JP2008522867A - パターニング用スタンプ、該スタンプの製造方法、および該スタンプを用いて対象物を製造する方法 - Google Patents

パターニング用スタンプ、該スタンプの製造方法、および該スタンプを用いて対象物を製造する方法 Download PDF

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Publication number
JP2008522867A
JP2008522867A JP2007544845A JP2007544845A JP2008522867A JP 2008522867 A JP2008522867 A JP 2008522867A JP 2007544845 A JP2007544845 A JP 2007544845A JP 2007544845 A JP2007544845 A JP 2007544845A JP 2008522867 A JP2008522867 A JP 2008522867A
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JP
Japan
Prior art keywords
stamp
manufacturing
diaphragm
receiving surface
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007544845A
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English (en)
Japanese (ja)
Inventor
ハインツ シュミッド
ブルーノ ミハエル
ウルス クロター
ゲルハルド ケラー
ジャン−ポール カノ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2008522867A publication Critical patent/JP2008522867A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • B41F17/001—Pad printing apparatus or machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • B29C43/12—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies using bags surrounding the moulding material or using membranes contacting the moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/021—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • B41F17/30—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on curved surfaces of essentially spherical, or part-spherical, articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3647—Membranes, diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Printing Methods (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2007544845A 2004-12-10 2005-12-01 パターニング用スタンプ、該スタンプの製造方法、および該スタンプを用いて対象物を製造する方法 Pending JP2008522867A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04292954A EP1669196B1 (de) 2004-12-10 2004-12-10 Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel
PCT/EP2005/013529 WO2006061255A1 (en) 2004-12-10 2005-12-01 Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp

Publications (1)

Publication Number Publication Date
JP2008522867A true JP2008522867A (ja) 2008-07-03

Family

ID=34931592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007544845A Pending JP2008522867A (ja) 2004-12-10 2005-12-01 パターニング用スタンプ、該スタンプの製造方法、および該スタンプを用いて対象物を製造する方法

Country Status (6)

Country Link
US (1) US8268544B2 (de)
EP (2) EP1669196B1 (de)
JP (1) JP2008522867A (de)
AT (1) ATE396048T1 (de)
DE (1) DE602004014002D1 (de)
WO (1) WO2006061255A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020088286A (ja) * 2018-11-29 2020-06-04 キヤノン株式会社 成形装置、成形方法、および物品の製造方法
KR102415094B1 (ko) * 2021-11-17 2022-06-30 한국기계연구원 비평면기판용 나노임프린트 노광장치 및 방법

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US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
JP5062551B2 (ja) * 2007-01-30 2012-10-31 株式会社吉野工業所 タンポ印刷方法とタンポ印刷用のタンポ転写体
US7678423B2 (en) * 2007-02-27 2010-03-16 The Regents Of The University Of Michigan System and method for depositing thin layers on non-planar substrates by stamping
US20090020910A1 (en) * 2007-02-27 2009-01-22 Stephen Forrest System and method for depositing thin layers on non-planar substrates by stamping
ATE484773T1 (de) 2007-03-21 2010-10-15 Erich Thallner Verfahren und vorrichtung zur erzeugung einer nanostrukturierten scheibe
DE102007019398A1 (de) * 2007-04-23 2008-11-06 Itw Morlock Gmbh Tampondruckmaschine und Tampon dafür
DE102008001800A1 (de) 2007-05-25 2008-11-27 Carl Zeiss Smt Ag Projektionsobjektiv für die Mikrolithographie, Mikrolithographie-Projektionsbelichtungsanlage mit einem derartigen Projektionsobjektiv, mikrolithographisches Herstellungsverfahren für Bauelemente sowie mit diesem Verfahren hergestelltes Bauelement
DE112008001634A5 (de) * 2007-06-21 2010-04-01 GeSIM Gesellschaft für Silizium-Mikrosysteme mbH Verfahren und Vorrichtung zur Übertragung von Mikro- oder Nanostrukturen durch Kontaktstempeln
WO2009014717A1 (en) * 2007-07-25 2009-01-29 Nano Terra Inc. Contact printing method using an elastomeric stamp having a variable surface area and variable shape
US8210840B2 (en) 2008-04-17 2012-07-03 Massachusetts Institute Of Technology Diaphragm flexure with large range and high load capacity
US9793481B2 (en) * 2008-10-01 2017-10-17 The Regents Of The University Of Michigan Patterning by stamped metal resist
KR20120034940A (ko) * 2010-10-04 2012-04-13 삼성전자주식회사 패터닝 몰드 및 그 제조방법
WO2012157636A1 (ja) * 2011-05-19 2012-11-22 綜研化学株式会社 ナノインプリント用モールドおよび曲面体
TW201321214A (zh) * 2011-11-29 2013-06-01 Wistron Corp 印壓方法及印壓模具
JP2014226859A (ja) * 2013-05-23 2014-12-08 株式会社秀峰 印刷方法
US20150108673A1 (en) * 2013-10-18 2015-04-23 The Chinese University Of Hong Kong Imprinting apparatus and method for imprinting
US10675975B2 (en) * 2015-04-17 2020-06-09 Visteon Global Technologies, Inc. Glass lens assembly with an elastic adhesive
US11840013B2 (en) * 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing
EP3828603A4 (de) * 2018-07-23 2022-04-20 Hitachi High-Tech Corporation Verfahren und vorrichtung zur herstellung eines konkaven beugungsgitters und konkaves beugungsgitter
CN109656098A (zh) * 2018-12-04 2019-04-19 上海安翰医疗技术有限公司 纳米压印弹性模板的制作方法、纳米压印弹性模板及组件
DE102021130516A1 (de) * 2021-11-22 2023-05-25 Tampoprint Gmbh Verfahren und Vorrichtung zum Bedrucken oder Dekorieren eines Objekts
JP2023118658A (ja) * 2022-02-15 2023-08-25 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法
US11717728B1 (en) * 2022-02-28 2023-08-08 Acushnet Company Golf ball having markings spaced from a centerline plane

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WO2003099463A2 (en) * 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from a stamp to a substrate

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JPH01232048A (ja) * 1988-03-12 1989-09-18 Nec Corp コンタクトプリンタ装置
JPH09240125A (ja) * 1996-03-04 1997-09-16 Motorola Inc 物品の面をスタンピングするための装置および方法
DE10028620A1 (de) * 2000-06-09 2001-12-20 Heinrich Bielmeier Vorrichtung zum Bedrucken unebener Oberflächen
JP2002040202A (ja) * 2000-07-21 2002-02-06 Seiko Epson Corp プラスチックレンズの着色方法および装置
JP2003086537A (ja) * 2001-09-13 2003-03-20 Tdk Corp 構造体を用いた薄膜パターン製造方法および構造体
WO2003099463A2 (en) * 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from a stamp to a substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020088286A (ja) * 2018-11-29 2020-06-04 キヤノン株式会社 成形装置、成形方法、および物品の製造方法
JP7171394B2 (ja) 2018-11-29 2022-11-15 キヤノン株式会社 成形装置、成形方法、および物品の製造方法
KR102415094B1 (ko) * 2021-11-17 2022-06-30 한국기계연구원 비평면기판용 나노임프린트 노광장치 및 방법

Also Published As

Publication number Publication date
WO2006061255A1 (en) 2006-06-15
US20090208882A1 (en) 2009-08-20
EP1669196A1 (de) 2006-06-14
EP1669196B1 (de) 2008-05-21
EP1819514A1 (de) 2007-08-22
ATE396048T1 (de) 2008-06-15
US8268544B2 (en) 2012-09-18
DE602004014002D1 (de) 2008-07-03

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