JP2000263577A5 - - Google Patents
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- JP2000263577A5 JP2000263577A5 JP1999073202A JP7320299A JP2000263577A5 JP 2000263577 A5 JP2000263577 A5 JP 2000263577A5 JP 1999073202 A JP1999073202 A JP 1999073202A JP 7320299 A JP7320299 A JP 7320299A JP 2000263577 A5 JP2000263577 A5 JP 2000263577A5
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一つの試みは、熱プレス装置に関するもので、従来の熱プレスを減圧雰囲気下に実施して、金属箔と液晶ポリマーフィルムの間にたとえ空隙が存在していても、それに含有される気体の絶対量を減少させて、部分的な欠陥が発生することを防止する技術であって、例えば特開昭６２−２１１１２９号公報に記載された真空式ホットプレス装置や、特開平１−５８２１号公報に記載されている多層プリント板の接着プレス装置などが提案されている。これらの減圧雰囲気下での積層によれば、気泡噛みに関してはかなりの効果が確認されるものの、金属箔積層板の端部の厚みが薄くなったり、同時に積層した複数枚の金属箔積層板に認められるそりの改善には効果がないのが実状であった。 One attempt relates to a thermal press device, in which a conventional thermal press is performed in a reduced pressure atmosphere and the absolute amount of gas contained therein is absolute, even if there are voids between the metal foil and the liquid crystal polymer film. A technique for reducing the amount to prevent the occurrence of partial defects, for example, in the vacuum hot press apparatus described in JP-A No. 62-21129 and JP-A No. 1-5821. Adhesive press devices for the described multilayer printed boards have been proposed. According to these laminating under a reduced pressure atmosphere , although a considerable effect is confirmed with respect to bubble biting, the thickness of the end portion of the metal leaf laminating plate becomes thin, or a plurality of metal foil laminating plates laminated at the same time can be formed. The actual situation was that there was no effect on the improvement of the observed warp.
【００１０】
【課題を解決するための手段】
本発明者らは、上記の目的を達成するために鋭意検討した結果、熱可塑性液晶ポリマーフィルムと金属箔とからなる構成材料を重ね合せて平坦な金属プレート間に挟んだ構成のセットを複数セット積み重ね、対向する加熱加圧盤間に装着し、加熱プレスして金属箔積層板を製造する方法において、対向する加熱加圧盤間に装着した後に、（１）加圧することなく、熱可塑性液晶ポリマーフィルムの融点より３０℃低い温度を上限とする予熱温度まで加熱する予熱工程である第１工程、（２）２ｋｇ／ｃｍ2 以下のプレス圧力を保ちながら、予熱温度から、熱可塑性液晶ポリマーフィルムの融点より５℃低い温度以上融点より５℃高い温度以下の範囲から選択される積層温度まで加熱する昇温工程である第２工程、（３）積層温度で、２０ｋｇ／ｃｍ2 から５０ｋｇ／ｃｍ2 までの範囲から選択されるプレス圧力にまで加圧する加圧工程である第３工程、および（４）加圧工程のプレス圧力を保ちながら、熱可塑性液晶ポリマーフィルムの融点より３０℃以上低い冷却温度まで冷却する冷却工程である第４工程を行い、その際に、第２工程から第４工程までを３０分以内の時間で行い、かつ第１工程から第４工程までを３０ｔｏｒｒ以下の減圧雰囲気で行い、次いで（５）加圧および減圧雰囲気を解除して、金属箔積層板を取り出す排出工程である第５工程を行うことを特徴とする金属箔積層板の製造方法を提供することによって達成される。
0010
[Means for solving problems]
As a result of diligent studies to achieve the above object, the present inventors have set a plurality of sets in which a constituent material composed of a thermoplastic liquid crystal polymer film and a metal foil is superposed and sandwiched between flat metal plates. In a method of stacking, mounting between facing heating and pressing plates, and heat-pressing to produce a metal foil laminated plate, after mounting between facing heating and pressing plates, (1) a thermoplastic liquid crystal polymer film without pressurization. The first step, which is a preheating step of heating to a preheating temperature up to a temperature 30 ° C. lower than the melting point of the above, (2) The melting point of the thermoplastic liquid crystal polymer film is determined from the preheating temperature while maintaining a press pressure of 2 kg / cm 2 or less. The second step, which is a heating step of heating to a stacking temperature selected from a range of 5 ° C lower or higher and 5 ° C higher than the melting point, and (3) stacking temperature from 20 kg / cm 2 to 50 kg / cm 2. The third step, which is a pressurizing step of pressurizing to a press pressure selected from the range of (4), and (4) to a cooling temperature 30 ° C. or more lower than the melting point of the thermoplastic liquid crystal polymer film while maintaining the press pressure of the pressurizing step. The fourth step, which is a cooling step for cooling, is performed, and at that time, the second step to the fourth step are performed within 30 minutes, and the first step to the fourth step are performed in a reduced pressure atmosphere of 30 torr or less. Then, (5) it is achieved by providing a method for manufacturing a metal foil laminated plate, which comprises performing a fifth step, which is a discharge step of taking out the metal foil laminated plate by releasing the pressurizing and depressurizing atmosphere. ..
