JP2000262015A - Wiring board retainer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of components necessary for retaining a plurality of types of wiring boards having different board thickness. SOLUTION: A retainer 17 has a pillar 24, which supports the lower surface 27 of a wiring board 16 with a plurality of board thicknesses with a 1st support part 26 at a common 1st support position 25 and support pins 28, which have engagement planes 29 supporting the upper surfaces of corresponding wiring boards 16 respectively, at a plurality of 2nd support positions with a plurality of distances in the thickness direction from the 1st support position and top surfaces 34.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding device for holding a wiring board.

[0002]

2. Description of the Related Art Wiring boards on which circuit elements are mounted on various electronic devices and electric devices are widely used. As a wiring board mounted on such an electronic device, a wiring board built in a small motor will be described as an example. 9 to 12 are views for explaining a conventional technique, FIG. 9 is a bottom view near the stator 2 of the motor 1, FIG. 10 is a side view of the stator 2 of the motor 1, and FIG. FIG. 12 is a development view of the stator 1 viewed from the radially inner side, and FIG. 12 is an enlarged view of a part of FIG. Hereinafter, the holding mechanism of the wiring board 3 in the motor 1 will be described with reference to FIGS.

[0003] A plurality of coils 5 are wound around a holder 4 of the stator 2 of the motor 1, and a wiring board 3 is supported on a plurality of columns 6 that stand up from the holder 4. The wiring board 3 is engaged with the engaging portion 8 at the tip of the support claw 7 rising integrally from the holder 4, and is held on the holder 4 by the support column 6 and the engaging portion 8. A circuit element 9 for control or the like is mounted on the wiring board 3, and a connection connector 10 is provided at one end.
Is provided. The holder 4, the support 6, and the support claws 7 are integrally formed of a synthetic resin material.

[0004]

The above prior art has the following problems. The column 6 and the supporting claw 7
In order to hold the wiring board 3 by the above method, the held wiring board 3 having a plate thickness t1 is set at an interval of a distance L1 between the tip of the column 6 and the engaging portion 8 as shown in FIGS. Since it is necessary to be clamped, the sizes of the support post 6 and the engagement claw 7 are uniquely determined so as to satisfy this condition. Therefore, as an example, the wiring board 3 mounted on the motor 1
In the case of changing the thickness of the wiring board 3 to a different type, it is necessary to manufacture and prepare a plurality of types of holders 4, supports 6, and engagement claws 7 corresponding to the thickness of the wiring board 3 to be changed, and the number of parts increases. There is a problem that.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to reduce the number of components required for holding even when holding a plurality of types of wiring boards having different thicknesses. An object of the present invention is to provide a substrate holding device.

[0006]

According to a first aspect of the present invention, there is provided a wiring board holding apparatus capable of holding a plurality of types of wiring boards having different thicknesses. 1
A first support member that is supported by the first support portion at the support position, and a plurality of first members that are respectively separated from the first support position by a plurality of types of thicknesses in the thickness direction corresponding to the plurality of types of thicknesses of the wiring board. And a second support member having a plurality of second support portions that respectively support the other surface of the corresponding wiring board at the two support positions.

According to a second aspect of the present invention, there is provided a wiring board holding device, comprising:
2. The wiring board according to claim 1, wherein each of the second support portions is provided at a position deviated from each other in a surface direction of the wiring board, and is provided to the wiring board along the thickness direction of each of the second support portions. 3. The projection area is determined so that the smaller the thickness of the held wiring board, the larger the area.

According to a third aspect of the present invention, there is provided a wiring board holding device.
3. The device according to claim 2, wherein the plurality of second support portions are recesses formed in the second support member along a surface direction of the wiring board.

[0009]

According to a first aspect of the present invention, there is provided a wiring board holding apparatus capable of holding a plurality of types of wiring boards.
That is, one surface of the wiring board having a certain thickness is supported by the first support portion at the common first support position of the first support member, and a distance corresponding to the certain thickness in the thickness direction from the first support position. The other surface of the wiring board is supported by one second support portion at one separated second support position.

In the case where the thickness of the held wiring board is different from the above-mentioned certain thickness, one side of the wiring board is placed at the common first support position of the first support member in the same manner as described above. The other surface of the wiring board is supported by the first support portion and at one second support position separated from the first support position in the plate thickness direction by a distance corresponding to the other plate thickness, by one second support portion. To support.

