FR88680E - Dispositif semiconducteur - Google Patents

Dispositif semiconducteur

Info

Publication number
FR88680E
FR88680E FR27612A FR27612A FR88680E FR 88680 E FR88680 E FR 88680E FR 27612 A FR27612 A FR 27612A FR 27612 A FR27612 A FR 27612A FR 88680 E FR88680 E FR 88680E
Authority
FR
France
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR27612A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Priority to FR27612A priority Critical patent/FR88680E/fr
Application granted granted Critical
Publication of FR88680E publication Critical patent/FR88680E/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
FR27612A 1964-08-08 1965-08-06 Dispositif semiconducteur Expired FR88680E (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR27612A FR88680E (fr) 1964-08-08 1965-08-06 Dispositif semiconducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0092533 1964-08-08
FR27612A FR88680E (fr) 1964-08-08 1965-08-06 Dispositif semiconducteur

Publications (1)

Publication Number Publication Date
FR88680E true FR88680E (fr) 1967-03-10

Family

ID=63144755

Family Applications (1)

Application Number Title Priority Date Filing Date
FR27612A Expired FR88680E (fr) 1964-08-08 1965-08-06 Dispositif semiconducteur

Country Status (5)

Country Link
CH (1) CH422168A (fr)
DE (1) DE1439427A1 (fr)
FR (1) FR88680E (fr)
GB (1) GB1104515A (fr)
NL (1) NL6510283A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2513013A1 (fr) * 1981-09-16 1983-03-18 Licentia Gmbh Diode a semiconducteurs sous boitier tubulaire

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2102512A5 (fr) * 1970-08-06 1972-04-07 Liaison Electr Silec
DE2630320A1 (de) * 1976-07-06 1978-01-12 Licentia Gmbh Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse
FR2839952B1 (fr) 2002-05-24 2004-08-06 Oreal Dispositif de distribution destine a equiper un recipient muni d'une valve
DE102017203132A1 (de) * 2017-02-06 2018-08-09 Siemens Aktiengesellschaft Leistungsmodul

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2513013A1 (fr) * 1981-09-16 1983-03-18 Licentia Gmbh Diode a semiconducteurs sous boitier tubulaire

Also Published As

Publication number Publication date
DE1439427A1 (de) 1969-06-26
NL6510283A (fr) 1966-02-09
CH422168A (de) 1966-10-15
GB1104515A (en) 1968-02-28

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