ETANT PROTEGEES, LEUR CARACTERISTIQUE ELECTRIQUE EST STABLE. APPLICATIONS NOTAMMENT A LA MESURE DE PRESSION DE FLUIDES CONTENANT DE L'HUMIDITE ET (OU) DES GAZ CORROSIFS.
FR8002042A 1979-02-02 1980-01-30 Capteur de pression a diaphragme Granted FR2448140A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979011583U JPS55112864U (fr) 1979-02-02 1979-02-02

Publications (2)

Publication Number Publication Date
FR2448140A1 true FR2448140A1 (fr) 1980-08-29
FR2448140B1 FR2448140B1 (fr) 1982-12-10

Family

ID=11781919

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8002042A Granted FR2448140A1 (fr) 1979-02-02 1980-01-30 Capteur de pression a diaphragme

Country Status (5)

Country Link
US (1) US4314226A (fr)
JP (1) JPS55112864U (fr)
DE (1) DE3003450C3 (fr)
FR (1) FR2448140A1 (fr)
GB (1) GB2042257A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0316343A4 (en) * 1986-07-28 1990-09-26 Rosemount Inc. Media isolated differential pressure sensors

Families Citing this family (37)

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DE3118366A1 (de) * 1981-05-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Drucksensor
DE3200448C2 (de) * 1982-01-09 1986-03-06 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Herstellung einer Halbleiter-Druckwandleranordnung
JPS58146827A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 半導体式圧力センサ
JPS5995420A (ja) * 1982-11-24 1984-06-01 Hitachi Ltd Ｍｏｓ型センサ
USRE33360E (en) * 1983-06-22 1990-10-02 Abbott Laboratories Disposable transducer apparatus for an electromanometry system
US4557269A (en) * 1983-06-22 1985-12-10 Abbott Laboratories Disposable transducer apparatus for an electromanometry system
JPS60128673A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 半導体感圧装置
CA1314410C (fr) * 1986-12-08 1993-03-16 Masanori Nishiguchi Structure de cablage pour capteur de pression a semiconducteur
US4737756A (en) * 1987-01-08 1988-04-12 Imo Delaval Incorporated Electrostatically bonded pressure transducers for corrosive fluids
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
US5107309A (en) * 1989-12-18 1992-04-21 Honeywell Inc. Double diffused leadout for a semiconductor device
DE59202616D1 (de) * 1991-12-24 1995-07-27 Landis & Gry Tech Innovat Ag Drucksensor mit einer Membran aus Halbleitermaterial.
US6229427B1 (en) * 1995-07-13 2001-05-08 Kulite Semiconductor Products Inc. Covered sealed pressure transducers and method for making same
JP3426498B2 (ja) * 1997-08-13 2003-07-14 株式会社日立ユニシアオートモティブ 圧力センサ
US8623709B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of top port surface mount silicon condenser microphone packages
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
AU2003232165A1 (en) * 2002-06-07 2003-12-22 Cantion A/S A cantilever sensor with a current shield and a method for its production
RU2243517C2 (ru) * 2002-06-11 2004-12-27 Новосибирский государственный технический университет Тензопреобразователь давления
DE102004035545A1 (de) * 2004-07-22 2006-02-16 Siemens Ag Drucksensor und Verfahren zu dessen Herstellung
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005058653A1 (de) * 2005-12-07 2007-06-28 Siemens Ag Mitteldrucksensor
JP4897318B2 (ja) * 2006-03-16 2012-03-14 ラピスセミコンダクタ株式会社 ピエゾ抵抗素子及びその製造方法
US20080217709A1 (en) * 2007-03-07 2008-09-11 Knowles Electronics, Llc Mems package having at least one port and manufacturing method thereof
JP2009053034A (ja) * 2007-08-27 2009-03-12 Mitsumi Electric Co Ltd 半導体圧力センサ及びその製造方法
DE102010018499A1 (de) * 2010-04-22 2011-10-27 Schweizer Electronic Ag Leiterplatte mit Hohlraum
EP2774390A4 (fr) 2011-11-04 2015-07-22 Knowles Electronics Llc Membrane diélectrique intégrée en vue de servir de barrière dans un dispositif acoustique, et procédé pour sa fabrication
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
JP7790339B2 (ja) * 2022-12-28 2025-12-23 トヨタ自動車株式会社 燃料電池
CN116062677A (zh) * 2023-03-21 2023-05-05 无锡胜脉电子有限公司 一种抗干扰的mems压力传感器芯片及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1248087A (en) * 1969-02-28 1971-09-29 Ferranti Ltd Improvements relating to pressure gauges
US3753196A (en) * 1971-10-05 1973-08-14 Kulite Semiconductor Products Transducers employing integral protective coatings and supports
US3968466A (en) * 1973-10-09 1976-07-06 Kabushiki Kaisha Toyota Chuo Kenkyusho Pressure transducer
US3994009A (en) * 1973-02-12 1976-11-23 Honeywell Inc. Stress sensor diaphragms over recessed substrates
US4023562A (en) * 1975-09-02 1977-05-17 Case Western Reserve University Miniature pressure transducer for medical use and assembly method
FR2422261A1 (fr) * 1978-04-05 1979-11-02 Hitachi Ltd Transducteur de pression absolue semi-conducteur et procede de fabrication

