JP2012255147A - 半導体モジュール部品及び液状封止用樹脂組成物 - Google Patents

半導体モジュール部品及び液状封止用樹脂組成物 Download PDF

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Publication number
JP2012255147A
JP2012255147A JP2012113099A JP2012113099A JP2012255147A JP 2012255147 A JP2012255147 A JP 2012255147A JP 2012113099 A JP2012113099 A JP 2012113099A JP 2012113099 A JP2012113099 A JP 2012113099A JP 2012255147 A JP2012255147 A JP 2012255147A
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JP
Japan
Prior art keywords
resin composition
semiconductor module
module component
liquid
liquid resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012113099A
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English (en)
Japanese (ja)
Inventor
Takeshi Masuda
剛 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2012113099A priority Critical patent/JP2012255147A/ja
Publication of JP2012255147A publication Critical patent/JP2012255147A/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP2012113099A 2011-05-19 2012-05-17 半導体モジュール部品及び液状封止用樹脂組成物 Withdrawn JP2012255147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012113099A JP2012255147A (ja) 2011-05-19 2012-05-17 半導体モジュール部品及び液状封止用樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011112202 2011-05-19
JP2011112202 2011-05-19
JP2012113099A JP2012255147A (ja) 2011-05-19 2012-05-17 半導体モジュール部品及び液状封止用樹脂組成物

Publications (1)

Publication Number Publication Date
JP2012255147A true JP2012255147A (ja) 2012-12-27

Family

ID=47176982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012113099A Withdrawn JP2012255147A (ja) 2011-05-19 2012-05-17 半導体モジュール部品及び液状封止用樹脂組成物

Country Status (3)

Country Link
JP (1) JP2012255147A (fr)
TW (1) TW201250950A (fr)
WO (1) WO2012157665A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
JP2016092176A (ja) * 2014-11-04 2016-05-23 株式会社村田製作所 電子部品内蔵基板およびその製造方法
JP6301031B1 (ja) * 2017-04-21 2018-03-28 三菱電機株式会社 半導体装置
KR20190006443A (ko) * 2017-07-10 2019-01-18 아지노모토 가부시키가이샤 수지 조성물
JP2022089902A (ja) * 2020-12-09 2022-06-16 味の素株式会社 樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270610A (ja) * 1997-01-23 1998-10-09 Toray Ind Inc 樹脂封止型半導体装置
JP2008007692A (ja) * 2006-06-30 2008-01-17 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP5573429B2 (ja) * 2009-08-10 2014-08-20 住友ベークライト株式会社 無電解ニッケル−パラジウム−金めっき方法、めっき処理物、プリント配線板、インターポーザ、および半導体装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
JP2016092176A (ja) * 2014-11-04 2016-05-23 株式会社村田製作所 電子部品内蔵基板およびその製造方法
JP6301031B1 (ja) * 2017-04-21 2018-03-28 三菱電機株式会社 半導体装置
WO2018193614A1 (fr) * 2017-04-21 2018-10-25 三菱電機株式会社 Dispositif à semi-conducteur
US10615093B2 (en) 2017-04-21 2020-04-07 Mitsubishi Electric Corporation Semiconductor device
DE112017000347B4 (de) 2017-04-21 2021-08-05 Mitsubishi Electric Corporation Halbleitervorrichtung
KR20190006443A (ko) * 2017-07-10 2019-01-18 아지노모토 가부시키가이샤 수지 조성물
JP2019014843A (ja) * 2017-07-10 2019-01-31 味の素株式会社 樹脂組成物
KR102663957B1 (ko) 2017-07-10 2024-05-09 아지노모토 가부시키가이샤 수지 조성물
KR102946978B1 (ko) 2017-07-10 2026-04-02 아지노모토 가부시키가이샤 수지 조성물
JP2022089902A (ja) * 2020-12-09 2022-06-16 味の素株式会社 樹脂組成物
JP7416118B2 (ja) 2020-12-09 2024-01-17 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
TW201250950A (en) 2012-12-16
WO2012157665A1 (fr) 2012-11-22

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