JP3313277B2 - ファインパターン用電解銅箔とその製造方法 - Google Patents

ファインパターン用電解銅箔とその製造方法

Info

Publication number: JP3313277B2
Authority: JP; Japan
Prior art keywords: copper foil; copper; roughness; untreated; foil
Prior art date: 1995-09-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP10674396A

Other languages

English (en)

Japanese (ja)

Other versions

JPH09143785A (ja

Inventor

アダム・エム・ウォルスキー

ミッシェル・ストレール

昭利鈴木

英雄大塚

Original Assignee

古河サーキットフォイル株式会社

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-09-22

Filing date

1996-04-26

Publication date

2002-08-12

1996-04-26 Priority to JP10674396A priority Critical patent/JP3313277B2/ja

1996-04-26 Application filed by 古河サーキットフォイル株式会社 filed Critical 古河サーキットフォイル株式会社

1996-09-16 Priority to CA002230256A priority patent/CA2230256C/en

1996-09-16 Priority to BR9610640A priority patent/BR9610640A/pt

1996-09-16 Priority to CZ1998775A priority patent/CZ292666B6/cs

1996-09-16 Priority to SK344-98A priority patent/SK282866B6/sk

1996-09-16 Priority to EP96928652A priority patent/EP0851944B1/de

1996-09-16 Priority to ES96928652T priority patent/ES2131952T3/es

1996-09-16 Priority to DK96928652T priority patent/DK0851944T3/da

1996-09-16 Priority to DE0851944T priority patent/DE851944T1/de

1996-09-16 Priority to DE69602104T priority patent/DE69602104T2/de

1996-09-16 Priority to AT96928652T priority patent/ATE178954T1/de

1996-09-16 Priority to PCT/IB1996/000951 priority patent/WO1997011210A1/en

1996-09-17 Priority to MYPI96003842A priority patent/MY114311A/en

1996-09-17 Priority to SG1996010645A priority patent/SG70999A1/en

1996-09-18 Priority to TW085111434A priority patent/TW332223B/zh

1996-09-18 Priority to US08/715,104 priority patent/US5834140A/en

1996-09-21 Priority to KR1019960041501A priority patent/KR970070247A/ko

1997-06-03 Publication of JPH09143785A publication Critical patent/JPH09143785A/ja

