ID20988A - Pengemas berongga dan metode pembuatannya serta aparat pembayang keadaan padat yang terpasang pada pengemas berongga tersebut - Google Patents

Pengemas berongga dan metode pembuatannya serta aparat pembayang keadaan padat yang terpasang pada pengemas berongga tersebut

Info

Publication number
ID20988A
ID20988A IDP980977A ID980977A ID20988A ID 20988 A ID20988 A ID 20988A ID P980977 A IDP980977 A ID P980977A ID 980977 A ID980977 A ID 980977A ID 20988 A ID20988 A ID 20988A
Authority
ID
Indonesia
Prior art keywords
packager
successed
bearing
making
well
Prior art date
Application number
IDP980977A
Other languages
English (en)
Inventor
Keiji Sasano
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of ID20988A publication Critical patent/ID20988A/id

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
IDP980977A 1997-07-10 1998-07-09 Pengemas berongga dan metode pembuatannya serta aparat pembayang keadaan padat yang terpasang pada pengemas berongga tersebut ID20988A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9185091A JPH1131751A (ja) 1997-07-10 1997-07-10 中空パッケージとその製造方法

Publications (1)

Publication Number Publication Date
ID20988A true ID20988A (id) 1999-04-01

Family

ID=16164691

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP980977A ID20988A (id) 1997-07-10 1998-07-09 Pengemas berongga dan metode pembuatannya serta aparat pembayang keadaan padat yang terpasang pada pengemas berongga tersebut

Country Status (3)