Accordingly, a plurality of types of wiring boards having different thicknesses can be held by a single holding device including the first support member and the second support member having a plurality of second support portions. This eliminates the need to manufacture and prepare a plurality of types of holding devices corresponding to the wiring boards having different thicknesses, thereby reducing the number of components required for holding.

According to a second aspect of the present invention, there is provided a wiring board holding device.
According to the first aspect of the present invention, the same operation and effect as those described in the first aspect can be realized, and the wiring board is held in a larger area as the thickness of the held wiring board becomes thinner. In addition, the smaller the thickness of the held wiring board, the stronger the holding action can be made.

According to a third aspect of the present invention, there is provided a wiring board holding device.
3. The wiring according to claim 2, wherein the plurality of second support portions are recesses formed in the second support member along a surface direction of the wiring board, and the recesses are used for holding the wiring. The thinner the substrate, the deeper the substrate is formed with respect to the second support member. Therefore, the thickness of the second support member in the surface direction is reduced, and the pressing force required when fitting the wiring board to the second support member can be reduced.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIGS. 1 to 4 show a first embodiment of the present invention, and FIGS. 5, 6, 7 and 8 show second, third, fourth and fifth embodiments, respectively. It is. FIG.
FIG. 2 is a cross-sectional view showing an operation state of the holding device for the wiring board incorporated in the motor 11 of the present embodiment, FIG. 2 is a cross-sectional view showing another operation state of the holding device, and FIG. FIG. 4 is a bottom view of the motor 11 of the example, and FIG.

Hereinafter, referring to FIG. 3 and FIG.
1 will be described. The motor 11 has a U
The motor is a 12-slot, 8-pole motor composed of three phases: phase, V phase, and W phase. A stator 14 on which a plurality of coils 13 are mounted and a rotor 15 are arranged in a casing 12 of the motor 11, and a wiring board 16 and a wiring having a configuration described later are provided on the left side of the stator 14 in FIG. A holding device 17 for the substrate 16 is arranged. The coil 13 is wound around a spool (or pre-molded portion) 18 made of a synthetic resin material or the like. The casing 12 is covered by a cover plate 19, and the rotating shaft 20 fixed to the rotor 15 is
Bearings 21 provided inside the cover 2 and the cover plate 19,
It is supported rotatably at 22. The wiring board 16 is connected to the connection terminal 23, and a drive signal is supplied from an external control device (not shown).

Hereinafter, the structure of the holding device 17 for the wiring board 16 will be described with reference to FIGS. The holding device 17 of the present embodiment has a function of mounting and holding the wiring board 16 on the motor 11 and, as shown in FIGS.
1, t12>t11> t12 (1) A single type of holding device 17 can hold a plurality of types of wiring boards 16 having different thicknesses. The holding device 17 includes a plurality of columns 24 as a first support member integrally formed on the bobbin 18 of the stator 14, and the column 24 is formed at a first support position 25 as a first support formed as a step surface. The part 26 supports the lower surface 27, which is one surface of the wiring board 16.

On the other hand, the bobbin 18 has a plurality of support pins 28 as second support members.
6 is located at one second support position at a distance h1 h1> t11 (2) in the longitudinal direction of the support pin 28 from the first support portion 26 of the support column 24. A locking surface 29 is formed. The locking surface 29 is
As shown in FIG. 1, the wiring board 16 having a large plate thickness t11 is formed as a step surface between a fixing claw 30 having a diameter larger than that of the support pin 28 at the end thereof. When mounted on the wiring board 17, it is formed at a position separated from the upper surface 38 of the wiring board 16 by a distance S12. Therefore, the base end side of the support pin 28 with respect to the fixed claw 30 has a diameter smaller than that of the fixed claw 30 and forms a recess 31 that holds the end of the wiring board 16.

The recess 31 of the support pin 26 is moved from a support position 32, which is a position close to the first support portion 26 of the support column 24 in the length direction of the support pin 26, to the support pin 2
A recess 33 is formed at a depth d0 over a distance h2 t11>h2> t12 (3) in the longitudinal direction of No. 6. The upper surface 34 that is the second support portion of the recess 33 is a distance h from the support position 32.
2 are formed at other second support positions 35 which are positions separated from each other.