2002-08-12 Application granted granted Critical

2002-08-12 Publication of JP3313277B2 publication Critical patent/JP3313277B2/ja

2016-04-26 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 119
239000011889 copper foil Substances 0.000 title claims abstract description 97
238000004519 manufacturing process Methods 0.000 title claims description 5
239000003292 glue Substances 0.000 claims abstract description 21
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 9
150000004676 glycans Chemical class 0.000 claims abstract description 8
229920001282 polysaccharide Polymers 0.000 claims abstract description 8
239000005017 polysaccharide Substances 0.000 claims abstract description 8
238000000034 method Methods 0.000 claims description 7
238000005868 electrolysis reaction Methods 0.000 claims description 6
150000001875 compounds Chemical class 0.000 claims description 5
239000007788 liquid Substances 0.000 claims description 5
229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 4
239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 4
235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 4
125000003396 thiol group Chemical group [H]S* 0.000 claims description 3
KCXFHTAICRTXLI-UHFFFAOYSA-M propane-1-sulfonate Chemical compound CCCS([O-])(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-M 0.000 claims 1
230000003746 surface roughness Effects 0.000 abstract description 26
229910052802 copper Inorganic materials 0.000 abstract description 22
239000010949 copper Substances 0.000 abstract description 22
238000007788 roughening Methods 0.000 abstract description 19
239000003792 electrolyte Substances 0.000 abstract description 8
150000002894 organic compounds Chemical class 0.000 abstract description 8
OBDVFOBWBHMJDG-UHFFFAOYSA-M 3-sulfanylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-M 0.000 abstract description 5
229920002472 Starch Polymers 0.000 abstract description 5
235000019698 starch Nutrition 0.000 abstract description 5
229920002678 cellulose Polymers 0.000 abstract description 3
235000010980 cellulose Nutrition 0.000 abstract description 3
150000001720 carbohydrates Chemical class 0.000 abstract description 2
235000014633 carbohydrates Nutrition 0.000 abstract description 2
229920001971 elastomer Polymers 0.000 abstract description 2
239000005060 rubber Substances 0.000 abstract description 2
235000013311 vegetables Nutrition 0.000 abstract 1
238000005530 etching Methods 0.000 description 25
239000008151 electrolyte solution Substances 0.000 description 16
239000011888 foil Substances 0.000 description 15
239000000654 additive Substances 0.000 description 13
230000000052 comparative effect Effects 0.000 description 13
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 10
230000000996 additive effect Effects 0.000 description 9
230000000694 effects Effects 0.000 description 9
239000000758 substrate Substances 0.000 description 8
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
238000004381 surface treatment Methods 0.000 description 7
239000010936 titanium Substances 0.000 description 7
229910052719 titanium Inorganic materials 0.000 description 7
238000000151 deposition Methods 0.000 description 6
238000011156 evaluation Methods 0.000 description 6
238000007747 plating Methods 0.000 description 6
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 5
239000013078 crystal Substances 0.000 description 5
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
229920000159 gelatin Polymers 0.000 description 4
239000000463 material Substances 0.000 description 4
239000000203 mixture Substances 0.000 description 4
229920005989 resin Polymers 0.000 description 4
239000011347 resin Substances 0.000 description 4
FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 4
239000000243 solution Substances 0.000 description 4
108010010803 Gelatin Proteins 0.000 description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
230000007423 decrease Effects 0.000 description 3
230000008021 deposition Effects 0.000 description 3
238000005516 engineering process Methods 0.000 description 3
239000008273 gelatin Substances 0.000 description 3
235000019322 gelatine Nutrition 0.000 description 3
235000011852 gelatine desserts Nutrition 0.000 description 3
239000008107 starch Substances 0.000 description 3
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
239000002585 base Substances 0.000 description 2
239000001913 cellulose Substances 0.000 description 2
229910001431 copper ion Inorganic materials 0.000 description 2
229910000365 copper sulfate Inorganic materials 0.000 description 2
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
239000000428 dust Substances 0.000 description 2
238000004070 electrodeposition Methods 0.000 description 2
238000002347 injection Methods 0.000 description 2
239000007924 injection Substances 0.000 description 2
238000009413 insulation Methods 0.000 description 2
239000011229 interlayer Substances 0.000 description 2
239000010410 layer Substances 0.000 description 2
150000004706 metal oxides Chemical class 0.000 description 2
229910000510 noble metal Inorganic materials 0.000 description 2
239000003921 oil Substances 0.000 description 2
239000002245 particle Substances 0.000 description 2
238000000059 patterning Methods 0.000 description 2
229910052717 sulfur Inorganic materials 0.000 description 2
239000011593 sulfur Substances 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 description 1
229920001353 Dextrin Polymers 0.000 description 1
239000004375 Dextrin Substances 0.000 description 1
241000196324 Embryophyta Species 0.000 description 1
102000004190 Enzymes Human genes 0.000 description 1
108090000790 Enzymes Proteins 0.000 description 1
229920000084 Gum arabic Polymers 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
241000978776 Senegalia senegal Species 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
229920001938 Vegetable gum Polymers 0.000 description 1
239000000205 acacia gum Substances 0.000 description 1
235000010489 acacia gum Nutrition 0.000 description 1
DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000003513 alkali Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000001768 carboxy methyl cellulose Substances 0.000 description 1
229920003090 carboxymethyl hydroxyethyl cellulose Polymers 0.000 description 1
229920003086 cellulose ether Polymers 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000000084 colloidal system Substances 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
230000007547 defect Effects 0.000 description 1
235000019425 dextrin Nutrition 0.000 description 1
238000010586 diagram Methods 0.000 description 1
230000005611 electricity Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
230000004927 fusion Effects 0.000 description 1
239000011521 glass Substances 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
235000015110 jellies Nutrition 0.000 description 1
239000008274 jelly Substances 0.000 description 1
239000002932 luster Substances 0.000 description 1
230000010534 mechanism of action Effects 0.000 description 1
235000013379 molasses Nutrition 0.000 description 1
239000006259 organic additive Substances 0.000 description 1
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000011734 sodium Substances 0.000 description 1
235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
229920001027 sodium carboxymethylcellulose Polymers 0.000 description 1
238000005507 spraying Methods 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
230000035882 stress Effects 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000008646 thermal stress Effects 0.000 description 1
238000005406 washing Methods 0.000 description 1
238000004804 winding Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Manufacturing & Machinery (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Manufacturing Of Printed Wiring (AREA)
Electrolytic Production Of Metals (AREA)
Electroplating And Plating Baths Therefor (AREA)
Cell Electrode Carriers And Collectors (AREA)
Electroplating Methods And Accessories (AREA)
Physical Vapour Deposition (AREA)
Chemically Coating (AREA)

