IN2015MN00491A - - Google Patents

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Publication number
IN2015MN00491A
IN2015MN00491A IN491MUN2015A IN2015MN00491A IN 2015MN00491 A IN2015MN00491 A IN 2015MN00491A IN 491MUN2015 A IN491MUN2015 A IN 491MUN2015A IN 2015MN00491 A IN2015MN00491 A IN 2015MN00491A
Authority
IN
India
Prior art keywords
contact
terminal face
displacement
bead
compartment
Prior art date
Application number
Other languages
English (en)
Inventor
Carsten Nieland
Frank Kriebel
Original Assignee
Smartrac Technology Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac Technology Gmbh filed Critical Smartrac Technology Gmbh
Publication of IN2015MN00491A publication Critical patent/IN2015MN00491A/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
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    • H05K2203/04—Soldering or other types of metallurgic bonding
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
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    • H10W72/01215—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps forming coatings
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01253—Changing the shapes of bumps by etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
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    • H10W72/01931—Manufacture or treatment of bond pads using blanket deposition
    • H10W72/01933—Manufacture or treatment of bond pads using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01935—Manufacture or treatment of bond pads using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01931—Manufacture or treatment of bond pads using blanket deposition
    • H10W72/01938—Manufacture or treatment of bond pads using blanket deposition in gaseous form, e.g. by CVD or PVD
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    • H10W72/071—Connecting or disconnecting
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    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
IN491MUN2015 2012-08-10 2013-08-09 IN2015MN00491A (fr)

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DE102012015811 2012-08-10
PCT/DE2013/000451 WO2014023287A2 (fr) 2012-08-10 2013-08-09 Connexion de plots de contact et plot de contact et procédé d'obtention d'une connexion de plots de contact

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IN2015MN00491A true IN2015MN00491A (fr) 2015-09-04

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CN (1) CN104737286B (fr)
BR (1) BR112015002759B1 (fr)
CA (1) CA2880408A1 (fr)
DE (1) DE102013215771B4 (fr)
IN (1) IN2015MN00491A (fr)
MX (1) MX349946B (fr)
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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019224575A1 (fr) 2018-05-22 2019-11-28 Tyco Fire & Security Gmbh Étiquette souple allongée
US12223814B2 (en) 2019-09-16 2025-02-11 Sensormatic Electronics, LLC Security tag for textiles using conductive thread
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10970613B1 (en) 2019-09-18 2021-04-06 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US12470254B2 (en) 2019-10-03 2025-11-11 collectID AG Methods and systems for authenticating physical products via near field communication tags and recording authentication transactions on a blockchain
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US12524640B2 (en) 2019-11-27 2026-01-13 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
CN113345879B (zh) * 2021-05-31 2022-07-12 Tcl华星光电技术有限公司 微型led显示面板
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
US12536401B2 (en) 2022-08-31 2026-01-27 Sensormatic Electronics, LLC Security tag
WO2025247501A1 (fr) * 2024-05-31 2025-12-04 Assa Abloy Ab Circuit intégré ayant une unité de contact munie de piliers

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716336B2 (ja) * 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
JPH0870019A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd 電子部品の接続構造および接続方法
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
CN1151547C (zh) * 1997-07-15 2004-05-26 株式会社日立制作所 半导体装置制造方法
JPH11163036A (ja) * 1997-09-17 1999-06-18 Tamura Seisakusho Co Ltd バンプ形成方法、はんだ接合用前処理方法、はんだ接合方法、バンプ形成装置、はんだ接合用前処理装置およびはんだ接合装置
US6028436A (en) * 1997-12-02 2000-02-22 Micron Technology, Inc. Method for forming coaxial silicon interconnects
US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
JP2000114314A (ja) 1998-09-29 2000-04-21 Hitachi Ltd 半導体素子実装構造体およびその製造方法並びにｉｃカード
DE19905807A1 (de) * 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
US6537854B1 (en) * 1999-05-24 2003-03-25 Industrial Technology Research Institute Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
JP2001148401A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体装置およびその製造方法
DE10157205A1 (de) 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
JP3860088B2 (ja) * 2002-07-25 2006-12-20 Ｎｅｃエレクトロニクス株式会社 ボンディング方法及びボンディング装置
US7015590B2 (en) * 2003-01-10 2006-03-21 Samsung Electronics Co., Ltd. Reinforced solder bump structure and method for forming a reinforced solder bump
US8574959B2 (en) * 2003-11-10 2013-11-05 Stats Chippac, Ltd. Semiconductor device and method of forming bump-on-lead interconnection
JP2005197488A (ja) 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
US6977213B1 (en) * 2004-08-27 2005-12-20 Taiwan Semiconductor Manufacturing Company, Ltd. IC chip solder bump structure and method of manufacturing same
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法
DE102005012496B3 (de) 2005-03-16 2006-10-26 Technische Universität Berlin Vorrichtung mit einem auf einem Montageteil montierten elektronischen Bauteil und Verfahren
JP2006310477A (ja) 2005-04-27 2006-11-09 Akita Denshi Systems:Kk 半導体装置及びその製造方法
JP5117169B2 (ja) * 2007-04-06 2013-01-09 株式会社日立製作所 半導体装置
JP2009246166A (ja) * 2008-03-31 2009-10-22 Fujitsu Ltd 電子部品パッケージおよび基板ユニット並びにプリント配線板およびその製造方法
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices
US8766450B2 (en) * 2009-09-22 2014-07-01 Samsung Electro-Mechanics Co., Ltd. Lead pin for package substrate
US8409979B2 (en) * 2011-05-31 2013-04-02 Stats Chippac, Ltd. Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

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WO2014023287A2 (fr) 2014-02-13
KR20150053902A (ko) 2015-05-19
US10292270B2 (en) 2019-05-14
CN104737286A (zh) 2015-06-24
MY172360A (en) 2019-11-21
BR112015002759B1 (pt) 2021-11-03
EP2883245B1 (fr) 2020-09-30
JP6347781B2 (ja) 2018-06-27
US20150208508A1 (en) 2015-07-23
JP2015532780A (ja) 2015-11-12
WO2014023287A3 (fr) 2014-04-03
CN104737286B (zh) 2018-09-25
US20140084460A1 (en) 2014-03-27
EP2883245A2 (fr) 2015-06-17
CA2880408A1 (fr) 2014-02-13
MX2015001754A (es) 2015-09-16
BR112015002759A2 (pt) 2017-07-04
DE102013215771B4 (de) 2019-06-13
MX349946B (es) 2017-08-22
US9215809B2 (en) 2015-12-15
DE102013215771A1 (de) 2014-02-13

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