JP2502995Y2 - Adhesive coating amount confirmation device in die bonding machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a device for confirming the amount of adhesive applied in a die bonding device.

[Conventional technology]

Conventionally, a die bonding apparatus called a die bonder is used to fix a semiconductor chip, a so-called bare chip, at a predetermined position on a substrate with an adhesive.

The operation of the die bonding apparatus will be described with reference to FIG. 4. A syringe 4 capable of discharging a fixed amount of the adhesive 2 is provided on the substrate 1, and the syringe 4 is placed at an arbitrary position on the substrate by an appropriate control means. The syringe 4 is moved and the syringe 4 is lowered at that position to apply a fixed amount of the adhesive 2 onto the substrate 1 by dropping. At this time, the substrate 1 is along the horizontal plane (X-Y direction)
It may be moved to move a predetermined position of the substrate under the nozzle of the syringe. Next, the semiconductor chip 3 is formed on the substrate as described above by a collet 5 which is formed separately from the syringe 4 and can be moved to a predetermined position by an appropriate control means while holding the semiconductor chip by suction. Then, the collet 5 descends and the semiconductor chip 3 is brought into contact with and pressed by the adhesive to complete the mounting of the semiconductor chip. Thereafter, heat treatment is performed to cure the adhesive, and wire bonding and sealing treatment are performed as necessary.

In such a conventional die bonding method, in the application of the adhesive, it is necessary to detect an abnormal change in the coating amount over time and a change in the viscosity by periodical weight measurement at an early stage to confirm that a uniform coating amount can always be obtained. But there is
In the conventional technique, a worker periodically extracts a product as a sample from a normal production line and compares it with a limited sample to determine whether the amount of adhesive applied is normal or abnormal. However, in such a method, since the work is a visual inspection that depends on intuition and experience, there are individual differences in the confirmation results, and the judgment is neither accurate nor uniform. Further, in this method, in the case of an integrated production line, the production line may have to be stopped at the time of the above confirmation, so that the work efficiency is poor and the productivity is reduced.

As a method of improving such a method, a dummy substrate made of a transparent material is periodically flown into the production line, for example, every hour, and the fifth step is performed on the dummy substrate by performing the same operation as the actual process. After applying the adhesive and mounting the semiconductor chip as shown in FIG. 5 (a), the semiconductor chip is taken out from the production line, and as shown in FIG. A method of visually inspecting the degree of protrusion of the adhesive from and comparing it with a limited sample to confirm whether the coating amount is normal or abnormal is considered. In this method, it is not necessary to stop the production line when confirming the coating amount, but there is a drawback in that the same judgment as in the above method cannot be expected to be accurate because it mainly involves visual inspection.

[Problems to be solved by the device]

The object of the present invention is to improve the above-mentioned drawbacks of the prior art by early discovering that the coating amount abnormally changes due to clogging of a syringe nozzle or viscosity change of an adhesive during die bonding of a semiconductor chip. It is an object of the present invention to provide an adhesive application amount confirmation device capable of minimizing the generation and maintaining stable quality.

[Means for solving the problem]

The present invention adopts the following technical constitution in order to achieve the above-mentioned object. That is, in a die bonding apparatus in which a bare chip is mounted on a substrate at a predetermined position via an adhesive, an adhesive application stage is provided in a movable area of a syringe that supplies the adhesive and at a position separated from the substrate. An adhesive application amount confirmation device in a die bonding apparatus, in which a means for measuring the application amount of the adhesive applied to the stage and a display means for displaying the measurement result by the measuring means are connected to the application stage and provided. Is.

[Action]

According to the present invention, an adhesive application stage is specially provided at a position distant from the semiconductor substrate production line, and the adhesive is applied to the application stage at predetermined intervals in the production process under the same conditions as in the actual production, and the weight of the adhesive is applied. It is measured and compared with a preset reference value, and it is possible to easily confirm an accurate coating amount without stopping the production process.

〔Example〕

A specific example of the adhesive application amount confirmation device of the die bonding apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 shows a principle view of an adhesive application amount confirmation device according to the present invention and a specific example thereof.

In FIG. 1, the substrate 1 is supported by guides 6 and 6'and is moved from the left to the right in the drawing by an appropriate substrate transfer means 7. On the other hand, on the substrate, a syringe 4 for supplying a predetermined amount of resin as an adhesive onto the substrate is attached to the tip of a coating head 31 that can be arbitrarily moved in the horizontal direction in response to a command from an appropriate control means. It is configured so that the adhesive can be applied to a predetermined position on the substrate 1 by arbitrarily moving in the two horizontal directions, that is, the XY directions by taking into consideration the moving speed of the substrate 1. The movement of the syringe 4 is program-controlled on the basis of horizontal coordinates having a machine origin (zero point of X and Y coordinates) at an appropriate place. Therefore, at all times, the syringe 4 is sequentially moved to a predetermined position on the substrate to automatically perform the work of applying the adhesive.

By the way, in the present invention, the adhesive is placed at a position distant from the production line of the substrate 1, that is, at a position where the movement of the substrate 1 is not hindered in the production line, and at an appropriate position within the movable range of the syringe 4. An adhesive application stage 8 for separately applying the adhesive is provided. The position where the coating stage is provided is preferably located as close to the substrate 1 and the syringe as possible, preferably at the machine origin described above, and it is possible to avoid increasing the moving distance of the syringe.