すなわち、熱プレス装置として、加熱および加圧装置全体を真空状態に維持できるように設計された真空熱プレス装置を使用して、前記の第１工程から第４工程の減圧雰囲気を３０ｔｏｒｒ以下に維持することによって金属箔積層板にふくれが部分的に発生することを改善することができる。減圧雰囲気が３０ｔｏｒｒを越えると、金属箔とフィルムとの間に噛み込んだ気泡が脱気されにくく中央部に部分的なふくれが認められる。 That is, as the heat press device, a vacuum heat press device designed so that the entire heating and pressurizing device can be maintained in a vacuum state is used, and the depressurized atmosphere of the first to fourth steps is maintained at 30 torr or less. By doing so, it is possible to improve the partial occurrence of blisters on the metal foil laminated plate. When the reduced pressure atmosphere exceeds 30 torr, the air bubbles caught between the metal foil and the film are hard to be degassed, and a partial blistering is observed in the central portion.
さらに、３０ｔｏｒｒ以下の減圧雰囲気にした場合においても、前記の予熱工程である第１工程において加圧したり、昇温工程である第２工程の圧力が２ｋｇ／ｃｍ2 を超えると、金属箔とフィルムとの間に噛み込んだ気泡が脱気されにくく中央部に部分的なふくれが認められる。これは、圧力をかけることによって、軟化状態にある熱可塑性液晶ポリマーフィルムが金属箔と部分的に融着し、脱気されるべき噛み込んだ気泡が部分的に残留するからと考えられる。 Further, even when the reduced pressure atmosphere is 30 torr or less, if the pressure is increased in the first step which is the preheating step or the pressure in the second step which is the raising step exceeds 2 kg / cm 2, the metal foil and the film are formed. The air bubbles caught between the two are hard to be degassed, and a partial blistering is observed in the center. It is considered that this is because the softened thermoplastic liquid crystal polymer film is partially fused with the metal foil by applying pressure, and the bitten air bubbles to be degassed are partially left.
加圧工程である第３工程の積層温度と積層圧力は、金属箔積層板のそりを減少させて平坦性という観点から設定される。積層温度としては、融点より５℃低い温度以上融点より５℃高い温度以下の範囲から選択される。融点より５℃低い温度よりも低温であると、中央部が凸になった形状で全体的に大きなそりが発生し、融点よりも５℃高い温度よりも高温であると、隅部が部分的にそり易くなる。このそりは、積層圧力が高い場合に程度が大きくなるが、とりわけ積層圧力が５０ｋｇ／ｃｍ2 を越えると、そりが極めて大きくなり実用に適さない。２０ｋｇ／ｃｍ2 未満のプレス圧力では端部の一部の界面接着強度が低くなる場合がある。 The laminating temperature and laminating pressure of the third step, which is the pressurizing step, are set from the viewpoint of flatness by reducing the warp of the metal foil laminated board. The stacking temperature is selected from a range of 5 ° C. lower than the melting point and 5 ° C. higher than the melting point. When the temperature is lower than the temperature 5 ° C lower than the melting point, a large warp occurs as a whole with a convex shape in the center, and when the temperature is higher than the temperature 5 ° C higher than the melting point, the corners are partially. It becomes easy to sledge. The degree of this warp increases when the stacking pressure is high, but especially when the stacking pressure exceeds 50 kg / cm 2 , the warp becomes extremely large and is not suitable for practical use. At a press pressure of less than 20 kg / cm 2, the interfacial adhesive strength of a part of the end may decrease.