Country Link
US (1) US6313525B1 (id)
JP (1) JPH1131751A (id)
ID (1) ID20988A (id)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531334B2 (en) * 1997-07-10 2003-03-11 Sony Corporation Method for fabricating hollow package with a solid-state image device
JPH11289023A (ja) * 1998-04-02 1999-10-19 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP3459787B2 (ja) * 1999-04-02 2003-10-27 Ｎｅｃ化合物デバイス株式会社 光半導体モジュール及びその製造方法
TW511264B (en) * 1999-02-18 2002-11-21 Seiko Epson Corp Semiconductor device, mounting substrate and its manufacturing method, circuit substrate and electronic machine
JP2001196488A (ja) * 1999-10-26 2001-07-19 Nec Corp 電子部品装置及びその製造方法
JP3496633B2 (ja) * 2000-10-05 2004-02-16 日本電気株式会社 ヒートシンク及びこれを用いた電源ユニット
JP4565728B2 (ja) * 2000-10-10 2010-10-20 三洋電機株式会社 中空気密パッケージ型の半導体装置
JP4565727B2 (ja) * 2000-10-10 2010-10-20 三洋電機株式会社 半導体装置の製造方法
US7012315B1 (en) * 2000-11-01 2006-03-14 Micron Technology, Inc. Frame scale package using contact lines through the elements
AU2002217987A1 (en) 2000-12-01 2002-06-11 Broadcom Corporation Thermally and electrically enhanced ball grid array packaging
US6906414B2 (en) * 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US20020079572A1 (en) * 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
JP2002246650A (ja) * 2001-02-13 2002-08-30 Agilent Technologies Japan Ltd 発光ダイオード及びその製造方法
US6853070B2 (en) 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
JP2002372473A (ja) * 2001-04-12 2002-12-26 Fuji Electric Co Ltd 半導体センサ収納容器およびその製造方法、並びに半導体センサ装置
US7259448B2 (en) * 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
JP2002368028A (ja) * 2001-06-13 2002-12-20 Nec Corp 半導体パッケージ及びその製造方法
US6730536B1 (en) * 2001-06-28 2004-05-04 Amkor Technology, Inc. Pre-drilled image sensor package fabrication method
US6559512B2 (en) * 2001-08-02 2003-05-06 Harvatek Corp. Adjustable in-line leads for light emitting device package
JP3773177B2 (ja) * 2001-11-30 2006-05-10 松下電器産業株式会社 固体撮像装置およびその製造方法
US6879039B2 (en) 2001-12-18 2005-04-12 Broadcom Corporation Ball grid array package substrates and method of making the same
US7550845B2 (en) * 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US7245500B2 (en) * 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US6825108B2 (en) 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6876553B2 (en) 2002-03-21 2005-04-05 Broadcom Corporation Enhanced die-up ball grid array package with two substrates
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
JP4134695B2 (ja) * 2002-11-21 2008-08-20 住友電気工業株式会社 光モジュール
US20040113221A1 (en) * 2002-12-16 2004-06-17 Jackson Hsieh Injection molded image sensor and a method for manufacturing the same
JP2004312666A (ja) * 2003-03-25 2004-11-04 Fuji Photo Film Co Ltd 固体撮像装置及び固体撮像装置の製造方法
US20040245589A1 (en) * 2003-06-05 2004-12-09 Jackson Hsieh Substrate structure for a photosensitive chip package
US20040245590A1 (en) * 2003-06-05 2004-12-09 Jackson Hsieh Image sensor package
JP3996904B2 (ja) * 2004-01-27 2007-10-24 松下電器産業株式会社 電子素子用の表面実装ベース
US7411281B2 (en) 2004-06-21 2008-08-12 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7432586B2 (en) 2004-06-21 2008-10-07 Broadcom Corporation Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
US7482686B2 (en) 2004-06-21 2009-01-27 Braodcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
CN1885909A (zh) * 2005-06-24 2006-12-27 鸿富锦精密工业（深圳）有限公司 数码相机模块
CN100517738C (zh) * 2005-07-15 2009-07-22 鸿富锦精密工业（深圳）有限公司 影像感测芯片的封装结构
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
US8183680B2 (en) 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
WO2008073485A2 (en) * 2006-12-12 2008-06-19 Quantum Leap Packaging, Inc. Plastic electronic component package
US20080165257A1 (en) * 2007-01-05 2008-07-10 Micron Technology, Inc. Configurable pixel array system and method
US7812869B2 (en) * 2007-05-11 2010-10-12 Aptina Imaging Corporation Configurable pixel array system and method
US8030752B2 (en) * 2007-12-18 2011-10-04 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing semiconductor package and semiconductor plastic package using the same
US8415703B2 (en) * 2008-03-25 2013-04-09 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
US20100052005A1 (en) * 2008-03-25 2010-03-04 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and conductive trace
US20090284932A1 (en) * 2008-03-25 2009-11-19 Bridge Semiconductor Corporation Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
US8525214B2 (en) 2008-03-25 2013-09-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with thermal via
US8129742B2 (en) 2008-03-25 2012-03-06 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and plated through-hole
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
US9018667B2 (en) * 2008-03-25 2015-04-28 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and dual adhesives
US20110278638A1 (en) 2008-03-25 2011-11-17 Lin Charles W C Semiconductor chip assembly with post/dielectric/post heat spreader
US8067784B2 (en) * 2008-03-25 2011-11-29 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and substrate
US8531024B2 (en) * 2008-03-25 2013-09-10 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
