IT1060578B - Procediemnto per fabbricare elementi a semiconduttori - Google Patents

Procediemnto per fabbricare elementi a semiconduttori

Info

Publication number
IT1060578B
IT1060578B IT23255/76A IT2325576A IT1060578B IT 1060578 B IT1060578 B IT 1060578B IT 23255/76 A IT23255/76 A IT 23255/76A IT 2325576 A IT2325576 A IT 2325576A IT 1060578 B IT1060578 B IT 1060578B
Authority
IT
Italy
Prior art keywords
procedure
semiconductor elements
manufacturing semiconductor
manufacturing
elements
Prior art date
Application number
IT23255/76A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1060578B publication Critical patent/IT1060578B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/945—Special, e.g. metal
IT23255/76A 1975-05-20 1976-05-14 Procediemnto per fabbricare elementi a semiconduttori IT1060578B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2522346A DE2522346C3 (de) 1975-05-20 1975-05-20 Verfahren zum Herstellen von Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
IT1060578B true IT1060578B (it) 1982-08-20

Family

ID=5946996

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23255/76A IT1060578B (it) 1975-05-20 1976-05-14 Procediemnto per fabbricare elementi a semiconduttori

Country Status (7)

Country Link
US (1) US4047286A (it)
JP (1) JPS51142974A (it)
CA (1) CA1061013A (it)
DE (1) DE2522346C3 (it)
FR (1) FR2312116A1 (it)
GB (1) GB1477129A (it)
IT (1) IT1060578B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368008A (en) * 1976-11-30 1978-06-17 Hitachi Ltd B board k-charging system
JPS5368006A (en) * 1976-11-30 1978-06-17 Hitachi Ltd B board k-charging system
US4232059A (en) * 1979-06-06 1980-11-04 E-Systems, Inc. Process of defining film patterns on microelectronic substrates by air abrading
FR2480034A1 (fr) * 1980-04-04 1981-10-09 Thomson Csf Procede de fabrication et de montage d'une pastille semi-conductrice et structure obtenue
US4636073A (en) * 1984-10-31 1987-01-13 International Business Machines Corporation Universal calibration standard for surface inspection systems
US5170245A (en) * 1988-06-15 1992-12-08 International Business Machines Corp. Semiconductor device having metallic interconnects formed by grit blasting
US4896464A (en) * 1988-06-15 1990-01-30 International Business Machines Corporation Formation of metallic interconnects by grit blasting
US6686225B2 (en) * 2001-07-27 2004-02-03 Texas Instruments Incorporated Method of separating semiconductor dies from a wafer
US20080153265A1 (en) * 2006-12-21 2008-06-26 Texas Instruments Incorporated Semiconductor Device Manufactured Using an Etch to Separate Wafer into Dies and Increase Device Space on a Wafer
JP6302644B2 (ja) * 2013-11-11 2018-03-28 株式会社ディスコ ウェーハの加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3152939A (en) * 1960-08-12 1964-10-13 Westinghouse Electric Corp Process for preparing semiconductor members
FR1303118A (fr) * 1961-07-27 1962-09-07 Lignes Telegraph Telephon Perfectionnements aux procédés de fabrication des dispositifs à semi-conducteur
DE1514304A1 (de) * 1964-04-03 1969-05-14 Philco Ford Corp Halbleiteranordnung und Herstellungsverfahren hierfuer
DE1282794C2 (de) * 1965-04-01 1975-10-09 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer legierungsmaske fuer die gleichzeitige fertigung mehrerer halbleiteranordnungen
BE668918A (it) * 1965-08-27 1900-01-01
US3466510A (en) * 1967-01-07 1969-09-09 Telefunken Patent Integrated graetz rectifier circuit
CH465722A (de) * 1967-12-01 1968-11-30 Battelle Development Corp Verfahren zur Herstellung eines durch einen Markierungsstoff gebildeten Musters auf einer Unterlage
CH504783A (de) * 1969-06-20 1971-03-15 Siemens Ag Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens
FR2146929A1 (en) * 1971-07-26 1973-03-09 Silec Semi Conducteurs Semiconductor elements separation - from diffused semiconductor wafer,using solder as mask for etching and cutting
DE2332822B2 (de) * 1973-06-28 1978-04-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Herstellen von diffundierten, kontaktierten und oberflächenpassivierten Halbleiterbauelementen aus Halbleiterscheiben aus Silizium

Also Published As

Publication number Publication date
CA1061013A (en) 1979-08-21
US4047286A (en) 1977-09-13
FR2312116A1 (fr) 1976-12-17
DE2522346B2 (de) 1978-03-09
DE2522346C3 (de) 1978-10-26
JPS51142974A (en) 1976-12-08
GB1477129A (en) 1977-06-22
DE2522346A1 (de) 1976-12-02

Similar Documents

Publication Publication Date Title
JPS5264279A (en) Method of manufacturing semiconductor element
BR7605155A (pt) Substrato programavel
GB1553417A (en) Semiconductor device manufacture
DK151425C (da) Fremgangsmaade til fremstilling af et termoelektrisk modul
IT1064349B (it) Procedimento di fabbricazione di idrossi-arilaldeidi
JPS5259583A (en) Method of manufacturing semiconductor element
IT1033295B (it) Procedimento per fabbricare un dispositivo a semiconduttori
GB1554273A (en) Semiconductor device manufacture
SE426595B (sv) Forfarande for framstellning av cellulosaetrar
BE840685A (fr) Circuits a semi-conducteurs
FR2312878A1 (fr) Amplificateurs a semi-conducteurs
SE414379B (sv) Forfarande for framstellning av slangar
GB1543737A (en) Method of manufacturing a semiconductor device
IT1063291B (it) Procedimento per fabbricare un trasduttore
IT1039921B (it) Procedimento per fabbricare undispositivo a semiconduttori
SE435195B (sv) Reduktionsmedel for staltillverkning
DK357576A (da) Fremgangsmade til fremstilling af indoler
SE7513458L (sv) Tillverkningsforfarande
SE414096B (sv) Halvledartryckgivare och forfarande for dess tillverkning
SE7613233L (sv) Forfarande vid tillverkning av en halvledaranordning
IT1060796B (it) Componente a semiconduttori comandabile
SE432095B (sv) Forfarande for framstellning av cementklinker
FR2335960A1 (fr) Element semi-conducteur perfectionne
SE7613873L (sv) Halvledarelement
GB1538934A (en) Semiconductor elements