そりの程度を特別に小さくするためには、第１工程の予熱温度と第４工程の冷却温度を同じ温度にすることが有効である。すなわち、僅かな圧力で加圧して昇温を行う昇温工程である第２工程では、熱可塑性液晶ポリマーフィルムと金属箔との接着が開始されるが、この時には、熱可塑性液晶ポリマーフィルムと金属箔との間で僅かな歪みが発生し始める。この歪みは、予熱温度と同じ温度まで冷却した段階で加圧および減圧雰囲気状態を解除して排出することにより相殺できると考えられる。 In order to make the degree of warpage particularly small, it is effective to make the preheating temperature of the first step and the cooling temperature of the fourth step the same temperature. That is, in the second step, which is a heating step of pressurizing with a slight pressure to raise the temperature, adhesion between the thermoplastic liquid crystal polymer film and the metal foil is started. At this time, the thermoplastic liquid crystal polymer film and the metal Slight distortion begins to occur with the foil. It is considered that this distortion can be offset by releasing the pressurized and depressurized atmosphere state at the stage of cooling to the same temperature as the preheating temperature and discharging the strain.
次に、マイクロ波の振動方向に対する物体の回転角が０°のとき、つまり、マイクロ波の振動方向と、物体の分子が最もよく配向されている方向であって、最小マイクロ波透過強度を与える方向とが合致しているときのｍ値をｍ ０ 、回転角が９０°のときのｍ値をｍ ９０ として、分子配向度ＳＯＲはｍ ０ ／ｍ ９０ により算出される。 Next, when the angle of rotation of the object with respect to the direction of microwave vibration is 0 °, that is, the direction of microwave vibration and the direction in which the molecules of the object are best oriented, the minimum microwave transmission intensity is given. m 0 to m value when the direction meets the m value when the rotation angle is 90 ° as m 90, orientation ratio SOR is calculated by m 0 / m 90.
さらに、本発明における金属箔には、厚みが０．２〜２ｍｍの範囲の金属板もが包含される。本発明の積層板が電子部品の放熱板として使用される場合には、折れ曲げ加工性の点から金属板の厚みは０．２〜１ｍｍの範囲が好ましい。この様な板厚の金属板は圧延法により一般に製造されるために、金属板の表面粗さは通常１μｍ以下で平滑であり、本発明における電気絶縁性材料と熱可塑性液晶ポリマーフィルムとの界面接着強度を向上させるために、金属板の表面を化学的あるいは物理的に処理して表面粗さを２〜４μｍにして用いることが好ましい。表面粗さに特に制限があるわけではないが、金属板の板厚の５０％以上の粗さは金属板の強度が低くなるので避けることが好ましい。 Further, the metal foil in the present invention also includes a metal plate having a thickness in the range of 0.2 to 2 mm. When the laminated plate of the present invention is used as a heat sink for electronic components, the thickness of the metal plate is preferably in the range of 0.2 to 1 mm from the viewpoint of bendability. Since a metal plate having such a thickness is generally manufactured by a rolling method, the surface roughness of the metal plate is usually 1 μm or less and smooth, and the interface between the electrically insulating material and the thermoplastic liquid crystal polymer film in the present invention. In order to improve the adhesive strength, it is preferable to chemically or physically treat the surface of the metal plate to make the surface roughness 2 to 4 μm. The surface roughness is not particularly limited, but it is preferable to avoid a roughness of 50% or more of the plate thickness of the metal plate because the strength of the metal plate is lowered.
