JP2003190840A - Fluid discharge nozzle, substrate processing apparatus and substrate processing method using the fluid discharge nozzle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fluid discharge nozzle capable of uniformly supplying a fluid over a wide range, a substrate processing apparatus and a substrate processing method using the fluid discharge nozzle. SOLUTION: The fluid discharge nozzle includes a fluid supply port 12 provided at one end of a nozzle body 11 and the fluid supply port 1.
The fluid outlet 13 provided at the other end of the nozzle body 11 opposite to the fluid outlet 2 is connected to the fluid supply port 12 and the fluid outlet 13, and the fluid having an elongated cross section perpendicular to the fluid flow is formed. Having a passage 14, and in the cross section of the fluid passage 14, the length in the longitudinal direction is larger from the fluid supply port 12 side toward the fluid discharge port 13 side, and the length in the transverse direction is In the fluid discharge nozzle which is smaller from the fluid supply port 12 toward the fluid discharge port 13, the cross section of the fluid passage 14 in the longitudinal direction is the fluid supply port 1.
It is characterized in that it has a curved surface such that the fluid passage 14 is enlarged from the second side toward the fluid discharge port 13 side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluid discharge nozzle for performing a surface treatment on a substrate to be processed such as a semiconductor substrate or a glass substrate, a substrate processing apparatus and a substrate processing method using the fluid discharge nozzle, and more particularly to a processing target. The present invention relates to the structure of a fluid discharge nozzle that supplies a chemical solution onto a substrate.

[0002]

2. Description of the Related Art In semiconductor devices and liquid crystal displays, various processing is performed on a processed substrate such as a silicon or glass substrate, and finally a fine pattern is formed to add a desired function.

In such various processes, not only a dry process using a gas but also a wet process using a chemical solution is widely used.

For example, a wet process is used in a developing process for forming a photosensitive resin pattern used for forming a fine pattern. That is, a photosensitive resin is applied on a film to be processed formed on a silicon or quartz substrate, and the photosensitive resin in a desired area is exposed using an exposure mask. In the mold, a wet process using a developing solution such as an organic solvent or an alkaline aqueous solution is used to remove the unexposed portion.

Further, the wet process is not limited to the above-mentioned developing process, and, for example, in the production of a chrome mask for exposure,
When a chrome film is formed on a quartz substrate, a photosensitive resin pattern is formed on the chrome film, and then the chrome film is etched by using the photosensitive resin pattern as a mask, a solution of ceric ammonium nitrate solution is also used. A wet process using the above is used.

Further, when etching the natural oxide film formed by the reaction between oxygen in the air and the silicon substrate, N
A wet process using H4F or diluted HF is used.

Furthermore, prior to the processing of the film to be processed, unnecessary organic substances adhering to the substrate to be processed are removed and cleaned, or the photosensitive resin pattern remaining on the substrate to be processed after the etching process is completed. When removing and cleaning
A wet process using a mixed chemical solution of sulfuric acid and hydrogen peroxide is used.

As the wet process, there is a dipping method in which a substrate to be processed is dipped in a chemical solution, or a spray or paddle method in which the chemical solution is supplied to the surface of the substrate to be processed. In recent years, the dipping method requires a large amount of chemical liquid in order to sufficiently immerse the substrate to be processed, and since the back surface of the substrate to be processed or the back surface is contaminated, a spraying or paddle method is being used.

Conventionally, in the spray or paddle method of this type, a fluid discharge nozzle for supplying a chemical liquid is arranged above a substrate to be processed, and one of the fluid discharge nozzle and the substrate to be processed is moved while being processed. A fluid is discharged onto the entire surface of the substrate and a chemical solution is supplied from a nozzle.

As the fluid discharge nozzle, a nozzle having a structure capable of discharging a fluid in a curtain shape and in a wide range is used as the substrate to be processed becomes large.

FIG. 6 is a sectional view showing the above-mentioned conventional fluid discharge nozzle, FIG. 6 (a) is a sectional view seen from the front, and FIG. 6 (b) is a sectional view seen from the side.

As shown in the figure, the nozzle body 100 has two
Made by laminating two base plates 100a and 100b together,
The shape seen from the front has a triangular structure, and the shape seen from the side has an inverted triangular structure.

A fluid supply port 101, which is connected to a fluid supply mechanism (not shown) and is supplied with fluid from the fluid supply mechanism, is formed at the upper end of the nozzle body 100, and the fluid is externally supplied at the lower end. The slit-shaped fluid discharge ports 102 for discharging the liquid are respectively formed.

A fluid passage 103 is formed in the nozzle body 100 for guiding the fluid from the fluid supply port 101 to the fluid discharge port 102.

