JP2000277461A - 半導体素子の分離方法及び分離装置 - Google Patents

半導体素子の分離方法及び分離装置

Info

Publication number
JP2000277461A
JP2000277461A JP8307099A JP8307099A JP2000277461A JP 2000277461 A JP2000277461 A JP 2000277461A JP 8307099 A JP8307099 A JP 8307099A JP 8307099 A JP8307099 A JP 8307099A JP 2000277461 A JP2000277461 A JP 2000277461A
Authority
JP
Japan
Prior art keywords
wafer
sheet
semiconductor
semiconductor device
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8307099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000277461A5 (de
Inventor
Masato Matsuoka
真人 松岡
Hitoshi Odajima
均 小田島
Kazuyuki Futaki
和行 二木
Shoji Nakakuki
昌二 中久喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8307099A priority Critical patent/JP2000277461A/ja
Priority to US09/534,521 priority patent/US6602736B1/en
Publication of JP2000277461A publication Critical patent/JP2000277461A/ja
Priority to US10/600,706 priority patent/US20040083602A1/en
Publication of JP2000277461A5 publication Critical patent/JP2000277461A5/ja
Pending legal-status Critical Current

Links

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  • Dicing (AREA)
JP8307099A 1999-03-03 1999-03-26 半導体素子の分離方法及び分離装置 Pending JP2000277461A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8307099A JP2000277461A (ja) 1999-03-26 1999-03-26 半導体素子の分離方法及び分離装置
US09/534,521 US6602736B1 (en) 1999-03-03 2000-03-24 Method and apparatus for separating semiconductor chips
US10/600,706 US20040083602A1 (en) 1999-03-03 2003-06-23 Method and apparatus for separating semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8307099A JP2000277461A (ja) 1999-03-26 1999-03-26 半導体素子の分離方法及び分離装置

Publications (2)

Publication Number Publication Date
JP2000277461A true JP2000277461A (ja) 2000-10-06
JP2000277461A5 JP2000277461A5 (de) 2005-02-24

Family

ID=13791932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8307099A Pending JP2000277461A (ja) 1999-03-03 1999-03-26 半導体素子の分離方法及び分離装置

Country Status (1)

Country Link
JP (1) JP2000277461A (de)

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