The lower surface 36 of the recess 33 is
Is attached to the holding device 17, the lower surface 2 of the wiring board 16
7 and the support pin 26 are formed at positions separated by a distance S11 in the longitudinal direction. Further, the support pin 2
As shown in FIG. 1, when the wiring board 16 having a large thickness t11 is mounted on the holding device 17, the side portion 37, which is a side surface facing the wiring board 16, has a distance from the end of the wiring board 16. It is formed at a position separating S13. The fixed claw 3
0, as shown in FIG. 1, when the wiring board 16 having the large thickness t11 is mounted on the holding device 17, the tip of the fixed claw 30 is separated from the end in the surface direction of the wiring board 16 by a distance d1. It is formed so as to be located at a position overlapping the wiring board 16.

In the holding device 17 having such a configuration, when holding the wiring board 16 having the large thickness t11,
The lower surface 27 of the wiring board 16 is moved to the first support position 25 of the support 24.
The first support portion 26 and the locking surface 29 of the support pin 28
Thus, the wiring board 16 is held with the wiring board 16 interposed therebetween.

When the thickness of the held wiring board 16 is smaller than the thickness t11, the wiring board 16
The lower surface 27 of the support column 24 in the first support position 2 in the same manner as described above.
5 is supported by the first support portion 26. Further, the end of the wiring board 16 is fitted into the recess 33 of the support pin 28, and the upper surface 34 of the recess 33 supports the upper surface 38 of the wiring board 16.

As described above, the holding device 17 of this embodiment is
Then, a plurality of types of wiring boards 16 having a thickness
And a single holding device 17 having a plurality of support pins 28 each having a locking surface 29 and an upper surface 34 as a second support portion.
Therefore, it is possible to eliminate the need to manufacture and prepare a plurality of types of holding devices corresponding to the number 6, and to reduce the number of components required for holding.

Further, in the holding device 17 of this embodiment, since the thickness of the support pin 28 is formed thin at the recess 33, the rigidity of the support pin 28 can be reduced at this portion, and The pressing force required when fitting the wiring board 16 to the motor 11 can be reduced, and the assembling work of the motor 11 can be easily performed.

FIG. 5 shows a holding device 17 according to a second embodiment of the present invention.
It is sectional drawing of a. This embodiment is similar to the first embodiment, and corresponding parts are denoted by the same reference numerals. The feature of the present embodiment is that in the support pin 28 of the first embodiment, the recess 33 is extended to the base end of the support pin 28.
That is, a support pin 28a having a is formed. That is, in this embodiment, the lower surface 36 of the support pin 28 of the first embodiment is not formed. Even when the lower surface 36 is not formed, the lower surface 27 of the wiring board 16
It is supported by the support part 26.

In this embodiment, the upper surface 38 of the wiring board 16 having the large thickness t11 is provided with the locking surface 29 of the support pin 28a.
Supported by The wiring board 16 having a small thickness t12
Is supported by the upper surface 34 of the support pin 28a. Therefore, even in the holding device 17a of such an embodiment,
The same functions and effects as those described in the above embodiment can be realized.

FIG. 6 shows a holding device 17 according to a third embodiment of the present invention.
It is sectional drawing of b. This embodiment is similar to the first embodiment, and corresponding parts are denoted by the same reference numerals. This embodiment is characterized in that the upper and lower surfaces 34 and 36 of the recess 33 and the side portions 3 of the support pin 28 are different from those of the first embodiment.
That is, the boundary with 7 was chamfered. Other configurations are the same as those of the holding device 17 of the first embodiment.

Therefore, in this embodiment, the large thickness t
11 and a wiring board 16 having a small thickness t12
Is the same as the holding operation of the holding device 17 of the first embodiment. Thus, even with the holding device 17b of such an embodiment, the same operation and effect as those described in the above embodiment can be realized.

FIG. 7 shows a holding device 17 according to a fourth embodiment of the present invention.
FIG. 8 is a cross-sectional view illustrating the operation of the holding device 17c. This embodiment is similar to the first embodiment, and corresponding parts are denoted by the same reference numerals. The feature of this embodiment is that the boundary between the lower surface 36 of the recess 33 and the side portion 37 of the support pin 28 is chamfered in the support pin 28 of the first embodiment. Other configurations are the same as those of the holding device 17 of the first embodiment.

Therefore, in this embodiment, the large thickness t
11 and a wiring board 16 having a small thickness t12
Is the same as the holding operation of the holding device 17 of the first embodiment. As a result, even with the holding device 17c of this embodiment, the same operation and effect as those described in the above embodiment can be realized.