When viewed from the front, the fluid passage 103 is formed in a structure in which the width (water channel width) is expanded linearly as it goes from the fluid supply port 101 to the fluid discharge port 102. When viewed, the width (water channel thickness) is formed in a linear function from the fluid supply port 101 toward the fluid discharge port 102.

[0016]

The above-mentioned conventional fluid discharge nozzle has the following problems.

FIG. 7 shows changes in the cross-sectional area of the water channel width and water channel thickness along the fluid channel of the fluid discharge nozzle. As shown in FIG. 7, when the passage width and the passage thickness of the fluid passage are changed in a linear function, the cross-sectional area becomes a quadratic function, and the cross-sectional area increases and then decreases in the middle of the passage. In this way, if there is an inflection point in the cross-sectional area, the fluid concentrates in the low pressure portion at this portion, and the flow rate becomes nonuniform in the longitudinal direction at the fluid discharge port. The film may be cut off.

Therefore, in the wet process using the fluid discharge nozzle, it is difficult to uniformly supply the chemical liquid to the entire surface of the substrate to be processed, which may deteriorate the processing accuracy and uniformity of the fine pattern. There is.

The present invention has been made in view of the above problems, and an object thereof is a fluid discharge nozzle capable of uniformly supplying a fluid in a wide range, a substrate processing apparatus using the fluid discharge nozzle, and It is to provide a substrate processing method.

[0020]

In order to achieve the above object, a fluid discharge nozzle according to a first invention (claim 1) is a fluid supply port provided at one end of a nozzle body, and the fluid supply nozzle. A fluid discharge port provided at the other end of the nozzle body opposite to the mouth, a fluid passage that connects the fluid supply port and the fluid discharge port, and has a slender cross section perpendicular to the fluid. The longitudinal length of the fluid passage in the cross section is
Larger from the fluid supply port side toward the discharge port side,
Further, in a fluid discharge nozzle whose length in the lateral direction is small from the fluid supply port toward the fluid discharge port, the longitudinal cross section of the fluid passage extends from the fluid supply port side toward the discharge port side. It has a curved surface that expands the fluid passage.

Further, it is preferable that the fluid discharge port has a curved surface shape protruding in the fluid discharge direction.

A fluid discharge nozzle according to a second invention (claim 2) is provided at a fluid supply port provided at one end of the nozzle body and at the other end of the nozzle body opposite to the fluid supply port. A fluid discharge port, and a fluid passage that connects the fluid supply port and the fluid discharge port and has a slender cross-sectional shape perpendicular to the fluid. Is a fluid discharge nozzle that is large from the fluid supply port side toward the discharge port side and has a short length in the fluid passage in the fluid passage from the fluid supply port toward the fluid discharge port. It is characterized by being filled with particles.

It is desirable that the particles have a particle diameter larger than the length of the cross section perpendicular to the fluid flow at the fluid discharge port in the shortest direction.

The fluid discharge nozzle is constructed by combining two plate-like members.

Furthermore, the substrate processing apparatus according to the third aspect of the present invention (claim 6) supplies a fluid to the substrate holding mechanism for holding the substrate to be processed substantially horizontally, a fluid discharge nozzle, and the discharge nozzle. And a moving mechanism for holding the discharge nozzle, moving the substrate above the substrate holding mechanism, and removing it from above the substrate holding mechanism.
The fluid discharge nozzle includes a fluid supply port provided at one end of the nozzle body, a fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, the fluid supply port and the fluid discharge port. A fluid passage having a slender cross-sectional shape perpendicular to the fluid, which is connected to the outlet, and has a longitudinal cross section in the transverse cross section of the fluid passage from the fluid supply port side toward the discharge port side. It is characterized in that it has a curved surface for enlarging the fluid passage, and a cross section in the lateral direction is formed smaller from the fluid supply port toward the fluid discharge port.

It is preferable that the fluid discharge port has a curved surface shape protruding in the fluid discharge direction.

Furthermore, a substrate processing apparatus according to a fourth aspect of the present invention (claim 8) is a substrate holding mechanism for holding a substrate to be processed substantially horizontally, a fluid discharge nozzle, and a fluid to the discharge nozzle. A fluid supply mechanism for supplying the discharge nozzle; and a moving mechanism for holding the discharge nozzle and moving it above the substrate holding mechanism and removing it from above the substrate holding mechanism. A fluid supply port provided at one end, a fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, the fluid supply port and the fluid discharge port are connected to each other, and the fluid is perpendicular to the fluid. The cross-sectional shape has an elongated fluid passage, and the cross-section in the longitudinal direction in the cross-section of the fluid passage is larger from the fluid supply port side toward the discharge port side, and the cross-section in the lateral direction is the Flow from the fluid supply port Small is formed toward the discharge port,
Further, the fluid passage is characterized in that it is filled with particles.

