FR3073763B1 - Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage - Google Patents

Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage Download PDF

Info

Publication number
FR3073763B1
FR3073763B1 FR1860164A FR1860164A FR3073763B1 FR 3073763 B1 FR3073763 B1 FR 3073763B1 FR 1860164 A FR1860164 A FR 1860164A FR 1860164 A FR1860164 A FR 1860164A FR 3073763 B1 FR3073763 B1 FR 3073763B1
Authority
FR
France
Prior art keywords
shaft
welding head
axis
mounting components
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1860164A
Other languages
English (en)
Other versions
FR3073763A1 (fr
Inventor
Rene Kroehnert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH01396/17A external-priority patent/CH714351A1/de
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of FR3073763A1 publication Critical patent/FR3073763A1/fr
Application granted granted Critical
Publication of FR3073763B1 publication Critical patent/FR3073763B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets
    • H02K1/2706—Inner rotors
    • H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
    • H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
    • H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
    • H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Resistance Welding (AREA)

Abstract

Une tête de soudage (1) pour monter des composants comprend un arbre (2) et une partie de boîtier (3) sur laquelle l'arbre (2) est supporté. Le palier de l'arbre (2) permet à la fois une rotation de l'arbre (2) autour d'un axe (6) et un déplacement de l'arbre (2) dans la direction longitudinale de l'axe (6) selon une course H prédéterminée. La tête de soudage (1) comprend en outre un moteur électrique avec un stator fixé sur la partie de boîtier (3) et un rotor fixé sur l'arbre (2), un encodeur pour mesurer la position de rotation de l'arbre (2) et un générateur de force pour appliquer une force sur l'arbre (2). Le stator comprend des bobines (7) auxquelles des courants peuvent être appliqués, le rotor comprend une pluralité d'aimants permanents (8). Une longueur des aimants permanents (8) mesurée dans la direction longitudinale de l'axe (6) est plus courte ou plus longue d'au moins la course H qu'une longueur effective des bobines (7) mesurée dans la direction longitudinale de l'axe (6).
FR1860164A 2017-11-17 2018-11-05 Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage Active FR3073763B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH0139617 2017-11-17
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.
CH0095718 2018-08-06
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.

Publications (2)

Publication Number Publication Date
FR3073763A1 FR3073763A1 (fr) 2019-05-24
FR3073763B1 true FR3073763B1 (fr) 2021-05-14

Family

ID=66336599

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1860164A Active FR3073763B1 (fr) 2017-11-17 2018-11-05 Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage

Country Status (4)

Country Link
US (1) US12046490B2 (fr)
CN (1) CN110011439B (fr)
DE (1) DE102018128615A1 (fr)
FR (1) FR3073763B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2591132A (en) * 2020-01-17 2021-07-21 Asm Assembly Systems Singapore Pte Ltd Tooling pin placement system
CN115255700B (zh) * 2022-08-19 2024-09-17 昆山汇智电机科技有限公司 一种电机定子的线头焊接设备

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093596A (en) 1990-10-24 1992-03-03 Ibm Corporation Combined linear-rotary direct drive step motor
JP2979772B2 (ja) * 1991-09-13 1999-11-15 松下電器産業株式会社 ダイボンディング装置
JP2998467B2 (ja) 1992-12-04 2000-01-11 松下電器産業株式会社 電子部品の実装用ヘッド
US5952744A (en) * 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
US7218017B1 (en) 1996-06-24 2007-05-15 Anorad Corporation System and method to control a rotary-linear actuator
JP4289761B2 (ja) 2000-04-20 2009-07-01 Ｊｕｋｉ株式会社 チップマウンタのチップ搭載用ヘッド
JP3800126B2 (ja) 2002-04-23 2006-07-26 松下電器産業株式会社 作業ヘッド
JP3772808B2 (ja) 2002-08-29 2006-05-10 株式会社村田製作所 部品装着装置
EP1813412B1 (fr) * 2003-08-25 2011-03-02 Husky Injection Molding Systems Ltd. Ensemble de commande pour faire pivoter et moduler un arbre
JP2008288473A (ja) 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
WO2010036204A1 (fr) * 2008-09-24 2010-04-01 Chai Meng Goh Système de préhension et de positionnement à entraînement direct avec masse mobile réduite
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
US8016010B2 (en) 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
CH707378A1 (de) * 2012-12-21 2014-06-30 Besi Switzerland Ag Thermokompressionsverfahren und Vorrichtung für die Montage von Halbleiterchips auf einem Substrat.
CH707480B1 (de) 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
CH707934B1 (de) 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6372031B2 (ja) 2013-12-09 2018-08-15 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 流体圧アクチュエータ
US9726204B2 (en) * 2013-12-09 2017-08-08 Samsung Electronics Co., Ltd. Fluid pressure actuator
JP6664986B2 (ja) 2016-02-17 2020-03-13 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
FR3073763A1 (fr) 2019-05-24
DE102018128615A1 (de) 2019-05-23
CN110011439B (zh) 2023-10-17
US20190157122A1 (en) 2019-05-23
US12046490B2 (en) 2024-07-23
CN110011439A (zh) 2019-07-12

Similar Documents

Publication Publication Date Title
JP5253789B2 (ja) ブラシレスモータ
EP2979936A1 (fr) Moteur d'essuie-glace sans balais
JP2007318821A5 (fr)
US11296579B2 (en) Vernier external rotor machine and motor system
FR3068408B1 (fr) Ensemble d'entrainement d'une machine electrique tournante pour un vehicule automobile
FR3083386A1 (fr) Ensemble ralentisseur electromagnetique et generatrice et vehicule comportant un tel ensemble
FR3069116B1 (fr) Machine electrique tournante munie d'un capteur de temperature
KR20160042934A (ko) 기어 전동 장치
JP2017131058A (ja) モータ、および、これを用いた電動パワーステアリング装置
BR112016029225B1 (pt) Rotor para uma máquina elétrica rotativa
KR20040081793A (ko) 차량용 교류 전기기계
FR2374765A1 (fr) Moteur electrique a embrayage et a frein
CN104362792B (zh) 电机及其转子组件
JP6469848B2 (ja) 機械の駆動装置、回転モーメントモータ、カップリング装置、材料を加工する装置およびトルクモータの使用
MY200011A (en) Bonding head for mounting components and die bonder with such a bonding head
EP2830199A3 (fr) Machine électrique rotative et véhicule de type à selle
JP2002084724A (ja) 車両用交流電機
FR3104850B1 (fr) Machine électrique tournante comportant un organe élastique
KR20090053267A (ko) 브러시형 직류 모터 및 이를 구비한 전동식 조향장치
FR3064134B1 (fr) Compresseur de suralimentation electrique avec support d'aimant
FR3108806B1 (fr) Rotor pour moteur électrique équipé de capteur de tiges
US10879750B2 (en) Claw pole having shaped claw pole segments
DE102016208513A1 (de) Riemenscheibenanordnung für einen Riementrieb zum Antrieb eines Nebenaggregats eines Kraftfahrzeugs
FR3089363B1 (fr) Compresseur electrique
FR3141295B1 (fr) Assemblage de moteur électrique

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20200124

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7