ITTO940788A0 - Perfezionamenti nei processi di fabbricazione di scatole di servizi e delle loro parti - Google Patents

Perfezionamenti nei processi di fabbricazione di scatole di servizi e delle loro parti

Info

Publication number
ITTO940788A0
ITTO940788A0 ITTO940788A ITTO940788A ITTO940788A0 IT TO940788 A0 ITTO940788 A0 IT TO940788A0 IT TO940788 A ITTO940788 A IT TO940788A IT TO940788 A ITTO940788 A IT TO940788A IT TO940788 A0 ITTO940788 A0 IT TO940788A0
Authority
IT
Italy
Prior art keywords
parts
manufacturing processes
service boxes
boxes
service
Prior art date
Application number
ITTO940788A
Other languages
English (en)
Inventor
Balana Josep Ma Altes
Nieto Rodolfo Kroebel
Original Assignee
Mecanismos Aux Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mecanismos Aux Ind filed Critical Mecanismos Aux Ind
Publication of ITTO940788A0 publication Critical patent/ITTO940788A0/it
Publication of ITTO940788A1 publication Critical patent/ITTO940788A1/it
Application granted granted Critical
Publication of IT1268103B1 publication Critical patent/IT1268103B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)
  • Packaging Frangible Articles (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
IT94TO000788A 1993-10-13 1994-10-07 Perfezionamenti nei processi di fabbricazione di scatole di servizi e delle loro parti IT1268103B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES09302193A ES2087815B1 (es) 1993-10-13 1993-10-13 Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.

Publications (3)

Publication Number Publication Date
ITTO940788A0 true ITTO940788A0 (it) 1994-10-07
ITTO940788A1 ITTO940788A1 (it) 1996-04-07
IT1268103B1 IT1268103B1 (it) 1997-02-20

Family

ID=8283361

Family Applications (1)

Application Number Title Priority Date Filing Date
IT94TO000788A IT1268103B1 (it) 1993-10-13 1994-10-07 Perfezionamenti nei processi di fabbricazione di scatole di servizi e delle loro parti

Country Status (17)

Country Link
US (1) US5601227A (it)
JP (1) JPH07122848A (it)
KR (1) KR950013338A (it)
BE (1) BE1008298A6 (it)
BR (1) BR9401908A (it)
CZ (1) CZ242394A3 (it)
DE (1) DE4410350A1 (it)
ES (1) ES2087815B1 (it)
FR (1) FR2711301A1 (it)
GB (1) GB2285004B (it)
HU (1) HUT68283A (it)
IT (1) IT1268103B1 (it)
PL (1) PL176420B1 (it)
PT (1) PT101486B (it)
SE (1) SE512003C2 (it)
SK (1) SK282553B6 (it)
TR (1) TR28246A (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0877539A1 (fr) * 1997-05-09 1998-11-11 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Améliorations dans les procédés de fabrication de boítes de services et de leurs parties
US6299055B1 (en) * 1997-05-09 2001-10-09 Lear Automotive Dearborn, Inc. Manufacturing processes of service boxes and their parts
DE202005015466U1 (de) * 2005-10-01 2007-02-08 Weidmüller Interface GmbH & Co. KG Leiterplattensystem
CN104600535B (zh) * 2015-01-26 2017-04-05 中国科学院等离子体物理研究所 超导缆与铜接头的真空压力浸渍软钎焊工艺
JP6840108B2 (ja) * 2018-06-14 2021-03-10 千住金属工業株式会社 フラックス、ソルダーペースト、基板、電子機器及び基板製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2105405A (en) * 1933-02-24 1938-01-11 Gen Motors Corp Soldered joint
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
GB1118948A (en) * 1966-08-30 1968-07-03 Nibco Improvements relating to the formation of sweat soldered joints between telescoped members
US3894330A (en) * 1971-03-01 1975-07-15 Du Pont Manufacture of conductive articles
US3865641A (en) * 1972-01-14 1975-02-11 Lake Chemical Co Compositions for use in soldering stainless steels
US3895158A (en) * 1973-08-15 1975-07-15 Westinghouse Electric Corp Composite glass cloth-cellulose fiber epoxy resin laminate
US3945556A (en) * 1975-02-25 1976-03-23 Alpha Metals, Inc. Functional alloy for use in automated soldering processes
US4170472A (en) * 1977-04-19 1979-10-09 Motorola, Inc. Solder system
ES228789Y (es) * 1977-05-27 1977-12-01 Caja de distribucion electrica para automoviles.
ES239279Y (es) * 1978-11-07 1979-05-16 Bloque perfeccionado de distribucion electrica.
JPS573875A (en) * 1980-06-11 1982-01-09 Tamura Kaken Kk Photopolymerizable ink composition
DE3265242D1 (en) * 1981-09-17 1985-09-12 Ciba Geigy Ag Light-sensitive coating agent and its use in protection purposes
US4529790A (en) * 1983-08-12 1985-07-16 Sumitomo Chemical Company, Limited Epoxy resin composition
GB2178683A (en) * 1985-07-11 1987-02-18 Nat Semiconductor Corp Improved semiconductor die-attach method and product
DE3682398D1 (de) * 1985-11-26 1991-12-12 Loctite Corp Zweikomponentenhaertbare epoxydharzzusammensetzung mit langer topfzeit.
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
EP0248617B1 (en) * 1986-06-02 1993-04-21 Japan Gore-Tex, Inc. Process for making substrates for printed circuit boards
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
JP2807008B2 (ja) * 1989-12-29 1998-09-30 田中電子工業株式会社 熱疲労特性に優れたＰｂ合金ろう
GB9107859D0 (en) * 1991-04-12 1991-05-29 Cookson Group Plc Protective coatings
TW224561B (it) * 1991-06-04 1994-06-01 Akocho Co
ES2071540B1 (es) * 1992-01-29 1996-02-01 Mecanismos Aux Ind Perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.