Further, in the holding device 17c of the present embodiment, the wiring boards 16 having different thicknesses can be held by the single holding device 17c. Therefore, when the thickness of the wiring board 16 is reduced, The height of the circuit component 40 mounted on the circuit board 16 can be increased by the length of the thinned wiring board 16, and the mounting density of the circuit component 40 can be increased. This operation and effect can be realized by a holding device that can use the same configuration when holding the wiring boards 16 having different thicknesses. Therefore, the holding device 17c according to the fourth embodiment is realized.
The holding device 1 according to the first to third embodiments is not limited to
It is obvious that the present invention can be realized with respect to 7, 17a and 17b.

The present invention is not limited to the above embodiments, but includes a wide variety of modifications without departing from the spirit of the present invention.

[0032]

As described above, the wiring board holding device according to the first aspect of the present invention is capable of holding a plurality of types of wiring boards having different thicknesses. That is, one surface of the wiring board having a certain thickness is supported by the first support portion at the common first support position of the first support member, and a distance corresponding to the certain thickness in the thickness direction from the first support position. The other surface of the wiring board is supported by one second support portion at one second support position separated by.

In the case where the thickness of the held wiring board is different from the above-mentioned certain thickness, one surface of the wiring board is similarly connected to the first supporting position of the first supporting member. The first surface of the wiring board is supported by the first support portion at one second support position separated from the first support position in the thickness direction by a distance corresponding to the other thickness. I support.

Accordingly, a plurality of types of wiring boards having different thicknesses can be held by a single holding device having the first support member and the second support member having a plurality of second support portions. This eliminates the need to manufacture and prepare a plurality of types of holding devices corresponding to the wiring boards having different thicknesses, thereby reducing the number of components required for holding.

According to a second aspect of the present invention, there is provided a wiring board holding device.
According to the first aspect of the present invention, the same operation and effect as those described in the first aspect can be realized, and the wiring board is held in a larger area as the thickness of the held wiring board becomes thinner. In addition, the smaller the thickness of the held wiring board, the stronger the holding action can be made.

According to a third aspect of the present invention, there is provided the wiring board holding device.
3. The wiring according to claim 2, wherein the plurality of second support portions are recesses formed in the second support member along a surface direction of the wiring board, and the recesses are used for holding the wiring. The thinner the substrate, the deeper the substrate is formed with respect to the second support member. Therefore, the thickness of the second support member in the surface direction is reduced, and the pressing force required when fitting the wiring board to the second support member can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an operation state of a holding device 17 according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing another operation state of the holding device 17;

FIG. 3 is a bottom view of the motor 11 according to the embodiment.

FIG. 4 is a sectional view of the motor 11;

FIG. 5 is a sectional view of a holding device 17a according to a second embodiment of the present invention.

FIG. 6 is a sectional view of a holding device 17b according to a third embodiment of the present invention.

FIG. 7 is a sectional view of a holding device 17c according to a fourth embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating an operation of the holding device 17c.

FIG. 9 is a bottom view near the stator 2 of the motor 1 according to the prior art.

10 is a side view of the stator 2 of the motor 1. FIG.

FIG. 11 is a developed view of the stator 2 of the motor 1 as viewed from the radially inner side.

FIG. 12 is an enlarged view of a part of FIG. 11;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Motor 14 Stator 16 Wiring board 17, 17a, 17b, 17c Holding device 18 Spool (pre-mold part) t11, t12 Plate thickness 24 Prop 25 First support position 26 First support 27 Lower surface 28 Support pin 29 Stop surface 30 Fixed claw 38 Upper surface 31, 33 Depression 32 Support position 34 Upper surface 35 Second support position 36 Lower surface 37 Side

Claims (3)

[Claims] A holding device capable of holding a plurality of types of wiring boards having different thicknesses, a first support member for supporting one surface of the wiring board at a first support portion at a common first support position, and a wiring. A plurality of second support positions respectively supporting a plurality of types of distances in the thickness direction from the first support position in correspondence with a plurality of types of board thicknesses of the substrate; And a second support member having the second support portion. 2. The second support portion is provided at a position shifted from each other in a surface direction of the wiring board, and a projected area of the second support portion on the wiring board along the thickness direction of the second support portion is provided. ,
2. The holding device for a wiring board according to claim 1, wherein the holding area is determined so that the area becomes larger as the thickness of the held wiring board becomes thinner. 3. The wiring board holding device according to claim 2, wherein the plurality of second support portions are recesses formed in the second support member along a surface direction of the wiring board.