JP2000500811A - 変性エポキシシロキサン縮合体、その製造方法および電子技術および電気技術のための低ストレス注型樹脂としてのその利用 - Google Patents
変性エポキシシロキサン縮合体、その製造方法および電子技術および電気技術のための低ストレス注型樹脂としてのその利用Info
- Publication number
- JP2000500811A JP2000500811A JP10508363A JP50836398A JP2000500811A JP 2000500811 A JP2000500811 A JP 2000500811A JP 10508363 A JP10508363 A JP 10508363A JP 50836398 A JP50836398 A JP 50836398A JP 2000500811 A JP2000500811 A JP 2000500811A
- Authority
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- Prior art keywords
- groups
- condensation
- group
- epoxy
- condensate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000008569 process Effects 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 title claims description 26
- 239000011347 resin Substances 0.000 title claims description 26
- 239000004593 Epoxy Substances 0.000 title claims description 20
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title claims description 20
- 238000005266 casting Methods 0.000 title description 9
- 238000005516 engineering process Methods 0.000 title description 3
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 150000001875 compounds Chemical class 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 238000009472 formulation Methods 0.000 claims abstract description 4
- 238000011065 in-situ storage Methods 0.000 claims abstract description 4
- 238000009833 condensation Methods 0.000 claims description 60
- 230000005494 condensation Effects 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 125000003545 alkoxy group Chemical group 0.000 claims description 17
- 150000002894 organic compounds Chemical class 0.000 claims description 17
- 125000000524 functional group Chemical group 0.000 claims description 14
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 239000012778 molding material Substances 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000002887 hydroxy group Chemical class [H]O* 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 6
- 125000005843 halogen group Chemical class 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 125000003700 epoxy group Chemical class 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000007859 condensation product Substances 0.000 claims description 4
- 150000003951 lactams Chemical class 0.000 claims description 4
- 125000002092 orthoester group Chemical group 0.000 claims description 4
- 125000002577 pseudohalo group Chemical group 0.000 claims description 4
- 125000004185 ester group Chemical class 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 125000000686 lactone group Chemical class 0.000 claims description 3
- 125000003003 spiro group Chemical group 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000035484 reaction time Effects 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 239000000047 product Substances 0.000 description 13
- -1 siloxanes Chemical class 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 235000019441 ethanol Nutrition 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 230000001588 bifunctional effect Effects 0.000 description 5
- 239000007858 starting material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000005809 transesterification reaction Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- HIPPBUJQSIICJN-UHFFFAOYSA-N 3385-61-3 Chemical compound C12CC=CC2C2CC(O)C1C2 HIPPBUJQSIICJN-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 101000801643 Homo sapiens Retinal-specific phospholipid-transporting ATPase ABCA4 Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 102100033617 Retinal-specific phospholipid-transporting ATPase ABCA4 Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- HVYWMOMLDIMFJA-DPAQBDIFSA-N cholesterol Chemical