SG86382A1 - Connector set - Google Patents
Connector setInfo
- Publication number
- SG86382A1 SG86382A1 SG200001510A SG200001510A SG86382A1 SG 86382 A1 SG86382 A1 SG 86382A1 SG 200001510 A SG200001510 A SG 200001510A SG 200001510 A SG200001510 A SG 200001510A SG 86382 A1 SG86382 A1 SG 86382A1
- Authority
- SG
- Singapore
- Prior art keywords
- housing
- electric connector
- solder ball
- projection
- housings
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/931—Conductive coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Materials For Medical Uses (AREA)
- Electron Tubes For Measurement (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11081474A JP2000277885A (ja) | 1999-03-25 | 1999-03-25 | 電気コネクタおよびその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG86382A1 true SG86382A1 (en) | 2002-02-19 |
Family
ID=13747412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200001510A SG86382A1 (en) | 1999-03-25 | 2000-03-15 | Connector set |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6328577B1 (de) |
| EP (1) | EP1039542B1 (de) |
| JP (1) | JP2000277885A (de) |
| AT (1) | ATE357073T1 (de) |
| DE (1) | DE60033880T2 (de) |
| SG (1) | SG86382A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3741934B2 (ja) * | 2000-05-10 | 2006-02-01 | シャープ株式会社 | フレキシブル基板の端子接続装置 |
| US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
| DE10257527A1 (de) * | 2002-12-10 | 2004-06-24 | Marquardt Gmbh | Schaltungsträger |
| US6979238B1 (en) | 2004-06-28 | 2005-12-27 | Samtec, Inc. | Connector having improved contacts with fusible members |
| US7371131B2 (en) * | 2005-04-04 | 2008-05-13 | Fci Americas Technology, Inc. | Connector having retentive rib |
| US7623034B2 (en) | 2005-04-25 | 2009-11-24 | Avery Dennison Corporation | High-speed RFID circuit placement method and device |
| US8183155B1 (en) * | 2011-03-30 | 2012-05-22 | Hon Hai Precision Ind. Co., Ltd. | Lower profile connector assembly |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0836243A2 (de) * | 1996-10-10 | 1998-04-15 | Berg Electronics Manufacturing B.V. | Steckverbinder hoher Kontaktdichte und Herstellungsverfahren |
| US5876219A (en) * | 1997-08-29 | 1999-03-02 | The Whitaker Corp. | Board-to-board connector assembly |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
| US5593322A (en) | 1995-01-17 | 1997-01-14 | Dell Usa, L.P. | Leadless high density connector |
| US5702255A (en) * | 1995-11-03 | 1997-12-30 | Advanced Interconnections Corporation | Ball grid array socket assembly |
| US5746608A (en) * | 1995-11-30 | 1998-05-05 | Taylor; Attalee S. | Surface mount socket for an electronic package, and contact for use therewith |
| US5730606A (en) | 1996-04-02 | 1998-03-24 | Aries Electronics, Inc. | Universal production ball grid array socket |
| US6024584A (en) * | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
| JPH10275662A (ja) * | 1997-03-26 | 1998-10-13 | Whitaker Corp:The | 1対の基板間の電気的接続方法、電気的接続構造、電気コネクタ及び電子回路モジュール |
-
1999
- 1999-03-25 JP JP11081474A patent/JP2000277885A/ja not_active Withdrawn
-
2000
- 2000-03-15 SG SG200001510A patent/SG86382A1/en unknown
- 2000-03-17 DE DE60033880T patent/DE60033880T2/de not_active Expired - Fee Related
- 2000-03-17 EP EP00105368A patent/EP1039542B1/de not_active Expired - Lifetime
- 2000-03-17 AT AT00105368T patent/ATE357073T1/de not_active IP Right Cessation
- 2000-03-22 US US09/532,548 patent/US6328577B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0836243A2 (de) * | 1996-10-10 | 1998-04-15 | Berg Electronics Manufacturing B.V. | Steckverbinder hoher Kontaktdichte und Herstellungsverfahren |
| US5876219A (en) * | 1997-08-29 | 1999-03-02 | The Whitaker Corp. | Board-to-board connector assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60033880D1 (de) | 2007-04-26 |
| US6328577B1 (en) | 2001-12-11 |
| JP2000277885A (ja) | 2000-10-06 |
| DE60033880T2 (de) | 2007-12-06 |
| EP1039542B1 (de) | 2007-03-14 |
| ATE357073T1 (de) | 2007-04-15 |
| EP1039542A2 (de) | 2000-09-27 |
| EP1039542A3 (de) | 2001-03-14 |
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