（１）第１工程（予熱工程）では、図２において、加圧することなく（プレス圧力ｐ１＝０）、熱可塑性液晶ポリマーフィルム１の融点より３０℃低い温度を上限とする予熱温度ｔ１まで、加熱加圧盤７を加熱する。このとき、減圧室内を減圧雰囲気解除ｖ１の状態から３０ｔｏｒｒ以下の減圧雰囲気ｖ２の状態にする。この減圧雰囲気ｖ２をこの予熱工程から冷却工程まで持続する。
（２）第２工程（昇温工程）では、２ｋｇ／ｃｍ2 以下のプレス圧力ｐ２を保ちながら、上記予熱工程における予熱温度ｔ１から、その融点より５℃低い温度以上融点より５℃高い温度以下の範囲から選択される積層温度ｔ２まで加熱する。（３）第３工程（加圧工程）では、上記昇温工程における積層温度ｔ２で加熱した状態で、プレス圧力を、２０ｋｇ／ｃｍ2 から５０ｋｇ／ｃｍ2 までの範囲から選択されるプレス圧力ｐ３に設定する。
（４）第４工程（冷却工程）では、上記加圧工程のプレス圧力ｐ３を保ちながら、熱可塑性液晶ポリマーフィルム１の融点より３０℃以上低い冷却温度ｔ１にまで冷却する。上記昇温工程から冷却工程までを３０分以内の時間で行う。
（５）第５工程（排出工程）では、加圧の解除（ｐ１＝０）および減圧雰囲気の解除（ｖ１）の後、図１の熱可塑性液晶ポリマーフィルム１と金属箔２、２とが一体化した金属箔積層板を、金属プレート３、３と分離させて取り出す。
(1) In the first step (preheating step), in FIG. 2, the preheating temperature t1 up to a temperature 30 ° C. lower than the melting point of the thermoplastic liquid crystal polymer film 1 without pressurization (press pressure p1 = 0) is reached. The heating pressurizing plate 7 is heated. At this time, the decompression chamber is changed from the state of decompression atmosphere release v1 to the state of decompression atmosphere v2 of 30 torr or less. This reduced pressure atmosphere v2 is maintained from this preheating step to the cooling step.
(2) In the second step (heating step), while maintaining a press pressure p2 of 2 kg / cm 2 or less, the temperature from the preheating temperature t1 in the preheating step is 5 ° C lower than the melting point or higher and 5 ° C higher than the melting point. It is heated to the stacking temperature t2 selected from the range of. (3) In the third step (pressing step), while heating at lamination temperatures t2 in the heating step, the pressing pressure is selected from a range of press pressure from 20 kg / cm 2 to 50 kg / cm 2 p3 Set to.
(4) In the fourth step (cooling step), the thermoplastic liquid crystal polymer film 1 is cooled to a cooling temperature t1 which is 30 ° C. or more lower than the melting point of the thermoplastic liquid crystal polymer film 1 while maintaining the press pressure p3 of the pressurizing step. The process from the temperature raising step to the cooling step is performed within 30 minutes.
(5) In the fifth step (discharge step), after the pressurization is released (p1 = 0) and the reduced pressure atmosphere is released (v1), the thermoplastic liquid crystal polymer film 1 of FIG. 1 and the metal foils 2 and 2 are integrated. The metal leaf laminated plate is separated from the metal plates 3 and 3 and taken out.
〔実施例１〕
縦３０ｃｍ×横３０ｃｍの参考例１の熱可塑性液晶ポリマーフィルムＡの上下に縦３５ｃｍ×横３５ｃｍの箔厚み１８μｍの電気分解法で製造した銅箔を中心を揃えて重ね、これを縦４０ｃｍ×横４０ｃｍの１ｍｍ厚みの金属プレート（浪速ステンレス工業株式会社製、ステンレス３０４）の間に中心を揃えて挟んで１セットとした。同構成１０セットを積み重ね、真空熱プレス機（北川精機株式会社製、ＶＨ２型）の加熱加圧盤の間に挿入した。加熱加圧盤は２６０℃に温度調節しており、加圧することなく１０ｔｏｒｒまで減圧した。１０ｔｏｒｒになるまでに３０秒を要した。この状態で４０分間保持して金属プレートの温度が２５５℃に到達したことを確認した。その後、プレス圧力が１．５ｋｇ／ｃｍ2 になるように加熱加圧盤で圧縮して加圧し、１０℃／分の速度で昇温を開始した。２８５℃になった時点で昇温を停止し、同時にプレス圧力を３０ｋｇ／ｃｍ2 に増加させてから５分間保った。その後に、冷却を強制的に行い、１０℃／分の速度で温度を下げて、２５０℃になった時点で、減圧雰囲気を解き、プレス圧力をゼロとし、積層板を取出した。昇温工程から加圧工程を経て冷却工程までに合計で約１２分を要した。金属箔積層板にはふくれなどの表面欠点はなく、そりは１ｍｍ以下で極めて小さく、界面接着強度は１．４ｋｇ／ｃｍであった。この金属箔積層板上に幅０．１ｍｍ、間隔０．１ｍｍで断線部のない配線をエッチング法により形成することができた。
[Example 1]
Copper foil produced by an electrolysis method having a length of 35 cm and a width of 35 cm and a foil thickness of 18 μm is placed on top of and below the thermoplastic liquid crystal polymer film A of Reference Example 1 having a length of 30 cm and a width of 30 cm. A set was formed by sandwiching the center between 40 cm 1 mm thick metal plates (manufactured by Naniwa Stainless Industry Co., Ltd., stainless 304). Ten sets of the same configuration were stacked and inserted between the heating and pressurizing machines of a vacuum heat press machine (manufactured by Kitagawa Seiki Co., Ltd., VH2 type). The temperature of the heating and pressurizing plate was adjusted to 260 ° C., and the pressure was reduced to 10 torr without pressurizing. It took 30 seconds to reach 10 