JP2005298535A - Thermoplastic resin electroconductive sheet and container for conveying electronic part - Google Patents
Thermoplastic resin electroconductive sheet and container for conveying electronic part Download PDFInfo
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- JP2005298535A JP2005298535A JP2004077950A JP2004077950A JP2005298535A JP 2005298535 A JP2005298535 A JP 2005298535A JP 2004077950 A JP2004077950 A JP 2004077950A JP 2004077950 A JP2004077950 A JP 2004077950A JP 2005298535 A JP2005298535 A JP 2005298535A
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- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 32
- 230000009477 glass transition Effects 0.000 claims abstract description 46
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 45
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000011231 conductive filler Substances 0.000 claims description 17
- 239000006229 carbon black Substances 0.000 claims description 14
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- 150000003673 urethanes Chemical class 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 17
- 239000000945 filler Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 14
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 9
- 239000004926 polymethyl methacrylate Substances 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003973 paint Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical group 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Abstract
Description
本発明は、熱可塑性樹脂導電性シート及びそれを成形してなる電子部品搬送用容器に関するものである。 The present invention relates to a thermoplastic resin conductive sheet and an electronic component carrying container formed by molding the same.
ＩＣやＩＣを用いた電子部品はキャリアテープ等に保管され、蓋材であるカバーテープをシール後、搬送、実装が行われている。近年は、技術の進歩によりこれらの電子部品は日々小型化している。しかしながら実装工程において、摩擦や、カバーテープとの剥離による静電気によってキャリアテープが帯電してしまい、小型化した電子部品がキャリアテープに張り付いたり、静電気により内包物のＩＣ等が破壊されたりといった問題が起きている。また、帯電防止処理をしていないと、埃を極端に嫌う部品等においても不具合を起こす。そこで、キャリアテープ等の電子部品搬送用容器には帯電防止に対する要求が強まっている。これに対し、現在は、特許文献１に示すようにカーボンブラック等の導電性フィラーを含む熱可塑性樹脂を共押出し等によりシーティングしたものが主流である。しかしながらこの方法では、導電性フィラーを大量に練りこむため、フィラー脱落による電子部品の汚染やショート、また導電性フィラーは高価であるためコストアップにもつながる。キャリアテープに蓋材であるカバーテープをシール後、搬送する際にカバーテープの剥離等の問題が起こらないようにカバーテープとの良好なシール性も必要である。よって、導電性フィラーの脱落が少なく、コストダウンの観点から使用量が少ないが帯電防止効果が十分であり、表面抵抗値が１０２〜１０１０Ωで、カバーテープとのシール性、ブロッキング性が良好な熱可塑性樹脂導電性シート及びそれを成形してなる電子部品搬送用容器が求められている。
解決しようとする課題は、導電性フィラーの脱落、導電性フィラー使用量が少なく、表面抵抗値が１０２〜１０１０Ωであり、カバーテープとのシール性、ブロッキング性が良好な熱可塑性樹脂導電性シート及びそれを成形してなる電子部品搬送用容器を提供する事である。 The problems to be solved are the removal of the conductive filler, the amount of the conductive filler used is small, the surface resistance value is 10 2 to 10 10 Ω, and the thermoplastic resin conductive having good sealing property and blocking property with the cover tape. It is providing the property sheet and the container for electronic component conveyance formed by molding it.
