GB2181981B - Device for removing or installing components from a printed circuit board or the like including improved nozzle for use therewith - Google Patents

Device for removing or installing components from a printed circuit board or the like including improved nozzle for use therewith

Info

Publication number
GB2181981B
GB2181981B GB8618672A GB8618672A GB2181981B GB 2181981 B GB2181981 B GB 2181981B GB 8618672 A GB8618672 A GB 8618672A GB 8618672 A GB8618672 A GB 8618672A GB 2181981 B GB2181981 B GB 2181981B
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
use therewith
including improved
improved nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8618672A
Other languages
English (en)
Other versions
GB8618672D0 (en
GB2181981A (en
Inventor
Bradford W Coffman
William J Siegel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pace Inc
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of GB8618672D0 publication Critical patent/GB8618672D0/en
Publication of GB2181981A publication Critical patent/GB2181981A/en
Application granted granted Critical
Publication of GB2181981B publication Critical patent/GB2181981B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB8618672A 1985-10-23 1986-07-31 Device for removing or installing components from a printed circuit board or the like including improved nozzle for use therewith Expired GB2181981B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79044885A 1985-10-23 1985-10-23

Publications (3)

Publication Number Publication Date
GB8618672D0 GB8618672D0 (en) 1986-09-10
GB2181981A GB2181981A (en) 1987-05-07
GB2181981B true GB2181981B (en) 1989-11-08

Family

ID=25150710

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8618672A Expired GB2181981B (en) 1985-10-23 1986-07-31 Device for removing or installing components from a printed circuit board or the like including improved nozzle for use therewith

Country Status (6)

Country Link
JP (1) JPS62113497A (fr)
CA (1) CA1293653C (fr)
DE (1) DE3624728A1 (fr)
FR (1) FR2589029B1 (fr)
GB (1) GB2181981B (fr)
IT (1) IT1209978B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4787548A (en) * 1987-07-27 1988-11-29 Pace Incorporated Nozzle structure for soldering and desoldering
ATE90247T1 (de) * 1987-08-31 1993-06-15 Siemens Ag Loetkopf zum ein- oder ausloeten von bauelementen mittels einer beheizung durch heissgas, insbesondere fuer oberflaechenmontierbare bauelemente (smd).
ATE90248T1 (de) * 1989-09-29 1993-06-15 Siemens Nixdorf Inf Syst Loetvorrichtung zum aufloeten von bauelementen auf leiterplatten.
DE9113986U1 (de) * 1991-11-11 1992-04-16 Zevac Auslötsysteme GmbH, 3548 Arolsen Lötvorrichtung zum Ein- und Auslöten von elektrischen Bauelementen
JP2714520B2 (ja) * 1992-08-28 1998-02-16 株式会社日立製作所 実装部品着脱装置
DE4345109C2 (de) * 1993-12-28 2002-10-24 Finetech Ges Fuer Elektronik T Werkzeug zum Löten und Entlöten von Lötstellen einer Sockelfassung eines vielpoligen integrierten Schaltkreises
DE4422341C2 (de) * 1994-06-27 1997-03-06 Martin Umwelt & Energietech Löteinrichtung
JP2018535914A (ja) * 2015-10-30 2018-12-06 コーニング インコーポレイテッド ３ｄ形状のガラス系物品、それを製造する方法及び装置
CN115365600B (zh) * 2022-09-16 2023-09-15 李文雄 一种用于电路板芯片的焊拆装置及焊拆方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
GB2154921A (en) * 1984-02-24 1985-09-18 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3718800A (en) * 1968-03-05 1973-02-27 Argus Eng Co Infrared heating apparatus
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
JPS5873189A (ja) * 1981-10-27 1983-05-02 富士通株式会社 電子部品自動取外し装置の熱風ノズルユニツトの構造
DE8334840U1 (de) * 1983-12-05 1984-03-22 Cooper Industries, Inc., 77210 Houston, Tex. Loetgeraet zum befestigen von elektrischen und elektronischen bauteilen auf leiterplatten
FR2573950B3 (fr) * 1984-11-27 1987-06-19 Matra Procede et dispositif d'extraction de composants electroniques soudes
JPS61141197A (ja) * 1984-12-14 1986-06-28 富士通株式会社 フラツトリ−ド形電子部品の取外し方法及びその装置
JPS6285494A (ja) * 1985-10-09 1987-04-18 株式会社日立製作所 部品取り外し装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
GB2154921A (en) * 1984-02-24 1985-09-18 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate

Also Published As

Publication number Publication date
JPS62113497A (ja) 1987-05-25
GB8618672D0 (en) 1986-09-10
IT8648369A0 (it) 1986-08-07
GB2181981A (en) 1987-05-07
FR2589029B1 (fr) 1995-06-23
CA1293653C (fr) 1991-12-31
IT1209978B (it) 1989-08-30
FR2589029A1 (fr) 1987-04-24
DE3624728A1 (de) 1987-04-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960731