JP2000277885A - 電気コネクタおよびその製造方法 - Google Patents

電気コネクタおよびその製造方法

Info

Publication number
JP2000277885A
JP2000277885A JP11081474A JP8147499A JP2000277885A JP 2000277885 A JP2000277885 A JP 2000277885A JP 11081474 A JP11081474 A JP 11081474A JP 8147499 A JP8147499 A JP 8147499A JP 2000277885 A JP2000277885 A JP 2000277885A
Authority
JP
Japan
Prior art keywords
housing
package
terminals
female
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11081474A
Other languages
English (en)
Japanese (ja)
Inventor
Asma Eddy
エディ・アズマ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI Americas Technology LLC
Original Assignee
Berg Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berg Technology Inc filed Critical Berg Technology Inc
Priority to JP11081474A priority Critical patent/JP2000277885A/ja
Priority to SG200001510A priority patent/SG86382A1/en
Priority to EP00105368A priority patent/EP1039542B1/de
Priority to DE60033880T priority patent/DE60033880T2/de
Priority to AT00105368T priority patent/ATE357073T1/de
Priority to US09/532,548 priority patent/US6328577B1/en
Publication of JP2000277885A publication Critical patent/JP2000277885A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Materials For Medical Uses (AREA)
  • Electron Tubes For Measurement (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP11081474A 1999-03-25 1999-03-25 電気コネクタおよびその製造方法 Withdrawn JP2000277885A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP11081474A JP2000277885A (ja) 1999-03-25 1999-03-25 電気コネクタおよびその製造方法
SG200001510A SG86382A1 (en) 1999-03-25 2000-03-15 Connector set
EP00105368A EP1039542B1 (de) 1999-03-25 2000-03-17 Verbindersatz
DE60033880T DE60033880T2 (de) 1999-03-25 2000-03-17 Verbindersatz
AT00105368T ATE357073T1 (de) 1999-03-25 2000-03-17 Verbindersatz
US09/532,548 US6328577B1 (en) 1999-03-25 2000-03-22 High density electric connector set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11081474A JP2000277885A (ja) 1999-03-25 1999-03-25 電気コネクタおよびその製造方法

Publications (1)

Publication Number Publication Date
JP2000277885A true JP2000277885A (ja) 2000-10-06

Family

ID=13747412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11081474A Withdrawn JP2000277885A (ja) 1999-03-25 1999-03-25 電気コネクタおよびその製造方法

Country Status (6)

Country Link
US (1) US6328577B1 (de)
EP (1) EP1039542B1 (de)
JP (1) JP2000277885A (de)
AT (1) ATE357073T1 (de)
DE (1) DE60033880T2 (de)
SG (1) SG86382A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10257527A1 (de) * 2002-12-10 2004-06-24 Marquardt Gmbh Schaltungsträger

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3741934B2 (ja) * 2000-05-10 2006-02-01 シャープ株式会社 フレキシブル基板の端子接続装置
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6979238B1 (en) 2004-06-28 2005-12-27 Samtec, Inc. Connector having improved contacts with fusible members
US7371131B2 (en) * 2005-04-04 2008-05-13 Fci Americas Technology, Inc. Connector having retentive rib
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US8183155B1 (en) * 2011-03-30 2012-05-22 Hon Hai Precision Ind. Co., Ltd. Lower profile connector assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5593322A (en) 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
US5702255A (en) * 1995-11-03 1997-12-30 Advanced Interconnections Corporation Ball grid array socket assembly
US5746608A (en) * 1995-11-30 1998-05-05 Taylor; Attalee S. Surface mount socket for an electronic package, and contact for use therewith
US5730606A (en) 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
SG71046A1 (en) * 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
JPH10275662A (ja) * 1997-03-26 1998-10-13 Whitaker Corp:The １対の基板間の電気的接続方法、電気的接続構造、電気コネクタ及び電子回路モジュール
US5876219A (en) * 1997-08-29 1999-03-02 The Whitaker Corp. Board-to-board connector assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10257527A1 (de) * 2002-12-10 2004-06-24 Marquardt Gmbh Schaltungsträger

Also Published As

Publication number Publication date
EP1039542A3 (de) 2001-03-14
US6328577B1 (en) 2001-12-11
SG86382A1 (en) 2002-02-19
DE60033880D1 (de) 2007-04-26
EP1039542A2 (de) 2000-09-27
EP1039542B1 (de) 2007-03-14
DE60033880T2 (de) 2007-12-06
ATE357073T1 (de) 2007-04-15

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060314

A761 Written withdrawal of application

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Effective date: 20070530