FR2676308B1 - Transistor a effet de champ utilisant un effet tunnel resonnant et procede de fabrication. - Google Patents

Transistor a effet de champ utilisant un effet tunnel resonnant et procede de fabrication.

Info

Publication number
FR2676308B1
FR2676308B1 FR9205582A FR9205582A FR2676308B1 FR 2676308 B1 FR2676308 B1 FR 2676308B1 FR 9205582 A FR9205582 A FR 9205582A FR 9205582 A FR9205582 A FR 9205582A FR 2676308 B1 FR2676308 B1 FR 2676308B1
Authority
FR
France
Prior art keywords
manufacturing
resonant tunnel
field effect
effect transistor
tunnel effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9205582A
Other languages
English (en)
Other versions
FR2676308A1 (fr
Inventor
Shigeru Kusunoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2676308A1 publication Critical patent/FR2676308A1/fr
Application granted granted Critical
Publication of FR2676308B1 publication Critical patent/FR2676308B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/025—Manufacture or treatment forming recessed gates, e.g. by using local oxidation
    • H10D64/027—Manufacture or treatment forming recessed gates, e.g. by using local oxidation by etching at gate locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3466—Crystal orientation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Bipolar Transistors (AREA)
  • Junction Field-Effect Transistors (AREA)
FR9205582A 1991-05-10 1992-05-06 Transistor a effet de champ utilisant un effet tunnel resonnant et procede de fabrication. Expired - Fee Related FR2676308B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3105878A JPH04335538A (ja) 1991-05-10 1991-05-10 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
FR2676308A1 FR2676308A1 (fr) 1992-11-13
FR2676308B1 true FR2676308B1 (fr) 2001-08-10

Family

ID=14419194

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9205582A Expired - Fee Related FR2676308B1 (fr) 1991-05-10 1992-05-06 Transistor a effet de champ utilisant un effet tunnel resonnant et procede de fabrication.

Country Status (4)

Country Link
US (1) US5336904A (fr)
JP (1) JPH04335538A (fr)
DE (1) DE4212861C2 (fr)
FR (1) FR2676308B1 (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5739544A (en) * 1993-05-26 1998-04-14 Matsushita Electric Industrial Co., Ltd. Quantization functional device utilizing a resonance tunneling effect and method for producing the same
GB9321326D0 (en) * 1993-10-15 1993-12-08 Hitachi Europ Ltd Controllable conduction device with multiple tunnel junction
US5796119A (en) * 1993-10-29 1998-08-18 Texas Instruments Incorporated Silicon resonant tunneling
US5489539A (en) * 1994-01-10 1996-02-06 Hughes Aircraft Company Method of making quantum well structure with self-aligned gate
US5877515A (en) * 1995-10-10 1999-03-02 International Rectifier Corporation SiC semiconductor device
FR2749977B1 (fr) * 1996-06-14 1998-10-09 Commissariat Energie Atomique Transistor mos a puits quantique et procedes de fabrication de celui-ci
US6191432B1 (en) * 1996-09-02 2001-02-20 Kabushiki Kaisha Toshiba Semiconductor device and memory device
US6310385B1 (en) 1997-01-16 2001-10-30 International Rectifier Corp. High band gap layer to isolate wells in high voltage power integrated circuits
US6180958B1 (en) * 1997-02-07 2001-01-30 James Albert Cooper, Jr. Structure for increasing the maximum voltage of silicon carbide power transistors
WO2002073673A1 (fr) 2001-03-13 2002-09-19 Rochester Institute Of Technology Commutateur micro-electromecanique et un procede de sa mise en oeuvre et de sa fabrication
JP4570806B2 (ja) * 2001-04-11 2010-10-27 セイコーインスツル株式会社 半導体集積回路装置の製造方法
US7378775B2 (en) 2001-10-26 2008-05-27 Nth Tech Corporation Motion based, electrostatic power source and methods thereof
US7217582B2 (en) 2003-08-29 2007-05-15 Rochester Institute Of Technology Method for non-damaging charge injection and a system thereof
US7287328B2 (en) 2003-08-29 2007-10-30 Rochester Institute Of Technology Methods for distributed electrode injection
US20050048409A1 (en) * 2003-08-29 2005-03-03 Elqaq Deirdre H. Method of making an optical device in silicon
JP2005209980A (ja) * 2004-01-26 2005-08-04 Sony Corp 半導体装置の製造方法および半導体装置
US8581308B2 (en) * 2004-02-19 2013-11-12 Rochester Institute Of Technology High temperature embedded charge devices and methods thereof
US7465992B2 (en) * 2005-04-27 2008-12-16 International Business Machines Corporation Field effect transistor with mixed-crystal-orientation channel and source/drain regions
WO2006135336A1 (fr) * 2005-06-16 2006-12-21 Qunano Ab Transistor a nanofil semi-conducteur
US8338887B2 (en) * 2005-07-06 2012-12-25 Infineon Technologies Ag Buried gate transistor
US8134142B2 (en) * 2006-01-25 2012-03-13 Nxp B.V. Tunneling transistor with barrier
EP1816689A1 (fr) * 2006-02-07 2007-08-08 ST Microelectronics Crolles 2 SAS Structure de transistor ou de triode à effet tunnel et à nanocanal isolant
US8093584B2 (en) * 2008-12-23 2012-01-10 Intel Corporation Self-aligned replacement metal gate process for QWFET devices
KR101159900B1 (ko) * 2009-04-22 2012-06-25 에스케이하이닉스 주식회사 반도체 소자 및 그 제조방법
WO2011004474A1 (fr) * 2009-07-08 2011-01-13 株式会社 東芝 Dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur
US8324661B2 (en) * 2009-12-23 2012-12-04 Intel Corporation Quantum well transistors with remote counter doping
JP5662865B2 (ja) * 2010-05-19 2015-02-04 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US10103226B2 (en) 2012-04-30 2018-10-16 International Business Machines Corporation Method of fabricating tunnel transistors with abrupt junctions
JP2015041765A (ja) * 2013-08-20 2015-03-02 正幸 安部 半導体装置
JP2015041764A (ja) * 2013-08-20 2015-03-02 正幸 安部 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127861A (en) * 1977-09-26 1978-11-28 International Business Machines Corporation Metal base transistor with thin film amorphous semiconductors
US4704622A (en) * 1985-11-27 1987-11-03 American Telephone And Telegraph Company, At&T Bell Laboratories Negative transconductance device
US4721983A (en) * 1986-01-31 1988-01-26 Texas Instruments Incorporated Three terminal tunneling device
US4908678A (en) * 1986-10-08 1990-03-13 Semiconductor Energy Laboratory Co., Ltd. FET with a super lattice channel
KR880010509A (ko) * 1987-02-11 1988-10-10 오레그 이. 앨버 전계효과 트랜지스터
US5130766A (en) * 1988-08-04 1992-07-14 Fujitsu Limited Quantum interference type semiconductor device
JP3194941B2 (ja) * 1990-03-19 2001-08-06 富士通株式会社 半導体装置

Also Published As

Publication number Publication date
US5336904A (en) 1994-08-09
DE4212861C2 (de) 1996-04-18
FR2676308A1 (fr) 1992-11-13
DE4212861A1 (de) 1992-11-12
JPH04335538A (ja) 1992-11-24

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