That is, according to the present invention, the syringe 4 is moved onto the coating stage at appropriate intervals during the normal die-bonding work, and the adhesive is coated on the coating stage at least once, and then again. It returns to the actual production line and continues the application of the adhesive on the ordinary substrate. Therefore, in the present invention, the operation of moving the syringe 4 to the coating stage 8 at an appropriate interval is interrupted in the normal production process.

Therefore, it is preferable that the moving distance of the syringe in this interruption operation is as short as possible.

The interval of the interruption work in the present invention is not particularly limited, and may be appropriately determined based on the number of shots by which the syringe shots the adhesive and the working time of the syringe. For example, once every 1000 shots, or The adhesive can be applied on the application stage such as once every three hours.

The size and material of the coating stage are not particularly limited.

Further, in the present invention, the weight measuring means 9 is provided on the coating stage.
Each time the adhesive 2 is applied to the application stage 8, the weight of the adhesive at that time is measured and recorded. Further, in the present invention, the display means 10 connected to the measuring means for displaying the measurement result of the measuring means is provided.

It is preferable that the display means 10 displays at least the weight of the adhesive agent 2 applied to the application stage and also displays the comparison with a predetermined weight reference value.

Next, an example of setting and operation of the display means and the measuring means 9 in the present invention will be described with reference to the perspective view of the display means of FIG. 2 and the flowchart of FIG.

FIG. 2 shows an example of the configuration of the front panel of the display means used in the present invention, in which the display section 11 sets and displays the intervals and timings at which the weight measurement is carried out. The number of shots of the adhesive is set every 1000 shots, or the operating time of the syringe is set every 2 hours. The display unit 12 also displays the cumulative number of shots of the actual syringe or the cumulative operating time.

Further, the display unit 13 displays the weight when the adhesive is applied to the application stage, and also displays the result of comparison and determination with the reference value which is predetermined and displayed on the display unit 14.

The display unit 14 can preset and display the upper limit value and the lower limit value of the allowable value of the weight, and if the weight of the adhesive measured this time is within the range of the allowable value, the display unit 13 displays, for example, ○. It is possible to stop the production process by displaying x and if it is out of the allowable range, x is displayed and an alarm sound is generated.

Referring to FIG. 3, a predetermined number of shots or shot time is set in advance to determine an interval for measuring the weight of the adhesive (step 20), and the number of shots or shot time is counted by a counter at the same time when the actual production is started. . (Step 21) The number of shots or shot time set and displayed is compared with the actual count number, and when a time point when both are detected is detected (Step 22), the syringe 4 is moved to the adhesive application stage 8 The control means is interrupted so that the adhesive is shot on the coating stage (step 23). (Step 24) Next, the weight of the adhesive is measured (Step 25). The upper limit value and the lower limit value (step 26) of the preset allowable range for the weight are compared and judged, and the adhesive weight is normal or abnormal. Judge whether it is a value (step
27).

Although only the syringe 4 is shown in FIG. 1 in the present invention, it goes without saying that an actual die bonding apparatus is provided with a collet for supplying a bare chip in the vicinity of the syringe.

The adhesive 2 applied to the application stage in the present invention is removed by any means (for example, manually) after the weight measurement is completed.

In the manual type die bonder, the XY movement of the head is often moved manually, but in this case, when the set number of times of coating is reached, the operator is notified with a buzzer, etc., and the operator moves the head to the stage for coating amount measurement section. Then, the adhesive may be applied to the stage and the weight may be measured.

〔effect〕

In the present invention, since the shot result under the same condition as the shot condition of the adhesive in the actual production process is obtained at the coating stage, it is possible to accurately and promptly confirm the weight change of the adhesive without stopping the production process. As a result, it is possible to easily check the clogging state of the syringe and the change in the viscosity of the adhesive, and it is possible to improve the production efficiency and the quality of the bonding product.

Also, in the present invention, do not rely on the intuition and experience of the operator,
Since the coating amount can be confirmed quantitatively, even a non-expert can easily perform the confirmation work.

[Brief description of drawings]

FIG. 1 is a diagram for explaining one specific example and principle of an adhesive application amount confirmation device in a die bonding device according to the present invention. FIG. 2 is a perspective view showing an example of the display means used in the present invention. FIG. 3 is a flow chart showing an execution example of the adhesive application amount confirmation method in the present invention. FIG. 4 is a diagram showing an example of a conventional die bonding apparatus. FIG. 5 is a diagram showing an example of a dummy substrate used in a conventional die bonding apparatus. 1 ... Substrate, 2 ... Adhesive resin (adhesive), 3 ... Bare chip, 4 ... Syringe, 5 ... Collet, 30 ... Dummy substrate, 6 ... Guide, 7 ... Substrate transporting means, 8 ... coating stage, 9 ... weight measuring means, 10 ... display means, 31
...... Applying head section, 11-14 …… Display section.

Claims (1)

(57) [Scope of utility model registration request] 1. A die bonding apparatus for mounting a bare chip on a substrate at a predetermined position via an adhesive, wherein the adhesive is applied at a position within a movable region of a syringe supplying the adhesive and away from the substrate. A die bonding, characterized in that a stage is provided, and means for measuring the application amount of the adhesive applied to the stage and display means for displaying the measurement result by the measuring means are connected to the application stage. Adhesive application amount confirmation device in the device.