JP2013197372A - 調心方法及び半導体レーザモジュールの製造方法 - Google Patents
調心方法及び半導体レーザモジュールの製造方法 Download PDFInfo
- Publication number
- JP2013197372A JP2013197372A JP2012063756A JP2012063756A JP2013197372A JP 2013197372 A JP2013197372 A JP 2013197372A JP 2012063756 A JP2012063756 A JP 2012063756A JP 2012063756 A JP2012063756 A JP 2012063756A JP 2013197372 A JP2013197372 A JP 2013197372A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- face
- semiconductor laser
- angle component
- crit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/14—Mode converters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/262—Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
- G02B6/4203—Optical features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012063756A JP2013197372A (ja) | 2012-03-21 | 2012-03-21 | 調心方法及び半導体レーザモジュールの製造方法 |
| PCT/JP2012/082639 WO2013140687A1 (fr) | 2012-03-21 | 2012-12-17 | Procédé d'alignement et procédé permettant de fabriquer un module laser à semi-conducteurs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012063756A JP2013197372A (ja) | 2012-03-21 | 2012-03-21 | 調心方法及び半導体レーザモジュールの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2013197372A true JP2013197372A (ja) | 2013-09-30 |
Family
ID=49222173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012063756A Pending JP2013197372A (ja) | 2012-03-21 | 2012-03-21 | 調心方法及び半導体レーザモジュールの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2013197372A (fr) |
| WO (1) | WO2013140687A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018105453A1 (fr) * | 2016-12-06 | 2018-06-14 | パナソニックIpマネジメント株式会社 | Procédé d'alignement |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283425A (ja) * | 1994-04-07 | 1995-10-27 | Hitachi Ltd | 光送受信モジュール |
| JPH10332985A (ja) * | 1997-05-27 | 1998-12-18 | Canon Inc | レンズの位置調整に用いる治具及びそれを用いたレンズ位置調整方法 |
| JPH1158665A (ja) * | 1997-08-27 | 1999-03-02 | Asahi Chem Ind Co Ltd | レーザ製版装置 |
| JP2012042819A (ja) * | 2010-08-20 | 2012-03-01 | Fujikura Ltd | レーザダイオードモジュール及びレーザ光源 |
-
2012
- 2012-03-21 JP JP2012063756A patent/JP2013197372A/ja active Pending
- 2012-12-17 WO PCT/JP2012/082639 patent/WO2013140687A1/fr not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018105453A1 (fr) * | 2016-12-06 | 2018-06-14 | パナソニックIpマネジメント株式会社 | Procédé d'alignement |
| JPWO2018105453A1 (ja) * | 2016-12-06 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 調芯方法 |
| JP7126062B2 (ja) | 2016-12-06 | 2022-08-26 | パナソニックIpマネジメント株式会社 | 調芯方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013140687A1 (fr) | 2013-09-26 |
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