It is desirable that the particles have a particle size larger than the length of the cross section perpendicular to the fluid flow at the fluid discharge port in the shortest direction.

Further, in the above substrate processing apparatus, the fluid discharge port has a slit shape, and the length of the slit shape in the longitudinal direction is formed longer than the diagonal or diameter of the substrate to be processed. preferable.

Furthermore, in the substrate processing method according to the fifth aspect of the present invention (claim 11), the chemical liquid is supplied from the fluid discharge port of the fluid discharge nozzle to the substrate to be processed whose main surface is held substantially horizontal. At the same time, a substrate processing method for supplying a chemical liquid to the entire main surface of the substrate to be processed to perform chemical liquid treatment on the substrate to be processed by moving the substrate to be processed and the fluid discharge nozzle relatively, The discharge nozzle is a fluid supply port provided at one end of the nozzle body, and a fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port,
The fluid supply port and the fluid discharge port are connected to each other, and a fluid passage having a slender lateral cross section perpendicular to the fluid is provided, and a longitudinal cross section of the fluid passage in the cross section is the fluid supply port side. Has a curved surface that enlarges the fluid passage toward the discharge port side, and a cross section in the lateral direction is formed to be small from the fluid supply port toward the fluid discharge port. .

Further, in the substrate processing method according to the sixth aspect of the present invention (claim 12), the chemical liquid is supplied from the fluid discharge port of the fluid discharge nozzle to the substrate to be processed whose main surface is held substantially horizontal. At the same time, a substrate processing method for supplying a chemical liquid to the entire main surface of the substrate to be processed to perform chemical liquid treatment on the substrate to be processed by moving the substrate to be processed and the fluid discharge nozzle relatively, The discharge nozzle includes a fluid supply port provided at one end of the nozzle body, a fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, the fluid supply port and the fluid discharge port. And a fluid passage having an elongated cross-sectional shape perpendicular to the fluid, the cross-section in the longitudinal direction in the cross-sectional surface of the fluid passage is large from the fluid supply port side toward the discharge port side, The cross section in the lateral direction is the fluid Is smaller toward the fluid discharge port from the sheet inlet, and the fluid passage, is characterized in that the particles are filled.

In the substrate processing method, while the fluid discharge nozzle is fixed and the substrate to be processed is moved, a chemical solution is supplied from the fluid discharge nozzle to the main surface of the substrate to move the substrate to be processed. A thin chemical liquid film is formed on the surface.

On the main surface of the substrate to be processed, the chemical liquid is supplied from the fluid discharge nozzle to the main surface of the substrate to be processed while fixing the substrate to be processed and moving the fluid discharge nozzle. You may form a thin film | membrane chemical liquid film on it.

Furthermore, the processing of the substrate to be processed may be a developing process of a resist formed on the main surface of the substrate to be processed.

Here, the chemical solution means a developing solution, a rinsing solution, pure water, an etching solution, a cleaning solution, or the like.

[0036]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention (hereinafter referred to as embodiments) will be described below with reference to the drawings.

(First Embodiment) First, the first embodiment of the present invention
As an example of the substrate processing apparatus according to the embodiment, a substrate developing apparatus will be described with reference to FIG.

FIG. 1A is a schematic cross-sectional view showing the schematic structure of the substrate developing apparatus, and FIG. 1B is a schematic plan view of the substrate developing apparatus seen from above.

As shown in FIG. 1, the substrate developing apparatus 1 has a substrate holding mechanism 3 for holding the substrate 2 to be processed by a vacuum chuck and holding it substantially horizontally.

The substrate holding mechanism 3 is supported by a rotating mechanism 4 and is configured to rotate the substrate 2 to be processed.

Further, the substrate processing apparatus 1 has a developing solution discharge nozzle (fluid discharge nozzle) 10 for, for example, piling up a developing solution on the substrate 2 to be processed.

The developing solution discharge nozzle 10 has a moving mechanism 5
Is held by the substrate holding mechanism 3, and is moved above the substrate 2 to be processed held by the substrate holding mechanism 3 and removed from above the substrate 2 to be processed.

A fluid supply mechanism 6 including a chemical solution tank (not shown), a flow rate-adjustable valve 7, a chemical solution supply pipe 8 and the like is connected to the developer solution discharge nozzle 10 to supply the developer solution. It has become.

FIG. 2 is a sectional view showing the developing solution discharge nozzle, FIG. 2 (a) is a sectional view seen from the front, and FIG. 2 (b).
[Fig. 4] is a cross-sectional view seen from the side.