JP10674396A 1995-09-22 1996-04-26 ファインパターン用電解銅箔とその製造方法 Expired - Fee Related JP3313277B2 (ja)

Priority Applications (17)

Application Number	Priority Date	Filing Date	Title
JP10674396A JP3313277B2 (ja)	1995-09-22	1996-04-26	ファインパターン用電解銅箔とその製造方法
DE69602104T DE69602104T2 (de)	1995-09-22	1996-09-16	Elektroplattierte kupferfolie und verfahren zu deren herstellung
CZ1998775A CZ292666B6 (cs)	1995-09-22	1996-09-16	Způsob výroby elektrolyticky nanášené měděné fólie
SK344-98A SK282866B6 (sk)	1995-09-22	1996-09-16	Spôsob výroby medenej fólie, medená fólia a jej použitie
EP96928652A EP0851944B1 (de)	1995-09-22	1996-09-16	Elektroplattierte kupferfolie und verfahren zu deren herstellung
ES96928652T ES2131952T3 (es)	1995-09-22	1996-09-16	Metodo para producir chapa delgada de cobre electrodepositada y chapa delgada de cobre obtenida por el mismo.
DK96928652T DK0851944T3 (da)	1995-09-22	1996-09-16	Fremgangsmåde til fremstilling af elektroafsat kobberfolie og kobberfolie fremstillet derved
DE0851944T DE851944T1 (de)	1995-09-22	1996-09-16	Elektroplattierte kupferfolie und verfahren zu deren herstellung
CA002230256A CA2230256C (en)	1995-09-22	1996-09-16	Method for producing electrodeposited copper foil and copper foil obtained by same
AT96928652T ATE178954T1 (de)	1995-09-22	1996-09-16	Elektroplattierte kupferfolie und verfahren zu deren herstellung
PCT/IB1996/000951 WO1997011210A1 (en)	1995-09-22	1996-09-16	Method for producing electrodeposited copper foil and copper foil obtained by same
BR9610640A BR9610640A (pt)	1995-09-22	1996-09-16	Método para a produção de lámina de cobre eletrodepositado e lámina de cobre obtida por esse processo
MYPI96003842A MY114311A (en)	1995-09-22	1996-09-17	Electrodeposited copper foil for fine pattern and method for producing the same
SG1996010645A SG70999A1 (en)	1995-09-22	1996-09-17	Electrodeposited copper foil for fine pattern and method for producing the same
TW085111434A TW332223B (en)	1995-09-22	1996-09-18	Electrodeposited copper foil for fine pattern and method for producing the same
US08/715,104 US5834140A (en)	1995-09-22	1996-09-18	Electrodeposited copper foil for fine pattern and method for producing the same
KR1019960041501A KR970070247A (ko)	1995-09-22	1996-09-21	미세 패턴용 전해 구리 호일 및 그의 제조 방법