US7948076B2 (en) * 2008-03-25 2011-05-24 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and vertical signal routing
US20110163348A1 (en) * 2008-03-25 2011-07-07 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump
US8148747B2 (en) * 2008-03-25 2012-04-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/cap heat spreader
US8203167B2 (en) * 2008-03-25 2012-06-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
US8288792B2 (en) * 2008-03-25 2012-10-16 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/post heat spreader
US20110156090A1 (en) * 2008-03-25 2011-06-30 Lin Charles W C Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts
US8314438B2 (en) * 2008-03-25 2012-11-20 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and cavity in bump
US8354688B2 (en) 2008-03-25 2013-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
US8269336B2 (en) * 2008-03-25 2012-09-18 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and signal post
US8324723B2 (en) * 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US8310043B2 (en) * 2008-03-25 2012-11-13 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with ESD protection layer
US8193556B2 (en) * 2008-03-25 2012-06-05 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and cavity in post
US8329510B2 (en) * 2008-03-25 2012-12-11 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
US8232576B1 (en) 2008-03-25 2012-07-31 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and ceramic block in post
US8212279B2 (en) * 2008-03-25 2012-07-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader, signal post and cavity
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post
US20100072511A1 (en) * 2008-03-25 2010-03-25 Lin Charles W C Semiconductor chip assembly with copper/aluminum post/base heat spreader
US8378372B2 (en) * 2008-03-25 2013-02-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
KR100992778B1 (ko) * 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US8324653B1 (en) 2009-08-06 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with ceramic/metal substrate
TW201115775A (en) * 2009-10-19 2011-05-01 Everlight Electronics Co Ltd Light emitting diode package structure
JP5416546B2 (ja) 2009-10-23 2014-02-12 日東電工株式会社 透明基板
JP2012104804A (ja) * 2010-10-15 2012-05-31 Seiko Instruments Inc 電子部品、及び電子装置
CN102569594A (zh) * 2010-12-24 2012-07-11 展晶科技(深圳)有限公司 封装载体及采用该封装载体的发光二极管封装结构
JP5827476B2 (ja) * 2011-03-08 2015-12-02 株式会社東芝 半導体モジュール及びその製造方法
TWM440524U (en) * 2012-02-21 2012-11-01 Domintech Co Ltd Semiconductor package with a base
CN103836191A (zh) * 2012-11-27 2014-06-04 北京航天试验技术研究所 一种低温传感器密封方法
US9638596B2 (en) 2014-04-08 2017-05-02 Freescale Semiconductor, Inc. Cavity-down pressure sensor device
JP2017139258A (ja) * 2016-02-01 2017-08-10 ソニー株式会社 撮像素子パッケージ及び撮像装置
CN106252289B (zh) * 2016-09-29 2019-02-01 山东盛品电子技术有限公司 一种提高气密性的塑封管壳产品及制备方法
JP7299144B2 (ja) * 2019-11-27 2023-06-27 京セラ株式会社 配線基板、パッケージおよび電子部品
US20210391226A1 (en) * 2020-06-15 2021-12-16 Stmicroelectronics, Inc. Semiconductor device packages having cap with integrated electrical leads
JP7518395B2 (ja) * 2021-12-20 2024-07-18 日亜化学工業株式会社 回路基板、発光装置及びそれらの製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669842A (en) * 1979-11-09 1981-06-11 Fujitsu Ltd Manufacture of semiconductor device
JPS5695902A (en) * 1979-12-29 1981-08-03 Toyobo Co Ltd Uv-curable resin composition
JPS56169971A (en) * 1980-06-02 1981-12-26 Hitachi Ltd Solidstate image sensor
JPS58108282A (ja) * 1981-12-22 1983-06-28 Yokogawa Hokushin Electric Corp 紫外線照射による接着方法
JPS58140156A (ja) * 1982-02-16 1983-08-19 Canon Inc 固体撮像装置
US4572924A (en) * 1983-05-18 1986-02-25 Spectrum Ceramics, Inc. Electronic enclosures having metal parts
US4537863A (en) * 1983-08-10 1985-08-27 Nippon Electric Glass Company, Ltd. Low temperature sealing composition
JPS61194751A (ja) * 1985-02-25 1986-08-29 Hitachi Ltd 半導体装置
JPS6245154A (ja) * 1985-08-23 1987-02-27 Toshiba Corp セラミツクパツケ−ジ
JPS6365840A (ja) * 1986-04-04 1988-03-24 オリンパス光学工業株式会社 内視鏡
JPS62285456A (ja) * 1986-06-04 1987-12-11 Hitachi Cable Ltd ガラス封止型半導体装置用リ−ドフレ−ム
US4761518A (en) * 1987-01-20 1988-08-02 Olin Corporation Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
US4921748A (en) * 1988-11-28 1990-05-01 Armstrong World Industries, Inc. Fluorhectorite laminate printed circuit substrate
DE69006609T2 (de) * 1989-03-15 1994-06-30 Ngk Insulators Ltd Keramischer Deckel zum Verschliessen eines Halbleiterelements und Verfahren zum Verschliessen eines Halbleiterelements in einer keramischen Packung.
DE69009958T2 (de) * 1989-12-19 1994-09-22 Fujitsu Ltd Adhäsionsstruktur für Halbleiterbauelement und Verfahren zu ihrer Herstellung.
US5278429A (en) * 1989-12-19 1994-01-11 Fujitsu Limited Semiconductor device having improved adhesive structure and method of producing same
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
JP2843464B2 (ja) * 1992-09-01 1999-01-06 シャープ株式会社 固体撮像装置
US5796714A (en) * 1994-09-28 1998-08-18 Matsushita Electric Industrial Co., Ltd. Optical module having a vertical-cavity surface-emitting laser
JP3054576B2 (ja) * 1995-04-26 2000-06-19 シャープ株式会社 半導体装置

