JP2003100604A5 - - Google Patents

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Publication number
JP2003100604A5
JP2003100604A5 JP2001291854A JP2001291854A JP2003100604A5 JP 2003100604 A5 JP2003100604 A5 JP 2003100604A5 JP 2001291854 A JP2001291854 A JP 2001291854A JP 2001291854 A JP2001291854 A JP 2001291854A JP 2003100604 A5 JP2003100604 A5 JP 2003100604A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2001291854A
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JP5062933B2 (ja
JP2003100604A (ja
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Priority to JP2001291854A priority Critical patent/JP5062933B2/ja
Priority claimed from JP2001291854A external-priority patent/JP5062933B2/ja
Priority to US10/234,378 priority patent/US7224459B2/en
Publication of JP2003100604A publication Critical patent/JP2003100604A/ja
Publication of JP2003100604A5 publication Critical patent/JP2003100604A5/ja
Application granted granted Critical
Publication of JP5062933B2 publication Critical patent/JP5062933B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001291854A 2001-09-25 2001-09-25 露光装置、位置合わせ方法、プログラム、コンピュータ可読媒体、デバイスの製造方法 Expired - Fee Related JP5062933B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001291854A JP5062933B2 (ja) 2001-09-25 2001-09-25 露光装置、位置合わせ方法、プログラム、コンピュータ可読媒体、デバイスの製造方法
US10/234,378 US7224459B2 (en) 2001-09-25 2002-09-05 Exposure apparatus, method of controlling same, method of manufacturing devices, computer-readable memory and program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001291854A JP5062933B2 (ja) 2001-09-25 2001-09-25 露光装置、位置合わせ方法、プログラム、コンピュータ可読媒体、デバイスの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011198858A Division JP5632810B2 (ja) 2011-09-12 2011-09-12 露光装置、ショット補正パラメータの決定方法、プログラム、コンピュータ可読媒体、デバイス製造方法および位置合わせ装置

Publications (3)

Publication Number Publication Date
JP2003100604A JP2003100604A (ja) 2003-04-04
JP2003100604A5 true JP2003100604A5 (ja) 2008-11-13
JP5062933B2 JP5062933B2 (ja) 2012-10-31

Family

ID=19113928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001291854A Expired - Fee Related JP5062933B2 (ja) 2001-09-25 2001-09-25 露光装置、位置合わせ方法、プログラム、コンピュータ可読媒体、デバイスの製造方法

Country Status (2)

Country Link
US (1) US7224459B2 (ja)
JP (1) JP5062933B2 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3913151B2 (ja) * 2002-09-10 2007-05-09 キヤノン株式会社 露光装置のパラメータの値を最適化する方法及びシステム、露光装置及び露光方法
TW594434B (en) 2003-04-30 2004-06-21 Nanya Technology Corp Exposure system and method
US7250237B2 (en) 2003-12-23 2007-07-31 Asml Netherlands B.V. Optimized correction of wafer thermal deformations in a lithographic process
JP2006259715A (ja) * 2005-02-21 2006-09-28 Fuji Photo Film Co Ltd 描画方法、描画装置、描画システムおよび補正方法
US8411271B2 (en) * 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
KR100817092B1 (ko) 2007-03-14 2008-03-26 삼성전자주식회사 중첩계측오차를 보정하기 위한 계측시스템 및 이를 이용한계측방법
JP5632810B2 (ja) * 2011-09-12 2014-11-26 キヤノン株式会社 露光装置、ショット補正パラメータの決定方法、プログラム、コンピュータ可読媒体、デバイス製造方法および位置合わせ装置
NL2009345A (en) 2011-09-28 2013-04-02 Asml Netherlands Bv Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods.
US9703214B2 (en) * 2013-07-19 2017-07-11 Canon Kabushiki Kaisha Lithography apparatus, lithography method, and article manufacturing method
CN105043314B (zh) * 2015-04-30 2017-11-21 东莞市神州视觉科技有限公司 一种用于锡膏检测精度检验的棱台参数测量方法和系统
CN114690593B (zh) * 2020-12-30 2024-06-11 科磊股份有限公司 一种制造集成电路的方法和系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4780617A (en) * 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPH07120621B2 (ja) * 1989-05-08 1995-12-20 キヤノン株式会社 位置合せ方法
JP3245859B2 (ja) * 1989-09-08 2002-01-15 株式会社日立製作所 半導体装置の製造装置
JPH04107465A (ja) * 1990-08-28 1992-04-08 Fujitsu Ltd 縮小投影露光方法
US5561606A (en) * 1991-08-30 1996-10-01 Nikon Corporation Method for aligning shot areas on a substrate
JP3348918B2 (ja) 1993-01-21 2002-11-20 株式会社ニコン 位置合わせ方法、該方法を用いた露光方法、及びデバイス製造方法
US6278957B1 (en) * 1993-01-21 2001-08-21 Nikon Corporation Alignment method and apparatus therefor
KR100377887B1 (ko) * 1994-02-10 2003-06-18 가부시키가이샤 니콘 정렬방법
JPH07335524A (ja) * 1994-06-06 1995-12-22 Canon Inc 位置合わせ方法
JPH09266164A (ja) 1996-03-28 1997-10-07 Canon Inc 位置合わせ方法および装置
JP3900562B2 (ja) * 1996-10-18 2007-04-04 ソニー株式会社 露光装置
AU6000499A (en) * 1998-09-30 2000-04-17 Nikon Corporation Alignment method and method for producing device using the alignment method
US20020042664A1 (en) * 2000-05-31 2002-04-11 Nikon Corporation Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus
US6482713B2 (en) * 2000-08-01 2002-11-19 Texas Instruments Incorporated Shot averaging for fine pattern alignment with minimal throughput loss

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