JP2528687Y2 - プレナ−型２端子双方向サイリスタ - Google Patents

プレナ−型２端子双方向サイリスタ

Info

Publication number
JP2528687Y2
JP2528687Y2 JP1988074299U JP7429988U JP2528687Y2 JP 2528687 Y2 JP2528687 Y2 JP 2528687Y2 JP 1988074299 U JP1988074299 U JP 1988074299U JP 7429988 U JP7429988 U JP 7429988U JP 2528687 Y2 JP2528687 Y2 JP 2528687Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
pair
planar type
solder
bidirectional thyristor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988074299U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01176930U (2
Inventor
芳昭 上條
伸行 宮寺
博之 大野
祐喜 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
NTT Inc
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd, Nippon Telegraph and Telephone Corp filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1988074299U priority Critical patent/JP2528687Y2/ja
Publication of JPH01176930U publication Critical patent/JPH01176930U/ja
Application granted granted Critical
Publication of JP2528687Y2 publication Critical patent/JP2528687Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Thyristors (AREA)
JP1988074299U 1988-06-06 1988-06-06 プレナ−型２端子双方向サイリスタ Expired - Lifetime JP2528687Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988074299U JP2528687Y2 (ja) 1988-06-06 1988-06-06 プレナ−型２端子双方向サイリスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988074299U JP2528687Y2 (ja) 1988-06-06 1988-06-06 プレナ−型２端子双方向サイリスタ

Publications (2)

Publication Number Publication Date
JPH01176930U JPH01176930U (2) 1989-12-18
JP2528687Y2 true JP2528687Y2 (ja) 1997-03-12

Family

ID=31299415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988074299U Expired - Lifetime JP2528687Y2 (ja) 1988-06-06 1988-06-06 プレナ−型２端子双方向サイリスタ

Country Status (1)

Country Link
JP (1) JP2528687Y2 (2)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821825B2 (ja) * 1975-10-09 1983-05-04 三菱電機株式会社 ハンドウタイソウチ
JPS56110652U (2) * 1980-01-28 1981-08-27
JPS60129136U (ja) * 1984-02-03 1985-08-30 新電元工業株式会社 半導体装置

Also Published As

Publication number Publication date
JPH01176930U (2) 1989-12-18

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