torr. It was held in this state for 40 minutes, and it was confirmed that the temperature of the metal plate reached 255 ° C. Then, the press pressure was compressed with a heating and pressurizing machine so as to be 1.5 kg / cm 2, and the pressure was increased, and the temperature rise was started at a rate of 10 ° C./min. When the temperature reached 285 ° C., the temperature rise was stopped, and at the same time, the press pressure was increased to 30 kg / cm 2 and then maintained for 5 minutes. After that, cooling was forcibly performed, the temperature was lowered at a rate of 10 ° C./min, and when the temperature reached 250 ° C., the reduced pressure atmosphere was released, the press pressure was set to zero, and the laminated plate was taken out. It took about 12 minutes in total from the temperature raising step to the cooling step through the pressurizing step. The metal foil laminated plate had no surface defects such as blisters, the warp was extremely small at 1 mm or less, and the interfacial adhesive strength was 1.4 kg / cm. Wiring with a width of 0.1 mm and an interval of 0.1 mm without disconnection could be formed on the metal foil laminated plate by an etching method.
〔実施例２〕
縦３０ｃｍ×横３０ｃｍの参考例２の熱可塑性液晶ポリマーフィルムＢの上下に縦３５ｃｍ×横３５ｃｍの箔厚み１８μｍの電気分解法で製造した銅箔を中心を揃えて重ね、これを縦４０ｃｍ×横４０ｃｍの１．５ｍｍ厚みの金属プレート（浪速ステンレス工業株式会社製、ステンレス６３０Ｈ）の間に中心を揃えて挟んで１セットとした。同構成１０セットを積み重ね、真空熱プレス機（北川精機株式会社製、ＶＨ２型）の加熱加圧盤の間に挿入した。加熱加圧盤は３００℃に温度調節しており、加圧することなく１０ｔｏｒｒまで減圧した。１０ｔｏｒｒになるまでに３０秒を要した。この状態で４０分間保持して金属プレートの温度が２９５℃に到達したことを確認した。その後、プレス圧力を１．５ｋｇ／ｃｍ2 に加熱加圧盤で圧縮して加圧し、５℃／分の速度で昇温を開始した。３３０℃になった時点で昇温を停止し、同時にプレス圧力を３０ｋｇ／ｃｍ2 に増加させてから５分間保った。冷却を強制的に行い、１０℃／分の速度で温度を下げて、３００℃になった時点で、減圧雰囲気を解き、プレス圧力をゼロとし、積層板を取出した。昇温工程から加圧工程を経て冷却工程までに合計で約１５分を要した。金属箔積層板にはふくれなどの表面欠点はなく、そりは１ｍｍ以下で極めて小さく、界面接着強度は１．３ｋｇ／ｃｍであった。この金属箔積層板上に幅０．１ｍｍ、間隔０．１ｍｍで断線部のない配線をエッチング法により形成することができた。
[Example 2]
Copper foil produced by an electrolysis method having a length of 35 cm and a width of 35 cm and a foil thickness of 18 μm is placed on top of and below the thermoplastic liquid crystal polymer film B of Reference Example 2 having a length of 30 cm and a width of 30 cm, and the copper foils are aligned and stacked. A set was formed by sandwiching the center between 40 cm and 1.5 mm thick metal plates (manufactured by Naniwa Stainless Industry Co., Ltd., stainless steel 630H). Ten sets of the same configuration were stacked and inserted between the heating and pressurizing machines of a vacuum heat press machine (manufactured by Kitagawa Seiki Co., Ltd., VH2 type). The temperature of the heating and pressurizing plate was adjusted to 300 ° C., and the pressure was reduced to 10 torr without pressurizing. It took 30 seconds to reach 10 torr. It was confirmed that the temperature of the metal plate reached 295 ° C. by holding it in this state for 40 minutes. Then, the press pressure was compressed to 1.5 kg / cm 2 with a heating pressurizer and pressurized, and the temperature was started to rise at a rate of 5 ° C./min. When the temperature reached 330 ° C., the temperature rise was stopped, and at the same time, the press pressure was increased to 30 kg / cm 2 and then maintained for 5 minutes. Cooling was forcibly performed, the temperature was lowered at a rate of 10 ° C./min, and when the temperature reached 300 ° C., the reduced pressure atmosphere was released, the press pressure was set to zero, and the laminated board was taken out. It took about 15 minutes in total from the temperature raising step to the cooling step through the pressurizing step. The metal foil laminated plate had no surface defects such as blisters, the warp was extremely small at 1 mm or less, and the interfacial adhesive strength was 1.3 kg / cm. Wiring with a width of 0.1 mm and an interval of 0.1 mm without disconnection could be formed on the metal foil laminated plate by an etching method.