本発明は、
（１）熱可塑性樹脂シートの両面又は片面に、ウレタン系樹脂１００重量部に対して、アクリル系樹脂混合物５〜１００重量部、導電性フィラー５〜５０重量部を含む導電性塗料を塗布する熱可塑性樹脂導電性シートであって、前記アクリル系樹脂混合物がガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂を１０〜３００重量部を含むものであり、かつ表面抵抗値が１０２〜１０１０Ωであることを特徴とする熱可塑性樹脂導電性シート、
（２）ウレタン系樹脂にアクリル変性ウレタン樹脂を含む（１）項に記載の熱可塑性樹脂導電性シート、
（３） 導電性フィラーがカーボンブラックである（１）又は（２）項に記載の熱可塑性樹脂導電性シート、
（４） 熱可塑性樹脂シートがポリエステル系樹脂シートである（１）〜（３）項のいずれかに記載の熱可塑性樹脂導電性シート、
（５） （１）〜（４）項のいずれかに記載の熱可塑性樹脂導電性シートを成形してなる電子部品搬送用容器、
である。
The present invention
(1) Heat for applying a conductive paint containing 5 to 100 parts by weight of an acrylic resin mixture and 5 to 50 parts by weight of a conductive filler to 100 parts by weight of a urethane resin on both surfaces or one surface of a thermoplastic resin sheet 10 to 300 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less with respect to 100 parts by weight of the acrylic resin having a glass transition temperature of 80 ° C. or more. And a thermoplastic resin conductive sheet characterized by comprising a surface resistance value of 10 2 to 10 10 Ω,
(2) The thermoplastic resin conductive sheet according to (1), which contains an acrylic-modified urethane resin in the urethane-based resin,
(3) The thermoplastic resin conductive sheet according to (1) or (2), wherein the conductive filler is carbon black,
(4) The thermoplastic resin conductive sheet according to any one of (1) to (3), wherein the thermoplastic resin sheet is a polyester resin sheet,
(5) An electronic component carrying container formed by molding the thermoplastic resin conductive sheet according to any one of (1) to (4),
It is.
本発明に従うと、得られた熱可塑性樹脂導電性シートは、導電性フィラーの脱落、導電性フィラー使用量が少なく、表面抵抗値が１０２〜１０１０Ωであり、蓋材であるカバーテープとのシール性、ブロッキング性が良好な熱可塑性樹脂導電性シート及びそれを成形してなる電子部品搬送用容器を提供できる。 According to the present invention, the obtained thermoplastic resin conductive sheet has a cover tape that is a cover material, with a conductive filler falling off, a small amount of conductive filler used, and a surface resistance value of 10 2 to 10 10 Ω. It is possible to provide a thermoplastic resin conductive sheet having good sealing properties and blocking properties and a container for transporting electronic components formed by molding the same.
以下、本発明を更に詳細に説明する。本発明は、熱可塑性樹脂シートの両面又は片面に、ウレタン系樹脂１００重量部に対して、アクリル系樹脂混合物５〜１００重量部、導電性フィラー５〜５０重量部を含む導電性塗料を塗布する熱可塑性樹脂導電性シートであって、前記アクリル系樹脂混合物がガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂を１０〜３００重量部を含むものであり、かつ表面抵抗値が１０２〜１０１０Ωであることを特徴とする熱可塑性樹脂導電性シート及びそれを成形してなる電子部品搬送用容器である。 Hereinafter, the present invention will be described in more detail. The present invention applies a conductive paint containing 5 to 100 parts by weight of an acrylic resin mixture and 5 to 50 parts by weight of a conductive filler to 100 parts by weight of a urethane resin on both or one side of a thermoplastic resin sheet. A thermoplastic resin conductive sheet, wherein the acrylic resin mixture has an acrylic resin having a glass transition temperature of 70 ° C. or less and 10 to 300 wt. A thermoplastic resin conductive sheet characterized by having a surface portion and a surface resistance value of 10 2 to 10 10 Ω, and an electronic component transport container formed by molding the thermoplastic resin conductive sheet.
ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が、下限値未満であると蓋材であるカバーテープとのシール性が悪くなり、上限値を超えると塗料の安定性が悪くなる。 If the total of the acrylic resin having a glass transition temperature of 70 ° C. or less and the acrylic resin having a glass transition temperature of 80 ° C. or more is less than the lower limit value, the sealing property with the cover tape as the cover material is deteriorated, and the upper limit value is set. If it exceeds, the stability of the paint will deteriorate.
