JP2649401B2 - 剛性補強部品を埋め込んで強化されたキャリア - Google Patents

剛性補強部品を埋め込んで強化されたキャリア

Info

Publication number
JP2649401B2
JP2649401B2 JP63505977A JP50597788A JP2649401B2 JP 2649401 B2 JP2649401 B2 JP 2649401B2 JP 63505977 A JP63505977 A JP 63505977A JP 50597788 A JP50597788 A JP 50597788A JP 2649401 B2 JP2649401 B2 JP 2649401B2
Authority
JP
Japan
Prior art keywords
carrier
structural
parts
wafer
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63505977A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02500631A (ja
Inventor
アール クアーネモエン、ダニエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUOROEA Inc
Original Assignee
FURUOROEA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUOROEA Inc filed Critical FURUOROEA Inc
Publication of JPH02500631A publication Critical patent/JPH02500631A/ja
Application granted granted Critical
Publication of JP2649401B2 publication Critical patent/JP2649401B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H10P72/135—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/10—Reaction chambers; Selection of materials therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP63505977A 1987-07-02 1988-06-29 剛性補強部品を埋め込んで強化されたキャリア Expired - Lifetime JP2649401B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6969987A 1987-07-02 1987-07-02
US69,699 1987-07-02

Publications (2)

Publication Number Publication Date
JPH02500631A JPH02500631A (ja) 1990-03-01
JP2649401B2 true JP2649401B2 (ja) 1997-09-03

Family

ID=22090658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63505977A Expired - Lifetime JP2649401B2 (ja) 1987-07-02 1988-06-29 剛性補強部品を埋め込んで強化されたキャリア

Country Status (4)

Country Link
EP (1) EP0322443A1 (de)
JP (1) JP2649401B2 (de)
KR (1) KR890702241A (de)
WO (1) WO1989000333A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4930634A (en) * 1987-09-29 1990-06-05 Fluoroware, Inc. Carrier for flat panel displays
EP0520106B1 (de) * 1991-06-28 1994-08-31 Shin-Etsu Handotai Company Limited Trägerkassette für Halbleiterscheiben
EP0520105B1 (de) * 1991-06-28 1995-08-30 Shin-Etsu Handotai Company Limited Trägerkassette für Halbleiterscheiben
JP2912520B2 (ja) * 1993-03-13 1999-06-28 淀川化成株式会社 ガラス基板収容用カセット
KR200493303Y1 (ko) * 2018-12-27 2021-03-10 위아코퍼레이션 주식회사 웨이퍼 캐리어의 슬롯바
CN218471907U (zh) * 2022-06-15 2023-02-10 深圳市拉普拉斯能源技术有限公司 一种新型石英舟

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277590A (en) * 1975-12-24 1977-06-30 Toshiba Corp Semiconductor producing device
JPS5598822A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Wafer holding jig
JPS6032761Y2 (ja) * 1979-05-11 1985-09-30 富士通株式会社 石英ボ−ト
JPS59198731A (ja) * 1983-04-26 1984-11-10 Toshiba Corp 半導体ウエ−ハの収納キヤリア
US4493418A (en) * 1983-08-17 1985-01-15 Empak Inc. Wafer processing cassette
GB8702834D0 (en) * 1987-02-09 1987-03-18 Tsl Group Plc Improving sag resistance of component

Also Published As

Publication number Publication date
EP0322443A1 (de) 1989-07-05
KR890702241A (ko) 1989-12-23
JPH02500631A (ja) 1990-03-01
WO1989000333A1 (en) 1989-01-12

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