Also Published As

Publication number Publication date
US6313525B1 (en) 2001-11-06
JPH1131751A (ja) 1999-02-02

Similar Documents

Publication Publication Date Title
ID20988A (id) Pengemas berongga dan metode pembuatannya serta aparat pembayang keadaan padat yang terpasang pada pengemas berongga tersebut
ID21319A (id) Metode penggulungan stator dan susunan gulungan stator
DE69828678D1 (de) Dynamisches Fluidlager
ID23978A (id) Turunan-turunan tienopirimidin dan tienopiridin yang berguna sebagai zat-zat anti kangker
ID23985A (id) Baterai dan metode pembuatannya
ID30472A (id) Metode pembuatan pelapis asap rendah dan pelapis serta benda-benda terlapis yang dibuatnya
ID20186A (id) Mentega kacang dan produk-produk yang berkaitan serta metode pembuatannya
DE69830639D1 (de) Dynamische gasdrucklagervorrichtung und herstellungsverfahren davon
DE69732700D1 (de) Sphärisches elastomerlager
ID29543A (id) TURUNAN-TURUNAN OKSAZOL DAN TIAZOL YANG DISUBSTITUSI SEBAGAI AKTIVATOR-AKTIVATOR τhPPAR DAN αhPPAR
ID22708A (id) Perangkai gen dan metodanya
ID23439A (id) Turunan-turunan 3-piperidil-4-oksokuinazolin dan komposisi-komposisi farmasi yang sama
ID22782A (id) Perenggang baterai dan metoda pembuatannya
FI981506L (fi) Elastomeerikompositio ja sen valmistusmenetelmä
TR199800103A3 (tr) Elastomerik malzemelerde silika dagilimi ve yapismasinin gelistirilmesi.
GB0025319D0 (en) Rolling bearing and method of machining rolling element of the bearing
ID21764A (id) Komposisi-komposisi yang mengandung antijamur dan fosfolipid
DE69919612D1 (de) Wälzlager mit Dichtmittel und Drehgeschwindigkeitsmesser
ID20911A (id) Pak rokok serta metode dan peralatan untuk membuat pak rokok tersebut
GB2336600B (en) Rolling bearing and method of manufacturing the same
PT969849E (pt) Composicao solida estavel compreendendo vitamina d3 e fosfato de tricalcio
HUP0002623A3 (en) Dielectrokinetic sensor and method of its application
ID24810A (id) Turunan-turunan isoquinolin tersubstitusi dan penggunaannya sebagai anti-kejang
AU5588299A (en) Elastomeric bearing and method of forming same
ID21289A (id) Metode perekatan dan peralatan daripadanya