Also Published As

Publication number Publication date
US5601227A (en) 1997-02-11
GB2285004A (en) 1995-06-28
SE9402002L (sv) 1995-04-14
KR950013338A (ko) 1995-05-17
GB2285004B (en) 1997-01-08
ITTO940788A1 (it) 1996-04-07
FR2711301A1 (fr) 1995-04-21
HUT68283A (en) 1995-06-28
BR9401908A (pt) 1995-07-04
SK123494A3 (en) 1995-06-07
PT101486B (pt) 2001-06-29
PL176420B1 (pl) 1999-05-31
PT101486A (pt) 1995-05-04
BE1008298A6 (fr) 1996-04-02
SE9402002D0 (sv) 1994-06-23
JPH07122848A (ja) 1995-05-12
DE4410350A1 (de) 1997-04-24
ES2087815B1 (es) 1997-02-16
PL305314A1 (en) 1995-04-18
TR28246A (tr) 1996-03-28
SE512003C2 (sv) 2000-01-10
GB9419910D0 (en) 1994-11-16
SK282553B6 (sk) 2002-10-08
CZ242394A3 (en) 1995-08-16
ES2087815A1 (es) 1996-07-16
HU9402951D0 (en) 1995-02-28
IT1268103B1 (it) 1997-02-20

Similar Documents

Publication Publication Date Title
EP1011889A4 (en) PRODUCTS AND METHOD FOR PRODUCING DILATERS
DE60034611D1 (de) Vertikale Sicherung und deren Herstellungsverfahren
ITMI940144A0 (it) Soluzioni e loro preparazione
DE69110729D1 (de) Aluminiumpigment und dessen Herstellungsverfahren.
EP1183030A4 (en) PROCESS FOR THE PREPARATION AND ITS USE OF N-DESMETHYLZOPICLONE
BR9707741A (pt) Processo para producão de particulas de detergente particulas de detergente e composicão detergente
EP0437243A3 (en) Semiconductor laser and process for fabricating the same
DE69433337D1 (de) Halbleiterbauelement und dessen Herstellungsverfahren
DE69504262D1 (de) Halbleiterlaser und dessen Herstellungsverfahren
IT1292427B1 (it) Procedimento e apparecchiatura per la produzione di melammina
MX9200840A (es) Aleaciones patron de aluminio-estroncio-boro y proceso para su fabricacion.
EP0560358A3 (en) Semiconductor laser and process for fabricating the same
ITUD920046A1 (it) Procedimento di fabbricazione di scatole di servizio e loro parti
FR2791037B1 (fr) Boite en composite et procede de fabrication de cette derniere
DE69401733D1 (de) Halbleiterlaser und dessen Herstellungsverfahren
GB9803964D0 (en) Processing blanks in the manufacture of packaging
IT1268103B1 (it) Perfezionamenti nei processi di fabbricazione di scatole di servizi e delle loro parti
IT1286525B1 (it) Agenti anti-incrostazione,composizioni che li contengono e loro impiego nei processi di polimerizzazione
EP0468814A3 (en) Ultraviolet semiconductor laser and method of manufacturing the same
DE69504484D1 (de) Produktionseinrichtung und verarbeitungsbetrieb
DE69400459D1 (de) Halbleiterlaser und Herstellungsverfahren
IT1273984B (it) Policarbonati speciali e loro impiego per la preparazione di articoli ottici
IT1301979B1 (it) Merendina soffiata al caffe' e procedimento di fabbricazione dellastessa
NO993034D0 (no) Bjelke og fremgangsmÕte ved fremstilling av samme
IT1313700B1 (it) Composizioni anti-incrostazione e loro impiego nei processi dipolimerizzazione.

Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19990429