IL214488A - Detecting defects on a wafer - Google Patents

Detecting defects on a wafer

Info

Publication number
IL214488A
IL214488A IL214488A IL21448811A IL214488A IL 214488 A IL214488 A IL 214488A IL 214488 A IL214488 A IL 214488A IL 21448811 A IL21448811 A IL 21448811A IL 214488 A IL214488 A IL 214488A
Authority
IL
Israel
Prior art keywords
detecting chip
chip defects
defects
detecting
chip
Prior art date
Application number
IL214488A
Other languages
English (en)
Hebrew (he)
Other versions
IL214488A0 (en
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL214488A0 publication Critical patent/IL214488A0/en
Publication of IL214488A publication Critical patent/IL214488A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
IL214488A 2009-02-13 2011-08-07 Detecting defects on a wafer IL214488A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15247709P 2009-02-13 2009-02-13
PCT/US2010/023802 WO2010093733A2 (fr) 2009-02-13 2010-02-10 Détection des défauts sur une tranche

Publications (2)

Publication Number Publication Date
IL214488A0 IL214488A0 (en) 2011-09-27
IL214488A true IL214488A (en) 2016-04-21

Family

ID=42562263

Family Applications (1)

Application Number Title Priority Date Filing Date
IL214488A IL214488A (en) 2009-02-13 2011-08-07 Detecting defects on a wafer

Country Status (7)

Country Link
EP (1) EP2396815A4 (fr)
JP (1) JP5570530B2 (fr)
KR (1) KR101674698B1 (fr)
CN (1) CN102396058B (fr)
IL (1) IL214488A (fr)
SG (1) SG173586A1 (fr)
WO (1) WO2010093733A2 (fr)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
WO2008086282A2 (fr) 2007-01-05 2008-07-17 Kla-Tencor Corporation Procédés et systèmes pour utiliser des informations électriques dans le cadre de la fabrication d'un dispositif sur une tranche afin d'accomplir une ou plusieurs fonctions liées à des défauts
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101729669B1 (ko) 2008-07-28 2017-04-24 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
JP2012119512A (ja) * 2010-12-01 2012-06-21 Hitachi High-Technologies Corp 基板の品質評価方法及びその装置
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) * 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9092846B2 (en) 2013-02-01 2015-07-28 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US9355208B2 (en) 2013-07-08 2016-05-31 Kla-Tencor Corp. Detecting defects on a wafer
US10338004B2 (en) * 2014-03-27 2019-07-02 KLA—Tencor Corp. Production sample shaping that preserves re-normalizability
US9535010B2 (en) * 2014-05-15 2017-01-03 Kla-Tencor Corp. Defect sampling for electron beam review based on defect attributes from optical inspection and optical review
US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US10267746B2 (en) * 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
US9518934B2 (en) * 2014-11-04 2016-12-13 Kla-Tencor Corp. Wafer defect discovery
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10062543B2 (en) * 2015-06-23 2018-08-28 Kla-Tencor Corp. Determining multi-patterning step overlay error
CN108475422B (zh) * 2015-08-12 2019-09-06 科磊股份有限公司 在电子束图像中确定缺陷的位置
US10535131B2 (en) * 2015-11-18 2020-01-14 Kla-Tencor Corporation Systems and methods for region-adaptive defect detection
CN105699396A (zh) * 2016-03-29 2016-06-22 同高先进制造科技（太仓）有限公司 基于光扫描的焊接激光头保护镜污染检测装置及方法
US10699926B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corp. Identifying nuisances and defects of interest in defects detected on a wafer
US11114324B2 (en) * 2019-04-10 2021-09-07 KLA Corp. Defect candidate generation for inspection

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07159337A (ja) * 1993-12-07 1995-06-23 Sony Corp 半導体素子の欠陥検査方法
JP3524853B2 (ja) * 1999-08-26 2004-05-10 株式会社ナノジオメトリ研究所 パターン検査装置、パターン検査方法および記録媒体
KR100335491B1 (ko) * 1999-10-13 2002-05-04 윤종용 공정 파라미터 라이브러리를 내장한 웨이퍼 검사장비 및 웨이퍼 검사시의 공정 파라미터 설정방법
CN100428277C (zh) * 1999-11-29 2008-10-22 奥林巴斯光学工业株式会社 缺陷检查系统
TWI256468B (en) * 2000-10-02 2006-06-11 Applied Materials Inc Defect source identifier
US7693323B2 (en) * 2002-03-12 2010-04-06 Applied Materials, Inc. Multi-detector defect detection system and a method for detecting defects
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
KR20060075691A (ko) * 2004-12-29 2006-07-04 삼성전자주식회사 결함 검사 방법
JP2007147376A (ja) * 2005-11-25 2007-06-14 Nikon Corp 検査装置
JP4851960B2 (ja) * 2006-02-24 2012-01-11 株式会社日立ハイテクノロジーズ 異物検査方法、および異物検査装置
JP2007298284A (ja) * 2006-04-27 2007-11-15 Mitsui Mining & Smelting Co Ltd ６価クロムの定量法
JP4641278B2 (ja) * 2006-05-02 2011-03-02 リンナイ株式会社 ガスバーナ
US8611639B2 (en) * 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
JP5022191B2 (ja) * 2007-11-16 2012-09-12 株式会社日立ハイテクノロジーズ 欠陥検査方法及び欠陥検査装置

Also Published As

Publication number Publication date
CN102396058B (zh) 2014-08-20
JP2012518278A (ja) 2012-08-09
JP5570530B2 (ja) 2014-08-13
EP2396815A4 (fr) 2012-11-28
WO2010093733A3 (fr) 2010-10-28
EP2396815A2 (fr) 2011-12-21
SG173586A1 (en) 2011-09-29
KR101674698B1 (ko) 2016-11-09
WO2010093733A2 (fr) 2010-08-19
IL214488A0 (en) 2011-09-27
KR20110124303A (ko) 2011-11-16
CN102396058A (zh) 2012-03-28

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Legal Events

Date Code Title Description
FF Patent granted
MM9K Patent not in force due to non-payment of renewal fees
NE Application for restoration - patent lapsed through non-payment of renewal fees (section 60, patents law, 5727-1967)
KB Patent renewed