JP2843658B2 - フリップチップ型半導体装置 - Google Patents

フリップチップ型半導体装置

Info

Publication number
JP2843658B2
JP2843658B2 JP20560690A JP20560690A JP2843658B2 JP 2843658 B2 JP2843658 B2 JP 2843658B2 JP 20560690 A JP20560690 A JP 20560690A JP 20560690 A JP20560690 A JP 20560690A JP 2843658 B2 JP2843658 B2 JP 2843658B2
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
semiconductor element
type semiconductor
chip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20560690A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0491448A (ja
Inventor
和己 中吉
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TORE DAUKOONINGU SHIRIKOON KK
Original Assignee
TORE DAUKOONINGU SHIRIKOON KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TORE DAUKOONINGU SHIRIKOON KK filed Critical TORE DAUKOONINGU SHIRIKOON KK
Priority to JP20560690A priority Critical patent/JP2843658B2/ja
Priority to DE69109014T priority patent/DE69109014T2/de
Priority to EP19910112967 priority patent/EP0469614B1/de
Priority to KR1019910013369A priority patent/KR100216100B1/ko
Priority to TW80106557A priority patent/TW216468B/zh
Publication of JPH0491448A publication Critical patent/JPH0491448A/ja
Application granted granted Critical
Publication of JP2843658B2 publication Critical patent/JP2843658B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4473—Conductive organic materials, e.g. conductive adhesives or conductive inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP20560690A 1990-08-02 1990-08-02 フリップチップ型半導体装置 Expired - Lifetime JP2843658B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP20560690A JP2843658B2 (ja) 1990-08-02 1990-08-02 フリップチップ型半導体装置
DE69109014T DE69109014T2 (de) 1990-08-02 1991-08-01 Flip-Chip-Halbleiteranordnung.
EP19910112967 EP0469614B1 (de) 1990-08-02 1991-08-01 Flip-Chip-Halbleiteranordnung
KR1019910013369A KR100216100B1 (ko) 1990-08-02 1991-08-02 플립 칩 반도체 장치
TW80106557A TW216468B (de) 1990-08-02 1991-08-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20560690A JP2843658B2 (ja) 1990-08-02 1990-08-02 フリップチップ型半導体装置

Publications (2)

Publication Number Publication Date
JPH0491448A JPH0491448A (ja) 1992-03-24
JP2843658B2 true JP2843658B2 (ja) 1999-01-06

Family

ID=16509652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20560690A Expired - Lifetime JP2843658B2 (ja) 1990-08-02 1990-08-02 フリップチップ型半導体装置

Country Status (5)

Country Link
EP (1) EP0469614B1 (de)
JP (1) JP2843658B2 (de)
KR (1) KR100216100B1 (de)
DE (1) DE69109014T2 (de)
TW (1) TW216468B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5249101A (en) * 1992-07-06 1993-09-28 International Business Machines Corporation Chip carrier with protective coating for circuitized surface
SG54297A1 (en) * 1992-09-15 1998-11-16 Texas Instruments Inc Ball contact for flip-chip devices
US5635762A (en) * 1993-05-18 1997-06-03 U.S. Philips Corporation Flip chip semiconductor device with dual purpose metallized ground conductor
DE69426347T2 (de) * 1993-09-29 2001-05-17 Matsushita Electric Industrial Co., Ltd. Verfahren zum Montieren einer Halbleiteranordnung auf einer Schaltungsplatte und eine Schaltungsplatte mit einer Halbleiteranordnung darauf
DE4334715B4 (de) * 1993-10-12 2007-04-19 Robert Bosch Gmbh Verfahren zur Montage von mit elektrischen Anschlüssen versehenen Bauteilen
US5659952A (en) * 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
US6635514B1 (en) 1996-12-12 2003-10-21 Tessera, Inc. Compliant package with conductive elastomeric posts
JP3223246B2 (ja) * 1997-07-25 2001-10-29 東レ・ダウコーニング・シリコーン株式会社 半導体装置
US6621173B1 (en) 1998-07-23 2003-09-16 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having an adhesive and a sealant
JP6518451B2 (ja) * 2015-02-02 2019-05-22 株式会社フジクラ 伸縮性回路基板
JP6623978B2 (ja) * 2016-08-26 2019-12-25 株式会社村田製作所 電子部品の接合構造および電子部品接合体の製造方法
CN115274461B (zh) * 2022-05-31 2024-10-11 浙江禾芯集成电路有限公司 一种应用于平面型功率器件的封装结构的封装方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618254B1 (fr) * 1987-07-16 1990-01-05 Thomson Semiconducteurs Procede et structure de prise de contact sur des plots de circuit integre.
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JPH0817189B2 (ja) * 1989-01-13 1996-02-21 三菱電機株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
KR920005289A (ko) 1992-03-28
TW216468B (de) 1993-11-21
DE69109014T2 (de) 1995-09-21
EP0469614A1 (de) 1992-02-05
JPH0491448A (ja) 1992-03-24
DE69109014D1 (de) 1995-05-24
KR100216100B1 (ko) 1999-08-16
EP0469614B1 (de) 1995-04-19

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