IE801200L - Semiconductor manufacture - Google Patents

Semiconductor manufacture

Info

Publication number
IE801200L
IE801200L IE801200A IE120080A IE801200L IE 801200 L IE801200 L IE 801200L IE 801200 A IE801200 A IE 801200A IE 120080 A IE120080 A IE 120080A IE 801200 L IE801200 L IE 801200L
Authority
IE
Ireland
Prior art keywords
stage
bonding
pellets
iii
pellet
Prior art date
Application number
IE801200A
Other versions
IE49684B1 (en
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of IE801200L publication Critical patent/IE801200L/en
Publication of IE49684B1 publication Critical patent/IE49684B1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)

Abstract

A system for bonding pellets, for example semiconductor chips (1, 1n) to supports, for example lead frames (6), has a pellet supply stage (I), a bonding stage (II) and an intermediate stage (III). Pellets (1, 1n) are transferred from the supply stage (I) onto a table (3) of the intermediate stage (II). The position of the table (3) in the X-Y directions and the angular position of the X-Y plane are controlled by control means (13) to bring a pellet (1, 1n) on the table to a desired position for transfer to the bonding stage (III) for bonding to a support (6). <IMAGE> [GB2056766A]
IE1200/80A 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports IE49684B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Publications (2)

Publication Number Publication Date
IE801200L true IE801200L (en) 1980-12-12
IE49684B1 IE49684B1 (en) 1985-11-27

Family

ID=13526306

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1200/80A IE49684B1 (en) 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports

Country Status (3)

Country Link
JP (1) JPS55165643A (en)
GB (1) GB2056766B (en)
IE (1) IE49684B1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device
JPS61112336A (en) * 1984-11-07 1986-05-30 Nec Corp Die bonder
JPH0519953Y2 (en) * 1985-06-26 1993-05-25
JPS6237942A (en) * 1985-08-13 1987-02-18 Matsushita Electronics Corp Pellet positioning apparatus
JPS6362241A (en) * 1986-09-02 1988-03-18 Toshiba Corp Wire bonding method
JPS62162335A (en) * 1986-11-07 1987-07-18 Toshiba Seiki Kk Bonding device for semiconductor pellet
KR910006367B1 (en) * 1987-07-09 1991-08-21 스미도모덴기고오교오 가부시기가이샤 Chip fixing tape
CH676695A5 (en) * 1988-05-19 1991-02-28 Bobst Sa
JPH027992A (en) * 1988-06-27 1990-01-11 Brother Ind Ltd Pattern registering machine
NL8900388A (en) * 1989-02-17 1990-09-17 Philips Nv METHOD FOR JOINING TWO OBJECTS
JPH02239637A (en) * 1989-03-14 1990-09-21 Nec Corp Manufacturing device for semiconductor device
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH0450517U (en) * 1990-09-05 1992-04-28
JPH0521544A (en) * 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd Method and apparatus for measuring semiconductor device with bump
DE4228012C2 (en) * 1992-08-24 1996-08-22 Siemens Ag Method for spacing two components
JP2007158102A (en) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd Bonding equipment
WO2009072659A1 (en) * 2007-12-03 2009-06-11 Panasonic Corporation Chip mounting system
JP5065969B2 (en) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ Component mounting equipment
CN116387209B (en) * 2023-06-06 2023-09-05 北京中科同志科技股份有限公司 Chip packaging system and chip packaging method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (en) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Also Published As

Publication number Publication date
GB2056766A (en) 1981-03-18
GB2056766B (en) 1984-04-26
JPS6318326B2 (en) 1988-04-18
JPS55165643A (en) 1980-12-24
IE49684B1 (en) 1985-11-27

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Legal Events

Date Code Title Description
MM4A Patent lapsed