JPS52149070A - Locating and inspecting method for semiconductor parts and die bonding device using the same - Google Patents

Locating and inspecting method for semiconductor parts and die bonding device using the same

Info

Publication number
JPS52149070A
JPS52149070A JP6560876A JP6560876A JPS52149070A JP S52149070 A JPS52149070 A JP S52149070A JP 6560876 A JP6560876 A JP 6560876A JP 6560876 A JP6560876 A JP 6560876A JP S52149070 A JPS52149070 A JP S52149070A
Authority
JP
Japan
Prior art keywords
locating
same
die bonding
bonding device
inspecting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6560876A
Other languages
Japanese (ja)
Other versions
JPS5520378B2 (en
Inventor
Nobushi Suzuki
Tatsu Yasue
Tomio Kashihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6560876A priority Critical patent/JPS52149070A/en
Priority to US05/804,441 priority patent/US4200393A/en
Publication of JPS52149070A publication Critical patent/JPS52149070A/en
Publication of JPS5520378B2 publication Critical patent/JPS5520378B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform location and inspection in good order based on the entire information obtained by scanning an optical image formed on a plane on which photo electric converting elements are arranged in the form of a matrix.
COPYRIGHT: (C)1977,JPO&Japio
JP6560876A 1976-06-07 1976-06-07 Locating and inspecting method for semiconductor parts and die bonding device using the same Granted JPS52149070A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6560876A JPS52149070A (en) 1976-06-07 1976-06-07 Locating and inspecting method for semiconductor parts and die bonding device using the same
US05/804,441 US4200393A (en) 1976-06-07 1977-06-07 Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6560876A JPS52149070A (en) 1976-06-07 1976-06-07 Locating and inspecting method for semiconductor parts and die bonding device using the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP16270379A Division JPS55108745A (en) 1979-12-17 1979-12-17 Die-bonding device

Publications (2)

Publication Number Publication Date
JPS52149070A true JPS52149070A (en) 1977-12-10
JPS5520378B2 JPS5520378B2 (en) 1980-06-02

Family

ID=13291885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6560876A Granted JPS52149070A (en) 1976-06-07 1976-06-07 Locating and inspecting method for semiconductor parts and die bonding device using the same

Country Status (1)

Country Link
JP (1) JPS52149070A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158874A (en) * 1978-06-06 1979-12-15 Matsushita Electronics Corp Dies bonding unit
JPS5570041A (en) * 1978-11-21 1980-05-27 Toshiba Corp Apparatus for fabricating semiconductor device
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
JPS5823448A (en) * 1981-08-05 1983-02-12 Nec Corp Recognition system for pellet positioning
JPS58121637A (en) * 1982-01-13 1983-07-20 Fuji Electric Co Ltd Tracking method for semiconductor chip
JPS58165335A (en) * 1982-03-26 1983-09-30 Nec Corp Method and apparatus for manufacturing semiconductor device using tape carrier system
JPS5926245U (en) * 1982-08-10 1984-02-18 日本電気株式会社 Semiconductor pellet mounting equipment
JP2007141980A (en) * 2005-11-16 2007-06-07 Nidec Tosok Corp Bonding apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6272676B2 (en) * 2013-11-07 2018-01-31 東レエンジニアリング株式会社 Bonding equipment
US11138746B2 (en) 2017-07-03 2021-10-05 Ricoh Company, Ltd. Diagnostic support system and diagnostic support method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158874A (en) * 1978-06-06 1979-12-15 Matsushita Electronics Corp Dies bonding unit
JPS5570041A (en) * 1978-11-21 1980-05-27 Toshiba Corp Apparatus for fabricating semiconductor device
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
JPS5823448A (en) * 1981-08-05 1983-02-12 Nec Corp Recognition system for pellet positioning
JPS58121637A (en) * 1982-01-13 1983-07-20 Fuji Electric Co Ltd Tracking method for semiconductor chip
JPS58165335A (en) * 1982-03-26 1983-09-30 Nec Corp Method and apparatus for manufacturing semiconductor device using tape carrier system
JPS5926245U (en) * 1982-08-10 1984-02-18 日本電気株式会社 Semiconductor pellet mounting equipment
JP2007141980A (en) * 2005-11-16 2007-06-07 Nidec Tosok Corp Bonding apparatus

Also Published As

Publication number Publication date
JPS5520378B2 (en) 1980-06-02

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