As shown in FIG. 2, the developing solution discharge nozzle 10 has a nozzle body 11.
Is formed by laminating two base plates 11a and 11b together, and has a triangular structure when viewed from the front and an inverted triangular structure when viewed from the side.

A developing solution supply port (fluid supply port) 12 is formed at the upper end of the nozzle body 11, and the developing solution is supplied to the developing solution supply port 12 by being connected to a fluid supply mechanism 6. It is like this.

Further, at the lower end of the nozzle body 11,
An elongated slit-shaped developer discharge port (fluid discharge port) 13 for discharging the developer to the outside is formed.

A fluid passage 14 for guiding the developing solution from the developing solution supply port 12 to the developing solution discharge port 13 is formed in the nozzle body 11.

The fluid passage 14 is formed such that its transverse cross section perpendicular to the fluid is elongated, for example, slit-like, and the longitudinal cross section of the fluid passage 14 extends from the fluid supply port 12 side to the fluid side. The cross section in the lateral direction is large toward the discharge port 13 side and is small from the fluid supply port 12 toward the fluid discharge port 13.

That is, when viewed from the front, it is formed in a structure in which the width (channel width) is expanded in a hyperbolic function from the fluid supply port 12 toward the fluid discharge port 13, that is, a structure having a curved surface (R). When viewed from the side, as in the conventional case, the fluid supply port 12 through the fluid discharge port 1
It is formed in a structure in which the width (channel thickness) is narrowed linearly as it goes to 3.

FIG. 3 shows changes in the cross-sectional area of the water channel width and the water channel thickness along the fluid channel of the fluid discharge nozzle.

As shown in FIG. 3, in the fluid discharge nozzle 10 of the present embodiment, the cross-sectional area monotonically decreases.
As a result, the fluid receives pressure from the wall surface of the fluid passage 14 when passing through the fluid passage 14, the flow rate at the fluid discharge port 13 spreads uniformly over the entire length in the longitudinal direction, and the curtain remains even after the discharge. -Shaped fluid film does not break.

Next, a case of developing using the above substrate developing apparatus will be described with reference to FIG.

As shown in FIG. 1, the fluid discharge nozzle 10
Is located at the side retracted position of the substrate holding mechanism 3 when the chemical liquid is not discharged. In this state, the substrate to be processed 2
Is placed on the substrate holding mechanism 3 and sucked by a vacuum chuck. A photosensitive resin is applied to the upper surface of the substrate 2 to be processed, and the photosensitive resin in a desired area is exposed using an exposure mask.

Next, while the substrate holding mechanism 3 is rotated, the fluid discharge nozzle 10 is moved from the retracted position to above the substrate 2 to be processed held by the substrate holding mechanism 3 by the moving mechanism 5. .

After the fluid discharge nozzle 10 is moved, a fluid supply mechanism 6 supplies a developing solution to the fluid discharge nozzle 10, and a fluid discharge port 13 supplies the developing solution onto the substrate 2 to be processed.

In addition to rotating the substrate to be processed, the developer may be supplied by moving the nozzle while the substrate to be processed is fixed, or by relatively moving the substrate to be processed and the nozzle. .

Then, after the developing solution is piled up in a thin film on the entire upper surface of the substrate 2 to be processed, the supply of the developing solution from the fluid discharge nozzle 10 is stopped. Then, the fluid discharge nozzle 10 is removed from above the substrate 2 to be processed by the moving mechanism 6 and moved to the retracted position.

After a predetermined time has elapsed, the substrate holding mechanism 3 rotates the substrate 2 to be processed at a high speed to shake off the developing solution deposited on the substrate 2 to be processed, and then the substrate holding mechanism 3 carries out the above-mentioned process. The substrate 2 to be processed is rotated at a low speed, and the substrate 2 to be processed is rinsed (cleaned) by a pure water discharge nozzle (not shown). When the rinsing is completed, the substrate holding mechanism 3 rotates the substrate 2 to be processed at high speed to drain and dry it.

Upon completion of the liquid-drying and drying, the holding by the substrate holding mechanism 3 is released, the substrate 2 to be processed is taken out and conveyed to the next step.

According to the above-described substrate developing apparatus, the fluid discharge nozzle 10 has a width in a hyperbolic function from the fluid supply port 12 toward the fluid discharge port 13 when the cross section perpendicular to the fluid is viewed from the front. Structure with expanded waterway width,
That is, it is formed in a structure having a curved surface (R), and when viewed from the side, the width (water channel thickness) is linearly narrowed from the fluid supply port 12 toward the fluid discharge port 13 as in the conventional case. It is formed in the structure.

