JPS55165643A - Device for bonding pellet - Google Patents

Device for bonding pellet

Info

Publication number
JPS55165643A
JPS55165643A JP7371979A JP7371979A JPS55165643A JP S55165643 A JPS55165643 A JP S55165643A JP 7371979 A JP7371979 A JP 7371979A JP 7371979 A JP7371979 A JP 7371979A JP S55165643 A JPS55165643 A JP S55165643A
Authority
JP
Japan
Prior art keywords
pellet
pedestal
reference position
relaying
picture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7371979A
Other languages
Japanese (ja)
Other versions
JPS6318326B2 (en
Inventor
Kyohei Tamaki
Naoki Sugao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7371979A priority Critical patent/JPS55165643A/en
Priority to GB8018970A priority patent/GB2056766B/en
Priority to IE1200/80A priority patent/IE49684B1/en
Publication of JPS55165643A publication Critical patent/JPS55165643A/en
Publication of JPS6318326B2 publication Critical patent/JPS6318326B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To protect the edges of a pellet from damage, by optically detecting the position of the pellet on a pedestal in a relaying position, calculating the deviation from a reference position to correct the position of the pedestal to adjust the position of the pellet without touching it.
CONSTITUTION: A TV camera 9 is accurately placed in a reference position just over a relaying pedestal 3 to take a picture of a pellet 1' conveyed onto the pedestal by a chuck 7. A signal based on the picture is converted into a binary code at 10 and then applied to a central processing unit 11. The reference position is set at 12 and compared with the binary-coded signal 10 by the central processing unit which calculates the difference. Units 13W15 are driven by a signal corresponding to the difference to displace the pedestal 3 in directions X, Y, O to position the pellet 1' without damaging it. The positioned pellet is conveyed to a bonding position by a collet 8 and bonded to a support 6. According to this constitution, the pellet is positioned without being damaged, the reference position and dimensions of the pellet can be accurately and quickly altered by a position setting unit 12 and the flexibility of equipment is enhanced.
COPYRIGHT: (C)1980,JPO&Japio
JP7371979A 1979-06-12 1979-06-12 Device for bonding pellet Granted JPS55165643A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet
GB8018970A GB2056766B (en) 1979-06-12 1980-06-10 Systems for bonding pellets for exaple semiconductor chips to supports
IE1200/80A IE49684B1 (en) 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Publications (2)

Publication Number Publication Date
JPS55165643A true JPS55165643A (en) 1980-12-24
JPS6318326B2 JPS6318326B2 (en) 1988-04-18

Family

ID=13526306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7371979A Granted JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Country Status (3)

Country Link
JP (1) JPS55165643A (en)
GB (1) GB2056766B (en)
IE (1) IE49684B1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device
JPS61112336A (en) * 1984-11-07 1986-05-30 Nec Corp Die bonder
JPS625639U (en) * 1985-06-26 1987-01-14
JPS6237942A (en) * 1985-08-13 1987-02-18 Matsushita Electronics Corp Pellet positioning apparatus
JPS62162335A (en) * 1986-11-07 1987-07-18 Toshiba Seiki Kk Bonding device for semiconductor pellet
JPH02239637A (en) * 1989-03-14 1990-09-21 Nec Corp Manufacturing device for semiconductor device
JP2007158102A (en) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd Bonding equipment
JP2009246285A (en) * 2008-03-31 2009-10-22 Hitachi High-Tech Instruments Co Ltd Component mounting apparatus
CN116387209A (en) * 2023-06-06 2023-07-04 北京中科同志科技股份有限公司 Chip packaging system and chip packaging method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS6362241A (en) * 1986-09-02 1988-03-18 Toshiba Corp Wire bonding method
KR910006367B1 (en) * 1987-07-09 1991-08-21 스미도모덴기고오교오 가부시기가이샤 Chip fixing tape
CH676695A5 (en) * 1988-05-19 1991-02-28 Bobst Sa
JPH027992A (en) * 1988-06-27 1990-01-11 Brother Ind Ltd Pattern registering machine
NL8900388A (en) * 1989-02-17 1990-09-17 Philips Nv METHOD FOR JOINING TWO OBJECTS
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH0450517U (en) * 1990-09-05 1992-04-28
JPH0521544A (en) * 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd Method and apparatus for measuring semiconductor device with bump
DE4228012C2 (en) * 1992-08-24 1996-08-22 Siemens Ag Method for spacing two components
US8215005B2 (en) 2007-12-03 2012-07-10 Panasonic Corporation Chip mounting system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (en) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (en) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device
JPS61112336A (en) * 1984-11-07 1986-05-30 Nec Corp Die bonder
JPS625639U (en) * 1985-06-26 1987-01-14
JPS6237942A (en) * 1985-08-13 1987-02-18 Matsushita Electronics Corp Pellet positioning apparatus
JPS62162335A (en) * 1986-11-07 1987-07-18 Toshiba Seiki Kk Bonding device for semiconductor pellet
JPH02239637A (en) * 1989-03-14 1990-09-21 Nec Corp Manufacturing device for semiconductor device
JP2007158102A (en) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd Bonding equipment
JP2009246285A (en) * 2008-03-31 2009-10-22 Hitachi High-Tech Instruments Co Ltd Component mounting apparatus
CN116387209A (en) * 2023-06-06 2023-07-04 北京中科同志科技股份有限公司 Chip packaging system and chip packaging method
CN116387209B (en) * 2023-06-06 2023-09-05 北京中科同志科技股份有限公司 Chip packaging system and chip packaging method

Also Published As

Publication number Publication date
GB2056766B (en) 1984-04-26
IE49684B1 (en) 1985-11-27
JPS6318326B2 (en) 1988-04-18
IE801200L (en) 1980-12-12
GB2056766A (en) 1981-03-18

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