Claims (1)
対向する加熱加圧盤間に装着した後に、
（１）加圧することなく、熱可塑性液晶ポリマーフィルムの融点より３０℃低い温度を上限とする予熱温度まで加熱する予熱工程である第１工程、
（２）２ｋｇ／ｃｍ2 以下のプレス圧力を保ちながら、予熱温度から、熱可塑性液晶ポリマーフィルムの融点より５℃低い温度以上融点より５℃高い温度以下の範囲から選択される積層温度まで加熱する昇温工程である第２工程、
（３）積層温度で、２０ｋｇ／ｃｍ2 から５０ｋｇ／ｃｍ2 までの範囲から選択されるプレス圧力にまで加圧する加圧工程である第３工程、および
（４）加圧工程のプレス圧力を保ちながら、熱可塑性液晶ポリマーフィルムの融点より３０℃以上低い冷却温度まで冷却する冷却工程である第４工程
を行い、その際に、第２工程から第４工程までを３０分以内の時間で行い、かつ第１工程から第４工程までを３０ｔｏｒｒ以下の減圧雰囲気で行い、次いで
（５）加圧および減圧雰囲気を解除して、金属箔積層板を取り出す排出工程である第５工程
を行うことを特徴とする金属箔積層板の製造方法。A film made of a thermoplastic polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as a thermoplastic liquid crystal polymer film) and a constituent material made of a metal foil are superposed and sandwiched between flat metal plates. In a method of manufacturing a metal leaf laminated plate by stacking a plurality of sets of a thermoplastic structure, mounting them between facing heating and pressurizing plates, and heating and pressing them.
After mounting between the opposing heating and pressurizing boards
(1) The first step, which is a preheating step of heating to a preheating temperature up to a temperature 30 ° C. lower than the melting point of the thermoplastic liquid crystal polymer film without pressurizing.
(2) While maintaining a press pressure of 2 kg / cm 2 or less, heat from the preheating temperature to a lamination temperature selected from a temperature range of 5 ° C. lower than the melting point of the thermoplastic liquid crystal polymer film and 5 ° C. higher than the melting point. The second step, which is the heating step,
(3) maintaining at lamination temperature, the third step is about pressurize pressurization step to a pressing pressure chosen from the range of 20 kg / cm 2 to 50 kg / cm 2, and (4) pressing pressure of the pressurization step However, the fourth step, which is a cooling step of cooling to a cooling temperature 30 ° C. or more lower than the melting point of the thermoplastic liquid crystal polymer film, is performed, and at that time, the second step to the fourth step are performed within 30 minutes. Further, the first step to the fourth step are carried out in a reduced pressure atmosphere of 30 torr or less, and then (5) the pressurization and the reduced pressure atmosphere are released, and the fifth step, which is a discharge step of taking out the metal foil laminated plate, is carried out. A method for manufacturing a metal foil laminated plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07320299A JP4162321B2 (en) | 1999-03-18 | 1999-03-18 | Method for producing metal foil laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07320299A JP4162321B2 (en) | 1999-03-18 | 1999-03-18 | Method for producing metal foil laminate |
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| JP2000263577A JP2000263577A (en) | 2000-09-26 |
| JP2000263577A5 true JP2000263577A5 (en) | 2005-09-08 |
| JP4162321B2 JP4162321B2 (en) | 2008-10-08 |
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| JP07320299A Expired - Lifetime JP4162321B2 (en) | 1999-03-18 | 1999-03-18 | Method for producing metal foil laminate |
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