HU188635B - Apparatus for reactive application of layer with plasmatrone - Google Patents

Apparatus for reactive application of layer with plasmatrone Download PDF

Info

Publication number
HU188635B
HU188635B HU66480A HU66480A HU188635B HU 188635 B HU188635 B HU 188635B HU 66480 A HU66480 A HU 66480A HU 66480 A HU66480 A HU 66480A HU 188635 B HU188635 B HU 188635B
Authority
HU
Hungary
Prior art keywords
coated
objects
wall
plasmatron
electrically conductive
Prior art date
Application number
HU66480A
Other languages
English (en)
Hungarian (hu)
Inventor
Harald Bilz
Ulrich Heisig
Siegfried Schiller
Klaus Goedicke
Karl Steinfelder
Johannes Struempel
Juergen Henneberger
Ingo Steinhauer
Original Assignee
Kombinat Veb Keramische Werke Hermsdorf,Dd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kombinat Veb Keramische Werke Hermsdorf,Dd filed Critical Kombinat Veb Keramische Werke Hermsdorf,Dd
Publication of HU188635B publication Critical patent/HU188635B/hu

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Physical Vapour Deposition (AREA)
HU66480A 1979-03-22 1980-03-20 Apparatus for reactive application of layer with plasmatrone HU188635B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD21173979A DD142568A1 (de) 1979-03-22 1979-03-22 EINRICHTUNG ZUM REAKTIVEN BESCHICHTEN MIT DEM PLASM&TRON

Publications (1)

Publication Number Publication Date
HU188635B true HU188635B (en) 1986-05-28

Family

ID=5517280

Family Applications (1)

Application Number Title Priority Date Filing Date
HU66480A HU188635B (en) 1979-03-22 1980-03-20 Apparatus for reactive application of layer with plasmatrone

Country Status (2)

Country Link
DD (1) DD142568A1 (de)
HU (1) HU188635B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3272669D1 (en) * 1982-03-18 1986-09-25 Ibm Deutschland Plasma-reactor and its use in etching and coating substrates
US4428812A (en) * 1983-04-04 1984-01-31 Borg-Warner Corporation Rapid rate reactive sputtering of metallic compounds
US4428811A (en) * 1983-04-04 1984-01-31 Borg-Warner Corporation Rapid rate reactive sputtering of a group IVb metal
DE3331707A1 (de) * 1983-09-02 1985-03-21 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern
DE3503398A1 (de) * 1985-02-01 1986-08-07 W.C. Heraeus Gmbh, 6450 Hanau Sputteranlage zum reaktiven beschichten eines substrates mit hartstoffen
DE3503397A1 (de) * 1985-02-01 1986-08-07 W.C. Heraeus Gmbh, 6450 Hanau Sputteranlage zum reaktiven beschichten eines substrates mit hartstoffen
DE3521053A1 (de) * 1985-06-12 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum aufbringen duenner schichten auf ein substrat
NL9002176A (nl) * 1990-10-08 1992-05-06 Philips Nv Werkwijze voor het verminderen van deeltjescontaminatie tijdens sputteren en een sputterinrichting voor gebruik van een dergelijke werkwijze.

Also Published As

Publication number Publication date
DD142568A1 (de) 1980-07-02

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