compound C1C=C2C[C@@H](O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2 HVYWMOMLDIMFJA-DPAQBDIFSA-N 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003398 denaturant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GJCHQPZGGYMKOK-UHFFFAOYSA-N dihydroxy(phenyl)silane Chemical compound O[SiH](O)C1=CC=CC=C1 GJCHQPZGGYMKOK-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003925 fat Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- KCIKCCHXZMLVDE-UHFFFAOYSA-N silanediol Chemical compound O[SiH2]O KCIKCCHXZMLVDE-UHFFFAOYSA-N 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 230000002110 toxicologic effect Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229940075420 xanthine Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.下記の縮合工程 a)一般構造1のエポキシアルコキシシロキサンと、 一般構造2のシラノール との縮合 〔式中、 R1は、炭素原子1〜22個を有するアルキル基またはアリール基を表し、 R2は、グリシジルオキシアルキル基、エポキシアルキル基またはエポキシシ クロアルキル基であり、二種の基、 R3は、互いに独立して、OR1またはR2または別のアルキル基ならびにアリ ール基を表し、 R4は、アルキル基またはアリール基を表し、 基 R5は、互いに独立して、OHまたはR4を表し、かつ nは、1より大きい整数である〕 および b)このようにして得られたアルコキシ基を有するエポキシシロキサン縮合体 と、線状、分枝状または環状、場合によれば芳香族で、炭素原子1〜24個から なる炭素骨格および少なくとも一個の縮合可能な官能基を有する有機化合物の化 学量論的量との縮合 により得られる変性エポキシシロキサン縮合体。 2.縮合工程b)において、使用される有機化合物が、少なくとも一個の縮合可 能な官能基の他に、付加的にさらに別の反応性基を有する、請求項1記載の変性 エポキシシロキサン縮合体。 3.付加的な反応性基が、任意で互いに独立して、ヒドロキシル基、エポキシ基 、エステル基、ラクトン基、ラクタム基、ハロゲン基および/または擬ハロゲン 官能基の系列および/または不飽和C−C結合の基および/またはスピロオルト エステル基および/またはビシクロオルトエステル基および/またはスピロカル ボナート基の群から選択されている、請求項2記載の変性エポキシシロキサン縮 合体。 4.第一の工程において a)エポキシシラン1をシラノール2と縮合させ、その際、1および2は請求 項1記載の化合物であり、かつシラノール2の反応終了の後に別の縮合工程にお いて b)このようにして得られたアルコキシ基を有する エポキシシロキサン縮合体を現場において、線状、分枝状または環状、場合によ れば芳香族で、炭素原子1〜24個から成る炭素骨格および少なくとも一個の縮 合可能な官能基を有する有機化合物と反応させることを特徴とするエポキシシロ キサンの変性のための方法。 5.工程b)において使用される有機化合物が、少なくとも一個の縮合可能な官 能基の他に付加的にさらに別の反応性基を有する、請求項4記載の方法。 6.付加的な反応性基が、任意で互いに独立して、ヒドロキシル基、エポキシ基 、エステル基、ラクトン基、ラクタム基、ハロゲン基および/または擬ハロゲン 官能基の系列および/または不飽和C−C結合の基および/またはスピロオルト エステル基および/またはビシクロオルトエステル基および/またはスピロカル ボナート基の群から選択されている、請求項5記載の方法。 7.縮合が、縮合触媒の存在下で、有利にはpH5〜8において実施される、請 求項4から6のいずれかに記載の方法。 8.縮合が、バルク反応として実施される、請求項4から7のいずれかに記載の 方法。 9.縮合が温度80℃〜150℃において実施される、請求項4から8のいずれ かに記載の方法。 10.エポキシアルコキシシラン1の縮合が、化学量 論的に不足量のシラノール2と一緒にして実施される、請求項4から9のいずれ かに記載の方法。 11.揮発性成分が縮合の間に不活性気体流の中に放出される、請求項4から1 0のいずれかに記載の方法。 12.縮合生成物が、2〜24時間、有利には6〜8時間の種々の反応時間の後 に分離される、請求項4から11のいずれかに記載の方法。 13.縮合により得られる反応生成物に、縮合の終了時において、貯蔵安定性を 高くするために真空中の熱処理を行う、請求項4から12のいずれかに記載の方 法。 14.エポキシ樹脂を第一縮合工程a)の前または後または第二縮合工程b)の 後において加えることができる、慣用のエポキシ樹脂との混合のための樹脂成分 としての請求項1から3のいずれかに記載の変性エポキシシロキサン縮合体の使 用。 15.成形体または成形材料の形成のための配合物を製造するための請求項14 記載の混合物の使用。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19630319.2 | 1996-07-26 | ||
| DE19630319A DE19630319C1 (de) | 1996-07-26 | 1996-07-26 | Modifiziertes Epoxysiloxan Kondensat, Verfahren zu dessen Herstellung und dessen Einsatz als Low-Stress-Gießharz für die Elektronik und Elektrotechnik |
| PCT/DE1997/001303 WO1998004609A1 (de) | 1996-07-26 | 1997-06-23 | Modifiziertes epoxysiloxan-kondensat, verfahren zu dessen herstellung und dessen einsatz als low-stress-giessharz für die elektronik und die elektrotechnik |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000500811A true JP2000500811A (ja) | 2000-01-25 |
| JP3266275B2 JP3266275B2 (ja) | 2002-03-18 |
Family
ID=7801016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50836398A Expired - Fee Related JP3266275B2 (ja) | 1996-07-26 | 1997-06-23 | 変性エポキシシロキサン縮合体、その製造方法および電子技術および電気技術のための低ストレス注型樹脂としてのその利用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6248854B1 (ja) |
| EP (1) | EP0914362A1 (ja) |
| JP (1) | JP3266275B2 (ja) |
| CN (1) | CN1226263A (ja) |
| DE (1) | DE19630319C1 (ja) |
| TW (1) | TW494112B (ja) |
| WO (1) | WO1998004609A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006508216A (ja) * | 2002-12-02 | 2006-03-09 | アールピーオー・ピーティワイ・リミテッド | ポリシロキサンの製造方法およびその使用 |
