JP2000277461A5 - - Google Patents
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- Publication number
- JP2000277461A5 JP2000277461A5 JP1999083070A JP8307099A JP2000277461A5 JP 2000277461 A5 JP2000277461 A5 JP 2000277461A5 JP 1999083070 A JP1999083070 A JP 1999083070A JP 8307099 A JP8307099 A JP 8307099A JP 2000277461 A5 JP2000277461 A5 JP 2000277461A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive sheet
- respect
- guide
- guide member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims 23
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 15
- 239000000853 adhesive Substances 0.000 claims 14
- 230000001070 adhesive effect Effects 0.000 claims 14
- 239000004065 semiconductor Substances 0.000 claims 10
- 230000032258 transport Effects 0.000 claims 7
- 238000001179 sorption measurement Methods 0.000 claims 5
- 238000000034 method Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8307099A JP2000277461A (ja) | 1999-03-26 | 1999-03-26 | 半導体素子の分離方法及び分離装置 |
| US09/534,521 US6602736B1 (en) | 1999-03-03 | 2000-03-24 | Method and apparatus for separating semiconductor chips |
| US10/600,706 US20040083602A1 (en) | 1999-03-03 | 2003-06-23 | Method and apparatus for separating semiconductor chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8307099A JP2000277461A (ja) | 1999-03-26 | 1999-03-26 | 半導体素子の分離方法及び分離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000277461A JP2000277461A (ja) | 2000-10-06 |
| JP2000277461A5 true JP2000277461A5 (de) | 2005-02-24 |
Family
ID=13791932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8307099A Pending JP2000277461A (ja) | 1999-03-03 | 1999-03-26 | 半導体素子の分離方法及び分離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000277461A (de) |
-
1999
- 1999-03-26 JP JP8307099A patent/JP2000277461A/ja active Pending
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