JP2013247283A - 搬送機構、搬送方法及び処理システム - Google Patents

搬送機構、搬送方法及び処理システム Download PDF

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Publication number
JP2013247283A
JP2013247283A JP2012121033A JP2012121033A JP2013247283A JP 2013247283 A JP2013247283 A JP 2013247283A JP 2012121033 A JP2012121033 A JP 2012121033A JP 2012121033 A JP2012121033 A JP 2012121033A JP 2013247283 A JP2013247283 A JP 2013247283A
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JP
Japan
Prior art keywords
processed
lid
pick
wafer
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012121033A
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English (en)
Japanese (ja)
Inventor
Shinji Wakabayashi
真士 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012121033A priority Critical patent/JP2013247283A/ja
Priority to PCT/JP2013/063673 priority patent/WO2013179904A1/fr
Publication of JP2013247283A publication Critical patent/JP2013247283A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2012121033A 2012-05-28 2012-05-28 搬送機構、搬送方法及び処理システム Pending JP2013247283A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012121033A JP2013247283A (ja) 2012-05-28 2012-05-28 搬送機構、搬送方法及び処理システム
PCT/JP2013/063673 WO2013179904A1 (fr) 2012-05-28 2013-05-16 Mécanisme de transport, procédé de transport et système de traitement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012121033A JP2013247283A (ja) 2012-05-28 2012-05-28 搬送機構、搬送方法及び処理システム

Publications (1)

Publication Number Publication Date
JP2013247283A true JP2013247283A (ja) 2013-12-09

Family

ID=49673107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012121033A Pending JP2013247283A (ja) 2012-05-28 2012-05-28 搬送機構、搬送方法及び処理システム

Country Status (2)

Country Link
JP (1) JP2013247283A (fr)
WO (1) WO2013179904A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018074174A (ja) * 2017-12-20 2018-05-10 シンフォニアテクノロジー株式会社 基板搬送装置、ｅｆｅｍ及び半導体製造装置
US20190362990A1 (en) * 2018-05-24 2019-11-28 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for dry wafer transport
JP2020004839A (ja) * 2018-06-28 2020-01-09 株式会社日立ハイテクマニファクチャ＆サービス 半導体ワーク搬送装置
KR20200116919A (ko) * 2018-02-06 2020-10-13 로제 가부시키가이샤 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇
KR20210030286A (ko) * 2018-07-13 2021-03-17 로제 가부시키가이샤 국소 퍼지 기능을 갖는 반송 장치
US12046500B2 (en) 2021-06-30 2024-07-23 Ebara Corporation Transport apparatus and substrate processing apparatus

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* Cited by examiner, † Cited by third party
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CN110612601B (zh) * 2017-05-11 2023-08-22 日商乐华股份有限公司 薄板状衬底保持指状件以及具有该指状件的运送机器人
CN110335838B (zh) * 2019-07-05 2021-08-13 北京北方华创微电子装备有限公司 传输装置、传输腔室及防止机械手腐蚀的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2043266A1 (fr) * 1990-09-24 1992-03-25 Gary Hillman Dispositif de translation de plaquettes
JPH09330972A (ja) * 1996-06-13 1997-12-22 Dainippon Screen Mfg Co Ltd 基板搬送装置
JP3818631B2 (ja) * 2000-02-16 2006-09-06 東京エレクトロン株式会社 基板処理装置
JP2003092335A (ja) * 2001-09-18 2003-03-28 Toshiba Corp 基板搬送装置、これを用いた基板処理装置および基板処理方法
JP3933507B2 (ja) * 2002-03-25 2007-06-20 大日本スクリーン製造株式会社 基板搬送装置および基板処理装置
JP4961894B2 (ja) * 2006-08-25 2012-06-27 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2009170740A (ja) * 2008-01-18 2009-07-30 Rorze Corp 搬送装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018074174A (ja) * 2017-12-20 2018-05-10 シンフォニアテクノロジー株式会社 基板搬送装置、ｅｆｅｍ及び半導体製造装置
KR20200116919A (ko) * 2018-02-06 2020-10-13 로제 가부시키가이샤 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇
KR102606448B1 (ko) * 2018-02-06 2023-11-27 로제 가부시키가이샤 박판 형상 기판 유지 장치 및 유지 장치를 구비하는 반송 로봇
US20190362990A1 (en) * 2018-05-24 2019-11-28 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for dry wafer transport
US11139183B2 (en) * 2018-05-24 2021-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for dry wafer transport
JP2020004839A (ja) * 2018-06-28 2020-01-09 株式会社日立ハイテクマニファクチャ＆サービス 半導体ワーク搬送装置
JP7061031B2 (ja) 2018-06-28 2022-04-27 株式会社日立ハイテク 半導体ワーク搬送装置
KR20210030286A (ko) * 2018-07-13 2021-03-17 로제 가부시키가이샤 국소 퍼지 기능을 갖는 반송 장치
KR102626528B1 (ko) * 2018-07-13 2024-01-18 로제 가부시키가이샤 국소 퍼지 기능을 갖는 반송 장치
US12387959B2 (en) 2018-07-13 2025-08-12 Rorze Corporation Transport device having local purge function
US12046500B2 (en) 2021-06-30 2024-07-23 Ebara Corporation Transport apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
WO2013179904A1 (fr) 2013-12-05

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