FR3100345B1 - Procédé de fabrications de structures dissymétriques en résine - Google Patents

Procédé de fabrications de structures dissymétriques en résine Download PDF

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Publication number
FR3100345B1
FR3100345B1 FR1909527A FR1909527A FR3100345B1 FR 3100345 B1 FR3100345 B1 FR 3100345B1 FR 1909527 A FR1909527 A FR 1909527A FR 1909527 A FR1909527 A FR 1909527A FR 3100345 B1 FR3100345 B1 FR 3100345B1
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FR
France
Prior art keywords
pattern
creep
resin
dinversion
flank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1909527A
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English (en)
Other versions
FR3100345A1 (fr
Inventor
Stefan Landis
Romain Laurent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1909527A priority Critical patent/FR3100345B1/fr
Priority to US17/638,688 priority patent/US20220404704A1/en
Priority to PCT/EP2020/074030 priority patent/WO2021038013A1/fr
Priority to EP20764362.8A priority patent/EP4022393A1/fr
Publication of FR3100345A1 publication Critical patent/FR3100345A1/fr
Application granted granted Critical
Publication of FR3100345B1 publication Critical patent/FR3100345B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Micromachines (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Materials For Photolithography (AREA)

Abstract

Procédé de fabrications de structures dissymétriques en résine L’invention porte notamment sur un procédé de réalisation d’au moins une structure (1) comprenant des flancs (211, 221) aux inclinaisons α211, α221 différentes, le procédé comprenant les étapes suivantes : Fournir un empilement comprenant un substrat (100) surmonté d’au moins une couche (200) de résine positive dont la tonalité peut s’inverser lorsque elle est exposée à une dose d’insolation D<Dinversion, les motifs exposés à la dose Dinversion n’étant pas sensible au fluage à la température transition vitreuse Tfluage de la résine, Former au moins un premier motif (210) non sensible par exposition de la résine avec une première dose D1 ≥ Dinversion, le premier motif (210) présentant au moins un premier flanc (211) présentant une première inclinaison α211, Former au moins un deuxième motif (220) sensible au fluage par exposition de la résine avec une deuxième dose D2 < Dinversion, puis développer la deuxième zone (232) de sorte à laisser en place le deuxième motif (220), Effectuer une étape de fluage en appliquant une température T ≥ Tfluage de sorte à faire fluer le deuxième motif (220) sans faire fluer le premier motif (210), jusqu’à ce que le deuxième motif (220) flue sur au moins une partie du premier motif (210) en : laissant à découvert au moins partiellement le premier flanc (211) du premier motif (210) présentant ladite première inclinaison α211, définissant au moins un deuxième flanc (221) pour la structure (1), le deuxième flanc (221) présentant par rapport audit plan (XY) une deuxième inclinaison α221 différente de la première inclinaison α211. Figure pour l’abrégé : Fig. 3J
FR1909527A 2019-08-29 2019-08-29 Procédé de fabrications de structures dissymétriques en résine Expired - Fee Related FR3100345B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1909527A FR3100345B1 (fr) 2019-08-29 2019-08-29 Procédé de fabrications de structures dissymétriques en résine
US17/638,688 US20220404704A1 (en) 2019-08-29 2020-08-27 Method for manufacturing resin asymmetrical structures
PCT/EP2020/074030 WO2021038013A1 (fr) 2019-08-29 2020-08-27 Procédé de fabrication de structures dissymétriques en résine
EP20764362.8A EP4022393A1 (fr) 2019-08-29 2020-08-27 Procédé de fabrication de structures dissymétriques en résine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1909527A FR3100345B1 (fr) 2019-08-29 2019-08-29 Procédé de fabrications de structures dissymétriques en résine
FR1909527 2019-08-29

Publications (2)

Publication Number Publication Date
FR3100345A1 FR3100345A1 (fr) 2021-03-05
FR3100345B1 true FR3100345B1 (fr) 2022-04-15

Family

ID=69172897

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1909527A Expired - Fee Related FR3100345B1 (fr) 2019-08-29 2019-08-29 Procédé de fabrications de structures dissymétriques en résine

Country Status (4)

Country Link
US (1) US20220404704A1 (fr)
EP (1) EP4022393A1 (fr)
FR (1) FR3100345B1 (fr)
WO (1) WO2021038013A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3143843B1 (fr) * 2022-12-19 2025-05-23 Commissariat Energie Atomique Procédé de transformation d’un support

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972570A (en) * 1997-07-17 1999-10-26 International Business Machines Corporation Method of photolithographically defining three regions with one mask step and self aligned isolation structure formed thereby
JP5573578B2 (ja) * 2009-10-16 2014-08-20 信越化学工業株式会社 パターン形成方法及びレジスト材料

Also Published As

Publication number Publication date
EP4022393A1 (fr) 2022-07-06
FR3100345A1 (fr) 2021-03-05
WO2021038013A1 (fr) 2021-03-04
US20220404704A1 (en) 2022-12-22

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