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP24426295		1995-09-22
JP7-244262		1995-09-22
JP10674396A JP3313277B2 (ja)	1995-09-22	1996-04-26	ファインパターン用電解銅箔とその製造方法

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2002018412A Division JP3660628B2 (ja)	1995-09-22	2002-01-28	ファインパターン用電解銅箔とその製造方法

Publications (2)

Publication Number	Publication Date
JPH09143785A JPH09143785A (ja)	1997-06-03
JP3313277B2 true JP3313277B2 (ja)	2002-08-12

Family

ID=26446848

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP10674396A Expired - Fee Related JP3313277B2 (ja)	1995-09-22	1996-04-26	ファインパターン用電解銅箔とその製造方法

Country Status (16)

Country	Link
US (1)	US5834140A (de)
EP (1)	EP0851944B1 (de)
JP (1)	JP3313277B2 (de)
KR (1)	KR970070247A (de)
AT (1)	ATE178954T1 (de)
BR (1)	BR9610640A (de)
CA (1)	CA2230256C (de)
CZ (1)	CZ292666B6 (de)
DE (2)	DE851944T1 (de)
DK (1)	DK0851944T3 (de)
ES (1)	ES2131952T3 (de)
MY (1)	MY114311A (de)
SG (1)	SG70999A1 (de)
SK (1)	SK282866B6 (de)
TW (1)	TW332223B (de)
WO (1)	WO1997011210A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7789976B2 (en)	2003-05-14	2010-09-07	Fukuda Metal Foil & Powder Co., Ltd.	Low surface roughness electrolytic copper foil and process for producing the same
WO2012002380A1 (ja)	2010-06-28	2012-01-05	古河電気工業株式会社	電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
WO2012046804A1 (ja)	2010-10-06	2012-04-12	古河電気工業株式会社	銅箔及びその製造方法、キャリア付き銅箔及びその製造方法、プリント配線板、多層プリント配線板
TWI584522B (zh) *	2011-11-29	2017-05-21	Furukawa Electric Co Ltd	Electrode collector, nonaqueous electrolyte secondary battery negative electrode, nonaqueous electrolyte secondary battery