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1534711A (fr) 1966-04-13 1968-08-02 Rca Corp Résistance et procédé pour sa fabrication
IT946150B (it) * 1971-12-15 1973-05-21 Ates Componenti Elettron Perfezionamento al processo plana re epistssiale per la produzione di circuiti integrati lineari di potenza
US3971059A (en) * 1974-09-23 1976-07-20 National Semiconductor Corporation Complementary bipolar transistors having collector diffused isolation
NL7415668A (nl) * 1974-12-02 1976-06-04 Philips Nv Drukopnemer.
US4125820A (en) * 1975-10-06 1978-11-14 Honeywell Inc. Stress sensor apparatus
US4035823A (en) * 1975-10-06 1977-07-12 Honeywell Inc. Stress sensor apparatus
DE2644638A1 (de) * 1975-10-06 1977-04-07 Honeywell Inc Verfahren zur herstellung eines halbleiter-druckfuehlers sowie nach diesem verfahren hergestellter druckfuehler
GB1488731A (en) 1976-05-07 1977-10-12 Ferranti Ltd Integrated circuit devices and to their manufacture
US4095252A (en) * 1976-12-27 1978-06-13 National Semiconductor Corporation Composite jfet-bipolar transistor structure
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
US4205556A (en) * 1979-02-12 1980-06-03 Rockwell International Corporation Circuitry for strain sensitive apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1248087A (en) * 1969-02-28 1971-09-29 Ferranti Ltd Improvements relating to pressure gauges
US3753196A (en) * 1971-10-05 1973-08-14 Kulite Semiconductor Products Transducers employing integral protective coatings and supports
US3994009A (en) * 1973-02-12 1976-11-23 Honeywell Inc. Stress sensor diaphragms over recessed substrates
US3968466A (en) * 1973-10-09 1976-07-06 Kabushiki Kaisha Toyota Chuo Kenkyusho Pressure transducer
US4023562A (en) * 1975-09-02 1977-05-17 Case Western Reserve University Miniature pressure transducer for medical use and assembly method
FR2422261A1 (fr) * 1978-04-05 1979-11-02 Hitachi Ltd Transducteur de pression absolue semi-conducteur et procede de fabrication

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0316343A4 (en) * 1986-07-28 1990-09-26 Rosemount Inc. Media isolated differential pressure sensors

Also Published As

Publication number Publication date
DE3003450C3 (de) 1982-04-01
JPS55112864U (fr) 1980-08-08
DE3003450A1 (de) 1980-08-07
US4314226A (en) 1982-02-02
FR2448140B1 (fr) 1982-12-10
DE3003450B2 (de) 1981-07-16
GB2042257A (en) 1980-09-17

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