ガラス転移温度が７０℃以下のアクリル系樹脂が、下限値未満であると蓋材であるカバーテープとのシール性が悪くなり、上限値を超えるとブロッキングを起こしやすくなる。 When the acrylic resin having a glass transition temperature of 70 ° C. or lower is less than the lower limit value, the sealing property with the cover tape as the cover material is deteriorated, and when the upper limit value is exceeded, blocking easily occurs.
導電性フィラーが下限値未満であると十分な帯電防止効果が得られず、上限値を超えると、導電性が良すぎて外部で発生した静電気を導通してしまい内容物であるＩＣ等を破壊する恐れがあり、またフィラー脱落の問題も起こる。 If the conductive filler is less than the lower limit, a sufficient antistatic effect cannot be obtained, and if the upper limit is exceeded, the conductivity is too good to conduct externally generated static electricity and destroy the IC etc. that are the contents In addition, there is a problem of filler falling off.
表面抵抗値が下限値未満であると、導電性が良すぎて外部で発生した静電気を導通してしまい内容物であるＩＣ等を破壊する恐れがあり、上限値を超えると、十分な帯電防止効果が得られない。 If the surface resistance value is less than the lower limit value, the electrical conductivity is too good and the externally generated static electricity may be conducted and the contents such as the IC may be destroyed. The effect is not obtained.
ウレタン系樹脂とは分子鎖中にウレタン結合を持つ樹脂であり、ポリエーテル系、ポリエステル系、ポリカーボネート系、エポキシ変性タイプ、アクリル変性タイプ等であり、種々の共重合体や単体を２種以上混合して使用しても良い。 Urethane resin is a resin having a urethane bond in the molecular chain, such as polyether, polyester, polycarbonate, epoxy-modified, acrylic-modified, etc., and a mixture of two or more kinds of various copolymers and monomers. May be used.
アクリル系樹脂とは分子鎖中にアクリル基を持つ樹脂であり、メチルメタアクリレート、エチルメタアクリレート、ブチルメタアクリレート、アクリルアミド等であり、種々の共重合体や単体を２種以上混合して使用しても良い。 Acrylic resin is a resin having an acrylic group in the molecular chain, such as methyl methacrylate, ethyl methacrylate, butyl methacrylate, acrylamide, etc., and a mixture of two or more kinds of various copolymers and monomers. May be.
導電性フィラーとは導電性を示す、カーボンブラックや酸化チタン、酸化亜鉛などの金属酸化物等で、これらを２種以上混合して使用しても良い。 The conductive filler is a metal oxide such as carbon black, titanium oxide, or zinc oxide that exhibits conductivity, and two or more of these may be used in combination.
熱可塑性樹脂シートとは、ポリエステル系樹脂シート、ポリスチレン系樹脂シート、ポリカーボネート系樹脂シート、塩化ビニル系樹脂シート等やこれらのアロイのシートや、これらのシートを積層したもの等である。 The thermoplastic resin sheet is a polyester resin sheet, a polystyrene resin sheet, a polycarbonate resin sheet, a vinyl chloride resin sheet, or an alloy sheet thereof, or a laminate of these sheets.
またこの塗料には必要に応じて、導電性フィラーの脱落性、シール性、ブロッキング性等を損なわない範囲で、各種添加剤や樹脂等を添加することが可能である。 Moreover, it is possible to add various additives, resin, etc. to this coating material in the range which does not impair the drop-off property, sealing property, blocking property, etc. of an electroconductive filler as needed.