Therefore, the cross-sectional area of the fluid passage 14 of the fluid discharge nozzle 10 monotonically decreases from the fluid supply port 12 toward the fluid discharge port 13. As a result, when the fluid passes through the fluid passage 14, the fluid passage 14
Upon receiving pressure from the wall surface, the flow rate at the fluid discharge port 13 spreads uniformly over the entire length in the longitudinal direction, and the curtain-shaped fluid film does not break even after discharge.

Therefore, in the substrate developing method using this substrate developing apparatus, the developing solution can be uniformly deposited on the entire upper surface of the substrate to be processed. Therefore, the development can be uniformly performed on the substrate to be processed.

(Second Embodiment) Next, the second embodiment of the present invention will be described.
The substrate developing apparatus according to the embodiment will be described.

This embodiment is the same as the first embodiment except that the structure of the fluid discharge nozzle is different.
Only the structure of the fluid discharge nozzle will be described.

FIG. 4 is a sectional view showing a fluid discharge nozzle,
FIG. 4A is a vertical sectional front view of the fluid discharge nozzle cut along the fluid flow, and FIG. 4B shows the fluid discharge nozzle cut along the fluid flow. It is the vertical side view seen.

As shown in FIG. 4, the developing solution discharge nozzle 20 has a nozzle body 21.
Is formed by bonding two base plates 21a and 21b together, and has a triangular structure when viewed from the front and an inverted triangular structure when viewed from the side.

A developing solution supply port (fluid supply port) 22 is formed at the upper end of the nozzle body 21, and the developing solution supply port 22 is connected to the fluid supply mechanism 7 shown in FIG. Are being supplied.

Further, at the lower end of the nozzle body 21,
An elongated slit-shaped developer discharge port (fluid discharge port) 23 for discharging the developer to the outside is formed.

Further, in the nozzle body 21, a fluid passage 24 for guiding the developing solution from the developing solution supply port 22 to the developing solution discharge port 23 is formed.

When viewed from the front, the fluid passage 24 is formed in a structure in which the width (water channel width) is expanded linearly as it goes from the fluid supply port 22 to the fluid discharge port 23. When viewed, the fluid supply port 22
To the fluid discharge port 23, the width (water channel thickness) is linearly reduced.

That is, the fluid passage 24 is formed in an elongated shape, for example, a slit shape, in a transverse cross section perpendicular to the fluid.
The transverse width of the fluid passage 24 in the longitudinal direction is larger from the fluid supply port 22 side toward the fluid discharge port 23 side, and the width in the lateral direction is from the fluid supply port 22 to the fluid discharge port 23. It is formed small toward.

Then, the fluid passage 24 is filled with small-sized particles 25 such as fine balls so as to fill the fluid passage. The particles are the fluid discharge port 23.
It has a particle size at least larger than the minimum thickness in the lateral direction so as not to flow out from the outside. As an example, when the minimum thickness in the lateral direction is about 0.1 mm, the diameter is about 0.
It is filled with particles having a particle size of 2 to 0.3 mm.

Further, it is desirable that the particles have resistance to a chemical solution used. For example, when the chemical solution used is inorganic, Teflon (registered trademark), zirconium or the like is used, and when it is organic, stainless steel or the like is used. The material of is used.

The structure other than the fluid discharge nozzle 20 is the same as the structure of the first embodiment shown in FIG.

According to the fluid discharge nozzle of the substrate developing apparatus in the second embodiment described above, the particles filled in the fluid passage cause the fluid to diffuse in the minute gaps between the particles due to the surface tension. The fluid is uniformly discharged to the outside along the entire length of the fluid discharge port.

Therefore, in the substrate developing method using this substrate developing apparatus, the developing solution can be uniformly deposited on the entire upper surface of the substrate to be processed. Therefore, the development can be uniformly performed on the substrate to be processed.

(Third Embodiment) Next, the third embodiment of the present invention will be described.
The substrate developing apparatus according to the embodiment will be described.

The present embodiment is the same as the first embodiment except that the structure of the fluid discharge nozzle is different.
Only the structure of the fluid discharge nozzle will be described.

FIG. 5 is a view showing a fluid discharge nozzle.
FIG. 5A is a perspective view showing a fluid discharge nozzle, FIG.
Is a vertical sectional front view of the fluid discharge nozzle cut along the fluid flow, viewed from the front, and FIG. 5C is a vertical sectional side view of the fluid discharge nozzle cut along the fluid flow, viewed from the side. Is.