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3742144B2 (ja) *	1996-05-08	2006-02-01	ソニー株式会社	非水電解液二次電池及び非水電解液二次電池用の平面状集電体
JPH10330983A (ja)	1997-05-30	1998-12-15	Fukuda Metal Foil & Powder Co Ltd	電解銅箔及びその製造方法
US5989727A (en) *	1998-03-04	1999-11-23	Circuit Foil U.S.A., Inc.	Electrolytic copper foil having a modified shiny side
DE19937843C1 (de) *	1999-08-13	2001-02-08	Bolta Werke Gmbh	Verfahren zur Herstellung einer selbsttragenden Kupferfolie
LU90532B1 (en) *	2000-02-24	2001-08-27	Circuit Foil Luxembourg Trading Sarl	Comosite copper foil and manufacturing method thereof
JP3794613B2 (ja) *	2000-05-18	2006-07-05	三井金属鉱業株式会社	電解銅箔の電解装置
US7148566B2 (en) *	2001-03-26	2006-12-12	International Business Machines Corporation	Method and structure for an organic package with improved BGA life
KR100429770B1 (ko) *	2001-11-15	2004-05-03	한국과학기술연구원	구리 전기 도금 용액
JP4136496B2 (ja) *	2002-07-02	2008-08-20	三井金属鉱業株式会社	電解銅箔の製造方法
JP3789107B2 (ja) *	2002-07-23	2006-06-21	株式会社日鉱マテリアルズ	特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4413552B2 (ja) *	2002-08-01	2010-02-10	古河電気工業株式会社	電解銅箔および二次電池集電体用電解銅箔
TW200403358A (en) *	2002-08-01	2004-03-01	Furukawa Circuit Foil	Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector
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KR100389061B1 (ko) *	2002-11-14	2003-06-25	일진소재산업주식회사	전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
KR100454270B1 (ko) *	2002-11-29	2004-10-26	엘지전선 주식회사	저조도 전해동박의 제조방법 및 전해동박
KR100559933B1 (ko) *	2002-11-29	2006-03-13	엘에스전선 주식회사	저조도 동박의 전해연마방법 및 전해연마장치와 동박
TW200424359A (en) *	2003-02-04	2004-11-16	Furukawa Circuit Foil	Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
JP2004244656A (ja) *	2003-02-12	2004-09-02	Furukawa Techno Research Kk	高周波用途対応可能銅箔とその製造方法
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CN1806067B (zh) *	2003-07-29	2010-06-16	日矿金属株式会社	含有具有特定骨架的含二烷基氨基的聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
EP1531656A3 (de) *	2003-11-11	2007-10-03	Furukawa Circuit Foil Co., Ltd.	Ultradünne Kupferfolie mit Träger und Leiterplatte unter Verwendung einer ultradünnen Kupferfolie mit Träger
JP4087369B2 (ja) *	2003-11-11	2008-05-21	古河サーキットフォイル株式会社	キャリア付き極薄銅箔、およびプリント配線板
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DE602005022650D1 (de) *	2004-04-26	2010-09-16	Rohm & Haas Elect Mat	Verbessertes Plattierungsverfahren
JP2006103189A (ja) *	2004-10-06	2006-04-20	Furukawa Circuit Foil Kk	表面処理銅箔並びに回路基板
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US20070015051A1 (en) *	2005-07-18	2007-01-18	Shen Ko C	Secondary battery
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JP6346244B2 (ja) *	2015-11-10	2018-06-20	Ｊｘ金属株式会社	電解銅箔、電解銅箔の製造方法、銅張積層板、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法
US10448507B2 (en) *	2016-01-15	2019-10-15	Jx Nippon Mining & Metals Corporation	Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
WO2018193935A1 (ja) *	2017-04-17	2018-10-25	住友金属鉱山株式会社	導電性基板、導電性基板の製造方法
CN109601024A (zh) *	2017-07-31	2019-04-09	卢森堡电路箔片股份有限公司	表面处理过的铜箔和覆铜箔层压板
WO2019024974A1 (en) *	2017-07-31	2019-02-07	Circuit Foil Luxembourg, Sàrl	COPPER LAMINATE AND PRINTED CIRCUIT BOARD COMPRISING THE SAME
CN109115795B (zh) *	2018-09-06	2020-11-13	嘉兴鼎尚信息科技有限公司	雾化系统、使用该雾化系统的检测设备及工作方法
TWI675128B (zh) *	2019-04-19	2019-10-21	長春石油化學股份有限公司	電解銅箔
CN112981473B (zh) *	2021-02-05	2021-11-23	广东嘉元科技股份有限公司	一种电解铜箔及其制备方法
LU500134B1 (en)	2021-05-07	2022-11-08	Circuit Foil Luxembourg	Method for producing an electrodeposited copper foil and copper foil obtained therewith
US20230029200A1 (en) *	2021-07-22	2023-01-26	Coherent, Inc.	Actively cooled end-pumped solid-state laser gain medium
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Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SU1019026A1 (ru) *	1981-08-26	1983-05-23	Ленинградский Ордена Трудового Красного Знамени И Ордена Октябрьской Революции Технологический Институт Им.Ленсовета	Электролит дл получени медной фольги
DE3836521C2 (de) *	1988-10-24	1995-04-13	Atotech Deutschland Gmbh	Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
US5171417A (en) *	1989-09-13	1992-12-15	Gould Inc.	Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same
US5215645A (en) *	1989-09-13	1993-06-01	Gould Inc.	Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5403465A (en) *	1990-05-30	1995-04-04	Gould Inc.	Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
KR100275899B1 (ko) *	1990-05-30	2000-12-15	마이클 에이. 센타니	전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법
US5431803A (en) *	1990-05-30	1995-07-11	Gould Electronics Inc.	Electrodeposited copper foil and process for making same
DE4126502C1 (de) *	1991-08-07	1993-02-11	Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4324995C2 (de) *	1993-07-26	1995-12-21	Demetron Gmbh	Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen

