FR2698302B1 - Méthode de découpage par laser. - Google Patents

Méthode de découpage par laser.

Info

Publication number
FR2698302B1
FR2698302B1 FR9314110A FR9314110A FR2698302B1 FR 2698302 B1 FR2698302 B1 FR 2698302B1 FR 9314110 A FR9314110 A FR 9314110A FR 9314110 A FR9314110 A FR 9314110A FR 2698302 B1 FR2698302 B1 FR 2698302B1
Authority
FR
France
Prior art keywords
laser cutting
cutting method
laser
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9314110A
Other languages
English (en)
Other versions
FR2698302A1 (fr
Inventor
Yoshizumu Yasuji
Inoue Akihiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2698302A1 publication Critical patent/FR2698302A1/fr
Application granted granted Critical
Publication of FR2698302B1 publication Critical patent/FR2698302B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
FR9314110A 1992-11-25 1993-11-25 Méthode de découpage par laser. Expired - Fee Related FR2698302B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4339784A JPH06155063A (ja) 1992-11-25 1992-11-25 レーザー切断方法

Publications (2)

Publication Number Publication Date
FR2698302A1 FR2698302A1 (fr) 1994-05-27
FR2698302B1 true FR2698302B1 (fr) 1995-04-14

Family

ID=18330781

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9314110A Expired - Fee Related FR2698302B1 (fr) 1992-11-25 1993-11-25 Méthode de découpage par laser.

Country Status (3)

Country Link
JP (1) JPH06155063A (fr)
FR (1) FR2698302B1 (fr)
PT (1) PT101412B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685868B2 (en) 1995-10-30 2004-02-03 Darryl Costin Laser method of scribing graphics
US5990444A (en) * 1995-10-30 1999-11-23 Costin; Darryl J. Laser method and system of scribing graphics
US6252196B1 (en) 1996-10-11 2001-06-26 Technolines Llc Laser method of scribing graphics
US6140602A (en) * 1997-04-29 2000-10-31 Technolines Llc Marking of fabrics and other materials using a laser
JP2001053443A (ja) * 1999-08-06 2001-02-23 Hitachi Ltd 電子回路基板の製造方法，電子回路基板の製造装置及び電子回路基板
US7065820B2 (en) 2003-06-30 2006-06-27 Nike, Inc. Article and method for laser-etching stratified materials
US7424783B2 (en) 2003-06-30 2008-09-16 Nike, Inc. Article of apparel incorporating a stratified material
WO2005036601A2 (fr) * 2003-10-07 2005-04-21 Midwest Research Institute Caracteristiques de plaquette determinees par reflectometrie, et dispositif et procede pour le traitement de plaquette
JP5361999B2 (ja) * 2009-05-25 2013-12-04 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
CN102205469A (zh) * 2010-03-31 2011-10-05 深圳市先阳软件技术有限公司 一种对电池极片进行激光切割的控制方法及系统
JP2012192415A (ja) * 2011-03-15 2012-10-11 Disco Corp レーザー加工装置
DE102011100735B4 (de) 2011-05-06 2019-12-05 Faurecia Autositze Gmbh Verfahren zum Herstellen eines Zahnrades und hierdurch hergestelltes Zahnrad
CN103962727B (zh) * 2013-01-28 2018-03-02 深圳市裕展精密科技有限公司 蓝宝石切割装置
CN104148817B (zh) * 2014-07-30 2016-09-07 苏州市华宁机械制造有限公司 激光切割机
JP6190855B2 (ja) * 2015-09-08 2017-08-30 株式会社アマダホールディングス レーザ加工方法およびレーザ加工装置
CN106964907A (zh) * 2017-04-25 2017-07-21 重庆邮电大学 一种激光切割的方法和设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4078165A (en) * 1976-05-03 1978-03-07 Grumman Aerospace Corporation Semi-automatic feed laser apparatus
JPS57181786A (en) * 1981-04-28 1982-11-09 Amada Eng & Service Laser working method
JPS61123493A (ja) * 1984-11-20 1986-06-11 Mitsubishi Electric Corp レ−ザ加工装置
JPS62240184A (ja) * 1986-04-14 1987-10-20 Mitsubishi Electric Corp 電気機器用絶縁物の切削方法
JPS63108984A (ja) * 1986-10-24 1988-05-13 Mitsubishi Electric Corp レ−ザ加工方法
DE3733568A1 (de) * 1987-10-03 1989-04-20 Thyssen Industrie Verfahren zur herstellung von schweissverbindungen an karosserieteilen und anderen blechteilen und robotersystem
JPH0199790A (ja) * 1987-10-12 1989-04-18 Mitsubishi Electric Corp ドロスが付着しやすい材料のレーザ切断法
JPH03258479A (ja) * 1990-03-06 1991-11-18 Mitsubishi Electric Corp レーザ加工装置
JPH04190987A (ja) * 1990-11-26 1992-07-09 Murata Mach Ltd レーザ加工機

Also Published As

Publication number Publication date
PT101412B (pt) 2000-02-29
FR2698302A1 (fr) 1994-05-27
PT101412A (pt) 1994-09-30
JPH06155063A (ja) 1994-06-03

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060731