As shown in FIG. 5, the developing solution discharge nozzle 30 has a nozzle body 31, and the nozzle body 31
Is formed by laminating two base plates 31a and 31b together, and the shape viewed from the front has a fan-shaped structure and the shape viewed from the side has an inverted triangular structure.

A developing solution supply port (fluid supply port) 32 is formed at the upper end of the nozzle body 31, and the developing solution supply port 32 is connected to the fluid supply mechanism 7 shown in FIG. Are being supplied.

Further, the lower end portion of the nozzle body 31 is formed in a curved surface shape projecting outward, and the lower end portion of the curved surface shape is an elongated slit-shaped developing solution for discharging the developing solution to the outside. A discharge port (fluid discharge port) 33 is formed along the curved surface.

A fluid passage 34 for guiding the developing solution from the developing solution supply port 32 to the developing solution discharge port 33 is formed in the nozzle body 31.

The fluid passage 34 is formed such that its transverse cross section perpendicular to the fluid is elongated, for example, slit-shaped, and the longitudinal cross section of the fluid passage 14 extends from the fluid supply port 32 side to the fluid side. The cross section in the lateral direction is formed to be large toward the discharge port 33 side and to be small toward the fluid discharge port 33 from the fluid supply port 32.

That is, when viewed from the front, it is formed in a structure in which the width (channel width) is expanded in a hyperbolic function manner from the fluid supply port 32 toward the fluid discharge port 33, that is, a structure having a curved surface (R). When viewed from the side, as in the conventional case, the fluid supply port 32 through the fluid discharge port 3
It is formed in a structure in which the width (channel thickness) is narrowed linearly as it goes to 3.

The structure other than the fluid discharge nozzle 30 is the same as the structure of the first embodiment shown in FIG.

According to the substrate developing apparatus of the third embodiment, the fluid discharge nozzle 30 is directed from the fluid supply port 32 toward the fluid discharge port 33 when the cross section perpendicular to the fluid is viewed from the front. Is formed in a structure having a hyperbolic function widening the width (channel width), that is, a structure having a curved surface (R), and when viewed from the side, the fluid supply port 32 to the fluid discharge port are formed in the same manner as in the conventional case. The width (channel thickness) is linearly reduced toward 33.

Therefore, the cross-sectional area of the fluid passage 34 of the fluid discharge nozzle 30 is from the fluid supply port 32 to the fluid discharge port 33.
Since the fluid monotonously decreases toward, the fluid receives pressure from the wall surface of the fluid passage 34 when passing through the fluid passage 34, and the flow rate at the fluid discharge port 33 spreads uniformly over the entire length in the longitudinal direction. .

Moreover, the fluid discharge port 33 is formed in a curved surface shape protruding in the fluid discharge direction. Therefore,
As in the case of the first embodiment, compared with a fluid discharge nozzle having a linear fluid discharge port, the fluid can be discharged uniformly in a wider area, and conversely, if the discharge range is the same, the fluid is discharged. The discharge nozzle can be downsized. Further, it is possible to discharge the fluid uniformly onto the surface of the substrate to be processed with a lower pressure to the fluid.

Therefore, in the substrate developing method using this substrate developing apparatus, the developing solution can be uniformly deposited on the entire upper surface of the substrate to be processed. Therefore, the development can be uniformly performed on the substrate to be processed.

The present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the spirit of the invention.

For example, in the first and third embodiments, the particles in the second embodiment may be filled in the fluid passage of the fluid discharge nozzle.

The present invention is not limited to the development processing step after exposure shown in the above-described embodiment, but also an etching step by a wet process for a semiconductor substrate, a liquid crystal substrate, or the like.
It can also be applied to a process such as a cleaning process for removing inorganic substances and a process for removing the photosensitive resin remaining after etching.

Further, the present invention is not limited to the spray type nozzle for ejecting the chemical liquid from a position distant from the substrate to be processed as in the above-mentioned embodiment, but is arranged close to the substrate to be processed to exude the chemical liquid. It can also be applied to a paddle system in which the liquid is piling up.

[0096]

As described above, according to the present invention, the fluid can be uniformly discharged onto the substrate to be processed in a wide range.

[Brief description of drawings]

1A and 1B are views showing a substrate developing apparatus according to a first embodiment of the present invention, FIG. 1A is a schematic sectional view showing a schematic configuration of a substrate developing apparatus, and FIG. 1B is a top view of the substrate developing apparatus. Schematic plan view.

FIG. 2 is a cross-sectional view showing a developing solution discharge nozzle in the substrate developing apparatus according to the first embodiment of the present invention, FIG.
The fluid discharge nozzle was cut along the flow of the fluid, and the vertical sectional front view was seen from the front. (B) is the vertical sectional side view which cut the fluid discharge nozzle along the flow of the fluid and was seen from the side.