以下本発明を実施例により更に詳細に説明するがこれは単なる例示であり、本発明はこれにより限定されるものではない。
＜実施例１＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５０重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜実施例２＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂２００重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜実施例３＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５０重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのポリスチレン基材の両面に塗布膜厚１μで塗布した。
＜比較例１＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が１２０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５０重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布したが、塗布ムラの発生があった。
＜比較例２＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が２重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５０重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜比較例３＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂３５０重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜比較例４＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５重量部）、カーボンブラック２０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜比較例５＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５０重量部）、カーボンブラック６０重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜比較例６＞
ウレタン系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂とガラス転移温度が８０℃以上のアクリル系樹脂の合計が３０重量部（ガラス転移温度が８０℃以上のアクリル系樹脂１００重量部に対して、ガラス転移温度が７０℃以下のアクリル系樹脂５０重量部）、カーボンブラック１重量部を配合した塗料を作成し、厚み０．３ｍｍのＡ−ＰＥＴ基材の両面に塗布膜厚１μで塗布した。
＜比較例７＞
ポリスチレン樹脂１００重量部に対しカーボンブラック２０重量部を配合した導電性樹脂をポリスチレン基材の両面に共押出しで層比率が導電性樹脂／基材／導電性樹脂＝１０／８０／１０になるようにシーティングし厚み０．３ｍｍのシートを得た。
The present invention will be described in more detail below by way of examples, but this is merely an example, and the present invention is not limited thereby.
<Example 1>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A coating material is prepared by blending 100 parts by weight of a resin with 50 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less) and 20 parts by weight of carbon black, on both sides of an A-PET substrate having a thickness of 0.3 mm. The coating was applied at a coating thickness of 1 μm.
<Example 2>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A coating material was prepared by blending 200 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less with respect to 100 parts by weight of the resin, and 20 parts by weight of carbon black, on both sides of the A-PET substrate having a thickness of 0.3 mm. The coating was applied at a coating thickness of 1 μm.
<Example 3>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A coating material is prepared by blending 100 parts by weight of a resin with 50 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less) and 20 parts by weight of carbon black. It was applied at a thickness of 1μ.
<Comparative Example 1>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 120 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher relative to 100 parts by weight of urethane resin. A coating material is prepared by blending 100 parts by weight of a resin with 50 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less) and 20 parts by weight of carbon black, on both sides of an A-PET substrate having a thickness of 0.3 mm. Coating was performed with a coating thickness of 1 μm, but there was coating unevenness.
<Comparative example 2>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 2 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A coating material is prepared by blending 100 parts by weight of a resin with 50 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less) and 20 parts by weight of carbon black, on both sides of an A-PET substrate having a thickness of 0.3 mm. The coating was applied at a coating thickness of 1 μm.
<Comparative Example 3>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A coating material was prepared by blending 100 parts by weight of resin with 350 parts by weight of acrylic resin having a glass transition temperature of 70 ° C. or less) and 20 parts by weight of carbon black, on both sides of a 0.3 mm thick A-PET substrate. The coating was applied at a coating thickness of 1 μm.
<Comparative example 4>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A paint in which 5 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less and 20 parts by weight of carbon black is prepared with respect to 100 parts by weight of the resin is formed on both sides of a 0.3 mm thick A-PET substrate. The coating was applied at a coating thickness of 1 μm.
<Comparative Example 5>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. Create a paint blending 100 parts by weight of resin with 50 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less) and 60 parts by weight of carbon black, on both sides of a 0.3 mm thick A-PET substrate. The coating was applied at a coating thickness of 1 μm.
<Comparative Example 6>
The total of acrylic resin having a glass transition temperature of 70 ° C. or lower and acrylic resin having a glass transition temperature of 80 ° C. or higher is 30 parts by weight (acrylic glass having a glass transition temperature of 80 ° C. or higher) with respect to 100 parts by weight of the urethane resin. A coating material was prepared by blending 100 parts by weight of a resin with 50 parts by weight of an acrylic resin having a glass transition temperature of 70 ° C. or less) and 1 part by weight of carbon black, on both sides of a 0.3 mm thick A-PET substrate. The coating was applied at a coating thickness of 1 μm.