1996
- 1996-04-26 JP JP10674396A patent/JP3313277B2/ja not_active Expired - Fee Related
- 1996-09-16 ES ES96928652T patent/ES2131952T3/es not_active Expired - Lifetime
- 1996-09-16 DK DK96928652T patent/DK0851944T3/da active
- 1996-09-16 WO PCT/IB1996/000951 patent/WO1997011210A1/en not_active Ceased
- 1996-09-16 DE DE0851944T patent/DE851944T1/de active Pending
- 1996-09-16 SK SK344-98A patent/SK282866B6/sk unknown
- 1996-09-16 DE DE69602104T patent/DE69602104T2/de not_active Expired - Lifetime
- 1996-09-16 EP EP96928652A patent/EP0851944B1/de not_active Expired - Lifetime
- 1996-09-16 CZ CZ1998775A patent/CZ292666B6/cs not_active IP Right Cessation
- 1996-09-16 CA CA002230256A patent/CA2230256C/en not_active Expired - Lifetime
- 1996-09-16 BR BR9610640A patent/BR9610640A/pt not_active IP Right Cessation
- 1996-09-16 AT AT96928652T patent/ATE178954T1/de not_active IP Right Cessation
- 1996-09-17 SG SG1996010645A patent/SG70999A1/en unknown
- 1996-09-17 MY MYPI96003842A patent/MY114311A/en unknown
- 1996-09-18 US US08/715,104 patent/US5834140A/en not_active Expired - Lifetime
- 1996-09-18 TW TW085111434A patent/TW332223B/zh not_active IP Right Cessation
- 1996-09-21 KR KR1019960041501A patent/KR970070247A/ko not_active Ceased

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7789976B2 (en)	2003-05-14	2010-09-07	Fukuda Metal Foil & Powder Co., Ltd.	Low surface roughness electrolytic copper foil and process for producing the same
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KR20160119269A (ko)	2010-06-28	2016-10-12	후루카와 덴키 고교 가부시키가이샤	전해 동박, 리튬 이온 이차 전지용 전해 동박, 상기 전해 동박을 이용한 리튬 이온 이차 전지용 전극, 상기 전극을 사용한 리튬 이온 이차 전지
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Also Published As

Publication number	Publication date
MY114311A (en)	2002-09-30
DE69602104D1 (de)	1999-05-20
ES2131952T3 (es)	1999-08-01
EP0851944B1 (de)	1999-04-14
DE69602104T2 (de)	1999-10-28
SK34498A3 (en)	1998-12-02
SG70999A1 (en)	2000-03-21
DK0851944T3 (da)	1999-10-25
DE851944T1 (de)	1998-11-19
EP0851944A1 (de)	1998-07-08
CA2230256C (en)	2002-01-08
TW332223B (en)	1998-05-21
BR9610640A (pt)	1999-05-18
CA2230256A1 (en)	1997-03-27
SK282866B6 (sk)	2003-01-09
ATE178954T1 (de)	1999-04-15
CZ77598A3 (cs)	1998-09-16
US5834140A (en)	1998-11-10
JPH09143785A (ja)	1997-06-03
KR970070247A (ko)	1997-11-07
CZ292666B6 (cs)	2003-11-12
WO1997011210A1 (en)	1997-03-27

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