3 is a diagram showing a change in cross-sectional area of a water channel width and a water channel thickness along a fluid passage of the fluid discharge nozzle of FIG.

FIG. 4 is a cross-sectional view showing a developing solution discharge nozzle in a substrate developing device according to a second embodiment of the present invention, and FIG.
4B is a vertical sectional front view of the fluid discharge nozzle cut along the fluid flow, viewed from the front. FIG. 4B is a vertical sectional side view of the fluid discharge nozzle cut along the fluid flow, viewed from the side. .

5A and 5B are views showing a developer discharge nozzle in a substrate developing apparatus according to a third embodiment of the present invention, FIG. 5A is a perspective view showing a fluid discharge nozzle, and FIG. FIG. 3C is a vertical cross-sectional side view of the fluid discharge nozzle cut along the flow of the fluid and viewed from the side.

FIG. 6 is a cross-sectional view showing a developer discharge nozzle in a conventional substrate developing apparatus, FIG. 6A is a vertical sectional front view of the fluid discharge nozzle cut along the flow of fluid, and FIG.
Is a vertical cross-sectional side view of the fluid discharge nozzle cut along the flow of fluid and viewed from the side.

FIG. 7 is a diagram showing changes in cross-sectional area of a water channel width and a water channel thickness along the fluid passage of the fluid discharge nozzle of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate developing apparatus (substrate processing apparatus), 2 ... Substrate to be processed, 3 ... Substrate holding mechanism, 4 ... Rotation mechanism, 5 ... Moving mechanism, 6 ... Fluid supply mechanism, 10, 20, 30, 100 ... Developing solution discharge Nozzle (fluid discharge nozzle), 11, 21, 31, 101 ... Nozzle body, 11a, 11b, 21a, 21b, 31a, 31b, 1
01a, 101b ... Base plate, 12, 22, 32, 102 ... Fluid supply port, 13, 23, 33, 103 ... Fluid discharge port, 14, 24, 34, 104 ... Fluid passage, 25 ... Particle,

Front page continuation (51) Int.Cl. ⁷ identification code FI theme code (reference) B05D 1/40 H01L 21/304 643C H01L 21/304 643 21/30 569A (72) Inventor Hidehiro Watanabe Kawasaki, Kanagawa Prefecture Komukai-Toshiba-cho, No. 1 In Toshiba Microelectronics Center Co., Ltd. (72) Inventor Machiko Suenaga Komukai-Toshiba-cho, Kawasaki-shi, Kanagawa 1 Komukai Toshiba Electronics Co., Ltd. F-term (Reference) 2H096 AA25 AA27 GA21 4D075 AC64 CA47 DA06 DB13 DB14 DC22 DC24 EA05 4F033 AA14 BA03 CA02 DA01 EA01 GA01 GA11 NA01 4F042 AA02 AA07 CB08 CB24 DF09 DF32 EB09 EB13 EB18 5F046 LA04

Claims (15)