<Comparative Example 7>
A conductive resin in which 20 parts by weight of carbon black is blended with 100 parts by weight of polystyrene resin is coextruded on both sides of the polystyrene base material so that the layer ratio becomes conductive resin / base material / conductive resin = 10/80/10. And a sheet having a thickness of 0.3 mm was obtained.
表１に、得られたシートの表面抵抗値、カーボン脱落、カーボン比率、シール性、ブロッキング性の評価結果を示した。
表面抵抗値はＪＩＳ−Ｋ−６９１１に基づき測定を行った。カーボン脱落とは得られたシートを一般コピー紙で５回擦り、コピー紙にカーボンが付着しないものを○、カーボンが付着するものを×とした。
シール性とはカバーテープ（ＣＳＬ−Ｚ７３０２ 住友ベークライト（株）製）をコテ幅１ｍｍ、コテ長１６ｍｍ、コテ圧１ｋｇ、シール時間０．２秒でシールした際、シール温度１６０〜２００℃でのシール強度が０．２〜１Ｎの範囲に入っているものを○、入っていないものを×とした。
ブロッキング性とは、導電塗料を両面に塗布後のシートを４ｃｍ×４ｃｍにカットたものを３枚重ね、その上に２．５ｋｇの荷重をかけ２４時間４０℃―９０％の環境に放置後、シートの張付きがひどいものを×、張付きがほとんどないものを○とした。
Table 1 shows the evaluation results of the surface resistance value, carbon dropout, carbon ratio, sealing property, and blocking property of the obtained sheet.
The surface resistance value was measured based on JIS-K-6911. For carbon dropout, the obtained sheet was rubbed five times with general copy paper. The case where carbon did not adhere to the copy paper was marked with ◯, and the case where carbon adhered was marked with x.
What is sealing performance? When sealing a cover tape (CSL-Z7302 manufactured by Sumitomo Bakelite Co., Ltd.) with a trowel width of 1 mm, trowel length of 16 mm, trowel pressure of 1 kg, and sealing time of 0.2 seconds, sealing at a sealing temperature of 160 to 200 ° C. The case where the strength was in the range of 0.2 to 1N was rated as ◯, and the case where the strength was not included was rated as ×.
The blocking property means that 3 sheets of 4 cm x 4 cm sheets coated with conductive paint are applied on both sides, and a load of 2.5 kg is applied on the sheet and left in an environment of 40 ° C-90% for 24 hours. The case where the sticking of the sheet was severe was rated as x, and the case where there was almost no sticking was rated as ○.
得られた熱可塑性樹脂導電性シートは、導電性フィラーの脱落、導電性フィラー使用量が少なく、表面抵抗値が１０２〜１０１０Ωであり、蓋材であるカバーテープとのシール性、ブロッキング性が良好な熱可塑性樹脂導電性シートである為、それを成形してなる電子部品搬送用容器は優れた特性をもったものであり、広く便利に効率的に使う事が可能である。 The obtained thermoplastic resin conductive sheet has a conductive filler falling off, a small amount of conductive filler used, a surface resistance value of 10 2 to 10 10 Ω, a sealing property with a cover tape as a lid, and blocking. Since it is a thermoplastic resin conductive sheet with good properties, an electronic component transport container formed by molding it has excellent characteristics and can be used conveniently and efficiently.
Claims (5)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251690A (en) * | 2007-03-29 | 2008-10-16 | Nanojoin Kk | Electromagnetic wave suppressing paper and manufacturing method thereof |
| JP2009267010A (en) * | 2008-04-24 | 2009-11-12 | Nanojoin Kk | Electromagnetic wave suppression paper |
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2004
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251690A (en) * | 2007-03-29 | 2008-10-16 | Nanojoin Kk | Electromagnetic wave suppressing paper and manufacturing method thereof |
| JP2009267010A (en) * | 2008-04-24 | 2009-11-12 | Nanojoin Kk | Electromagnetic wave suppression paper |
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