JP2016219599A - 電子機器および熱拡散体 - Google Patents

電子機器および熱拡散体 Download PDF

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Publication number
JP2016219599A
JP2016219599A JP2015102995A JP2015102995A JP2016219599A JP 2016219599 A JP2016219599 A JP 2016219599A JP 2015102995 A JP2015102995 A JP 2015102995A JP 2015102995 A JP2015102995 A JP 2015102995A JP 2016219599 A JP2016219599 A JP 2016219599A
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JP
Japan
Prior art keywords
heat
circuit board
thermal
electronic device
conducting medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015102995A
Other languages
English (en)
Japanese (ja)
Inventor
村松　功一
Koichi Muramatsu
功一 村松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP2015102995A priority Critical patent/JP2016219599A/ja
Priority to CN202010277947.2A priority patent/CN111479444A/zh
Priority to KR1020177032960A priority patent/KR102113678B1/ko
Priority to US15/570,590 priority patent/US10524389B2/en
Priority to EP16796083.0A priority patent/EP3298867B1/fr
Priority to CN201680028459.XA priority patent/CN107637187A/zh
Priority to PCT/JP2016/002269 priority patent/WO2016185687A1/fr
Publication of JP2016219599A publication Critical patent/JP2016219599A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H05K5/13—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2217/00—Details of cameras or camera bodies; Accessories therefor
    • G03B2217/002—Details of arrangement of components in or on camera body
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B37/00—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe
    • G03B37/04—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe with cameras or projectors providing touching or overlapping fields of view
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Studio Devices (AREA)
JP2015102995A 2015-05-20 2015-05-20 電子機器および熱拡散体 Pending JP2016219599A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015102995A JP2016219599A (ja) 2015-05-20 2015-05-20 電子機器および熱拡散体
CN202010277947.2A CN111479444A (zh) 2015-05-20 2016-05-09 电子装置和散热器
KR1020177032960A KR102113678B1 (ko) 2015-05-20 2016-05-09 전자 장치 및 히트 스프레더
US15/570,590 US10524389B2 (en) 2015-05-20 2016-05-09 Electronic device and heat spreader
EP16796083.0A EP3298867B1 (fr) 2015-05-20 2016-05-09 Dispositif électronique et dissipateur thermique
CN201680028459.XA CN107637187A (zh) 2015-05-20 2016-05-09 电子装置和散热器
PCT/JP2016/002269 WO2016185687A1 (fr) 2015-05-20 2016-05-09 Dispositif électronique et dissipateur thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015102995A JP2016219599A (ja) 2015-05-20 2015-05-20 電子機器および熱拡散体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019153741A Division JP6825661B2 (ja) 2019-08-26 2019-08-26 電子機器および熱拡散体

Publications (1)

Publication Number Publication Date
JP2016219599A true JP2016219599A (ja) 2016-12-22

Family

ID=57319755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015102995A Pending JP2016219599A (ja) 2015-05-20 2015-05-20 電子機器および熱拡散体

Country Status (6)

Country Link
US (1) US10524389B2 (fr)
EP (1) EP3298867B1 (fr)
JP (1) JP2016219599A (fr)
KR (1) KR102113678B1 (fr)
CN (2) CN107637187A (fr)
WO (1) WO2016185687A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020057852A (ja) * 2018-09-28 2020-04-09 株式会社ニコン 撮像装置
US11013148B2 (en) 2018-07-24 2021-05-18 Ricoh Company, Ltd. Imaging apparatus

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102663691B1 (ko) * 2019-04-04 2024-05-08 삼성전자주식회사 방열 구조를 포함하는 카메라 모듈 및 이를 포함하는 전자 장치
US10917544B2 (en) * 2019-04-30 2021-02-09 Gopro, Inc. Heat transfer between integrated sensor-lens assemblies in an image capture device
US12309977B2 (en) 2021-07-12 2025-05-20 Dell Products L.P. Management with a liquid metal embedded elastomer
US11586261B2 (en) * 2021-07-12 2023-02-21 Dell Products L.P. Information handling system thermal management integrated with glass material
US20240393665A1 (en) * 2023-05-22 2024-11-28 Gopro, Inc. Heat conductor assembly

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JPS60500391A (ja) * 1982-12-16 1985-03-22 ハスレル　エ−ジ− 熱伝導性のペ−スト又は液体が満たされた扁平なバッグ
JPH01128495A (ja) * 1987-09-25 1989-05-22 Minnesota Mining & Mfg Co <3M> 熱トランスファバツグ及びその製造方法
JPH06268113A (ja) * 1993-03-16 1994-09-22 Nippon Steel Corp 電子機器用の放熱部材
JPH088567A (ja) * 1994-06-23 1996-01-12 Fujitsu Ltd 部品の冷却装置及び熱伝導機構部
JPH08139235A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 電子機器およびその製造方法
GB2310321A (en) * 1996-02-13 1997-08-20 Electrovac Deformable heat sink
DE19624475A1 (de) * 1996-06-19 1998-01-02 Kontron Elektronik Vorrichtung zum Temperieren elektronischer Bauteile
JP2003068952A (ja) * 2001-08-28 2003-03-07 Nec Saitama Ltd 熱伝導性シートとその製造方法
JP2012503890A (ja) * 2008-09-26 2012-02-09 パーカー．ハニフィン．コーポレイション 熱伝導性ゲルパック
JP2012256792A (ja) * 2011-06-10 2012-12-27 Toshiba Corp 放熱構造
JP2013222836A (ja) * 2012-04-17 2013-10-28 Shin Etsu Chem Co Ltd 放熱性及びリワーク性に優れる電子装置及びその製造方法
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11013148B2 (en) 2018-07-24 2021-05-18 Ricoh Company, Ltd. Imaging apparatus
JP2020057852A (ja) * 2018-09-28 2020-04-09 株式会社ニコン 撮像装置
JP7205143B2 (ja) 2018-09-28 2023-01-17 株式会社ニコン 撮像装置
JP2023029470A (ja) * 2018-09-28 2023-03-03 株式会社ニコン 撮像装置
JP2024166391A (ja) * 2018-09-28 2024-11-28 株式会社ニコン 撮像装置

Also Published As

Publication number Publication date
KR20170137869A (ko) 2017-12-13
CN107637187A (zh) 2018-01-26
KR102113678B1 (ko) 2020-05-22
EP3298867B1 (fr) 2021-04-07
EP3298867A1 (fr) 2018-03-28
WO2016185687A1 (fr) 2016-11-24
US10524389B2 (en) 2019-12-31
US20180139867A1 (en) 2018-05-17
EP3298867A4 (fr) 2018-05-02
CN111479444A (zh) 2020-07-31

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