[Claims] 1. A fluid supply port provided at one end of a nozzle body, a fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, the fluid supply port and the fluid discharge port. And has a fluid passage whose cross-sectional shape perpendicular to the fluid flow is an elongated shape, and in the cross-section of the fluid passage,
A fluid discharge nozzle having a length in the longitudinal direction that is large from the fluid supply port side toward the discharge port side and a length in the lateral direction that is small from the fluid supply port toward the fluid discharge port; A fluid discharge nozzle, wherein a cross section in the longitudinal direction of the fluid passage has a curved surface that expands the fluid passage from the fluid supply port side toward the discharge port side. 2. The fluid discharge nozzle according to claim 1, wherein the fluid discharge port has a curved surface shape projecting in a fluid discharge direction. 3. A fluid supply port provided at one end of the nozzle body, a fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, the fluid supply port and the fluid discharge port. And a fluid passage having a slender cross-sectional shape perpendicular to the fluid, and in the transverse cross section of the fluid passage, the length in the longitudinal direction is from the fluid supply port side toward the discharge port side. A fluid discharge nozzle having a large length and a short length in the short direction from the fluid supply port toward the fluid discharge port, wherein the fluid passage is filled with particles. 4. The fluid discharge nozzle according to claim 2, wherein the particles have a particle diameter larger than the length of the transverse section of the fluid passage in the shortest direction. 5. The fluid discharge nozzle according to claim 1, wherein the nozzle body is configured by combining two plate-shaped members. 6. A substrate holding mechanism for holding a substrate to be processed substantially horizontally, a fluid discharge nozzle, a fluid supply mechanism for supplying a fluid to the discharge nozzle, a holding mechanism for holding the discharge nozzle, and And a moving mechanism for moving the substrate above the substrate holding mechanism and removing it from above the substrate holding mechanism, wherein the fluid discharge nozzle has a fluid supply port provided at one end of the nozzle body, and a fluid supply port opposite to the fluid supply port. A fluid discharge port provided at the other end of the nozzle body, and a fluid passage that connects the fluid supply port and the fluid discharge port and has a slender cross section perpendicular to the fluid. In the transverse cross section, a cross section in the longitudinal direction has a curved surface that expands the fluid passage from the fluid supply port side toward the discharge port side, and a cross section in the lateral direction is the fluid from the fluid supply port. Heading to the outlet The substrate processing apparatus characterized by being formed smaller Te. 7. The substrate processing apparatus according to claim 6, wherein the fluid discharge port has a curved surface shape projecting in a fluid discharge direction. 8. A substrate holding mechanism for holding a substrate to be processed substantially horizontally, a fluid discharge nozzle, a fluid supply mechanism for supplying a fluid to the discharge nozzle, a holding mechanism for holding the discharge nozzle, and And a moving mechanism for moving the substrate above the substrate holding mechanism and removing it from above the substrate holding mechanism, wherein the fluid discharge nozzle has a fluid supply port provided at one end of the nozzle body, and a fluid supply port opposite to the fluid supply port. A fluid discharge port provided at the other end of the nozzle body, and a fluid passage that connects the fluid supply port and the fluid discharge port and has a slender cross section perpendicular to the fluid. The cross-section in the longitudinal direction of the cross section is large from the fluid supply port side toward the discharge port side, and the cross-section in the lateral direction is formed small from the fluid supply port toward the fluid discharge port, and In the aisle The substrate processing apparatus, characterized in that the particles are filled. 9. The substrate processing apparatus according to claim 8, wherein the particles have a particle diameter larger than a length of a transverse section of the fluid passage in the shortest direction. 10. The fluid discharge port has a slit shape, and the length of the slit shape in the longitudinal direction is longer than the diagonal or diameter of the substrate to be processed. Alternatively, the substrate processing apparatus according to claim 8. 11. A chemical liquid is supplied from a fluid discharge port of a fluid discharge nozzle to a substrate to be processed whose main surface is held substantially horizontal, and the substrate to be processed and the fluid discharge nozzle are relatively moved. According to the substrate processing method of supplying a chemical solution to the entire main surface of the substrate to be processed to chemically process the substrate to be processed, the fluid discharge nozzle includes a fluid supply port provided at one end of the nozzle body, A fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, and a fluid passage having a slender cross-sectional shape perpendicular to the fluid, which connects the fluid supply port and the fluid discharge port. In the transverse cross section of the fluid passage, the cross section in the longitudinal direction has a curved surface that expands the fluid passage from the fluid supply port side toward the discharge port side, and the cross section in the lateral direction, The fluid discharge from the fluid supply port A substrate processing method, wherein the substrate processing method is formed to be small toward an outlet. 12. A chemical liquid is supplied from a fluid discharge port of a fluid discharge nozzle to a substrate whose main surface is held substantially horizontally, and the substrate to be processed and the fluid discharge nozzle are moved relatively. According to the substrate processing method of supplying a chemical solution to the entire main surface of the substrate to be processed to chemically process the substrate to be processed, the fluid discharge nozzle includes a fluid supply port provided at one end of the nozzle body, A fluid discharge port provided at the other end of the nozzle body opposite to the fluid supply port, and a fluid passage having a slender cross-sectional shape perpendicular to the fluid, which connects the fluid supply port and the fluid discharge port. A cross section of the fluid passage in the longitudinal direction in the cross section is large from the fluid supply port side toward the discharge port side, and a cross section in the lateral direction from the fluid supply port toward the fluid discharge port. Formed small and A substrate processing method, wherein particles are filled in the fluid passage. 13. A thin film is formed on the main surface of the substrate to be processed by supplying a chemical solution to the main surface of the substrate while fixing the fluid discharge nozzle and moving the substrate to be processed. 12. A chemical film is formed, which is characterized in that
Alternatively, the substrate processing method according to claim 12. 14. On the main surface of the substrate to be processed, the chemical liquid is supplied from the fluid discharge nozzle to the main surface of the substrate to be processed while fixing the substrate to be processed and moving the fluid discharge nozzle. The substrate processing method according to claim 11 or 12, wherein a thin film chemical solution film is formed on the substrate. 15. The substrate processing method according to claim 11, wherein the processing of the substrate to be processed is a developing process of a resist formed on the main surface of the substrate to be processed.