| JP2010229346A (ja) * | 2009-03-27 | 2010-10-14 | Asahi Kasei Chemicals Corp | 絶縁性樹脂組成物、それを用いた半導体装置及び絶縁性樹脂組成物の製造方法 |
| WO2011108516A1 (ja) * | 2010-03-02 | 2011-09-09 | 日本化薬株式会社 | オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003254564A1 (en) * | 2003-07-22 | 2005-02-25 | Canon Kabushiki Kaisha | Liquid-repellent coating composition and coating having high alkali resistance |
| DE60324157D1 (de) * | 2003-07-22 | 2008-11-27 | Leibniz Inst Neue Materialien | Flüssigkeitsabweisende, alkali-beständige beschichtungszusammensetzung und beschichtungsmuster. |
| WO2005040245A1 (ja) * | 2003-10-24 | 2005-05-06 | Nippon Kayaku Kabushiki Kaisha | 感光性樹脂組成物及びその硬化皮膜を有するフィルム |
| KR100614976B1 (ko) * | 2004-04-12 | 2006-08-25 | 한국과학기술원 | 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법 |
| DE102005002960A1 (de) | 2005-01-21 | 2006-08-03 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität |
| DE102006033280A1 (de) * | 2006-07-18 | 2008-01-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrostrukturierte Schichten |
| US20080255318A1 (en) * | 2006-11-21 | 2008-10-16 | Momentive Performance Materials Inc. | Organosilicone compositions and methods for preparing them |
| DE102012202161A1 (de) | 2012-02-14 | 2013-08-14 | Elantas Gmbh | Elektroisolierharz auf Basis von Isohexiddioldiglycidethern |
| KR102146668B1 (ko) * | 2017-05-31 | 2020-08-21 | 코오롱인더스트리 주식회사 | 코팅용 수지 조성물 및 이의 경화물을 코팅층으로 포함하는 코팅필름 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US178274A (en) * | 1876-06-06 | Improvement in exhaust-pipes for steam-hammers | ||
| US902739A (en) * | 1908-08-17 | 1908-11-03 | Alfred Kandall | Phonograph-stopping attachment. |
| DE3738634C2 (de) * | 1986-11-13 | 1996-11-14 | Sunstar Engineering Inc | Epoxyharzmasse mit darin dispergierten Siliconharzteilchen |
| DE4022661A1 (de) | 1990-07-17 | 1992-01-23 | Bayer Ag | Verfahren zur hertellung von poly(diorganosiloxanen) mit alkoxyendgruppen |
| JP3367964B2 (ja) * | 1992-04-21 | 2003-01-20 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US5280098A (en) | 1992-09-30 | 1994-01-18 | Dow Corning Corporation | Epoxy-functional silicone resin |
| WO1995006050A1 (de) | 1993-08-24 | 1995-03-02 | Siemens Aktiengesellschaft | Verfahren zur herstellung von epoxysiloxanen |
| DE4328466C1 (de) | 1993-08-24 | 1995-04-13 | Siemens Ag | Siloxanhaltiges Gießharzsystem |
-
1996
- 1996-07-26 DE DE19630319A patent/DE19630319C1/de not_active Expired - Fee Related
-
1997
- 1997-06-23 US US09/230,505 patent/US6248854B1/en not_active Expired - Fee Related
- 1997-06-23 CN CN97196765A patent/CN1226263A/zh active Pending
- 1997-06-23 EP EP97932704A patent/EP0914362A1/de not_active Withdrawn
- 1997-06-23 JP JP50836398A patent/JP3266275B2/ja not_active Expired - Fee Related
- 1997-06-23 WO PCT/DE1997/001303 patent/WO1998004609A1/de not_active Ceased
- 1997-07-03 TW TW086109379A patent/TW494112B/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006508216A (ja) * | 2002-12-02 | 2006-03-09 | アールピーオー・ピーティワイ・リミテッド | ポリシロキサンの製造方法およびその使用 |
| JP2010229346A (ja) * | 2009-03-27 | 2010-10-14 | Asahi Kasei Chemicals Corp | 絶縁性樹脂組成物、それを用いた半導体装置及び絶縁性樹脂組成物の製造方法 |
| WO2011108516A1 (ja) * | 2010-03-02 | 2011-09-09 | 日本化薬株式会社 | オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物 |
| JP5730852B2 (ja) * | 2010-03-02 | 2015-06-10 | 日本化薬株式会社 | オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3266275B2 (ja) | 2002-03-18 |
| WO1998004609A1 (de) | 1998-02-05 |
| TW494112B (en) | 2002-07-11 |
| US6248854B1 (en) | 2001-06-19 |
| CN1226263A (zh) | 1999-08-18 |
| EP0914362A1 (de) | 1999-05-12 |
| DE19630319C1 (de) | 1998-04-23 |
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