JP3738603B2 - Ａｃｆ貼着装置 - Google Patents

Ａｃｆ貼着装置 Download PDF

Info

Publication number
JP3738603B2
JP3738603B2 JP15138099A JP15138099A JP3738603B2 JP 3738603 B2 JP3738603 B2 JP 3738603B2 JP 15138099 A JP15138099 A JP 15138099A JP 15138099 A JP15138099 A JP 15138099A JP 3738603 B2 JP3738603 B2 JP 3738603B2
Authority
JP
Japan
Prior art keywords
acf
tape
roller
peeling
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP15138099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000340616A5 (2
JP2000340616A (ja
Inventor
秀明 片保
弘司 平迫
則之 岩崎
Original Assignee
日立ハイテク電子エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立ハイテク電子エンジニアリング株式会社 filed Critical 日立ハイテク電子エンジニアリング株式会社
Priority to JP15138099A priority Critical patent/JP3738603B2/ja
Publication of JP2000340616A publication Critical patent/JP2000340616A/ja
Publication of JP2000340616A5 publication Critical patent/JP2000340616A5/ja
Application granted granted Critical
Publication of JP3738603B2 publication Critical patent/JP3738603B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors

Landscapes

  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP15138099A 1999-05-31 1999-05-31 Ａｃｆ貼着装置 Expired - Fee Related JP3738603B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15138099A JP3738603B2 (ja) 1999-05-31 1999-05-31 Ａｃｆ貼着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15138099A JP3738603B2 (ja) 1999-05-31 1999-05-31 Ａｃｆ貼着装置

Publications (3)

Publication Number Publication Date
JP2000340616A JP2000340616A (ja) 2000-12-08
JP2000340616A5 JP2000340616A5 (2) 2005-06-16
JP3738603B2 true JP3738603B2 (ja) 2006-01-25

Family

ID=15517316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15138099A Expired - Fee Related JP3738603B2 (ja) 1999-05-31 1999-05-31 Ａｃｆ貼着装置

Country Status (1)

Country Link
JP (1) JP3738603B2 (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3852378B2 (ja) 2002-07-09 2006-11-29 株式会社日立ハイテクノロジーズ Ａｃｆ供給装置及びａｃｆ供給方法
JP4597061B2 (ja) * 2006-02-09 2010-12-15 株式会社ディスコ 保護テープの剥離方法
JP5838305B2 (ja) * 2012-05-31 2016-01-06 パナソニックＩｐマネジメント株式会社 Ａｃｆ貼着装置及びａｃｆ貼着方法
JP6778293B2 (ja) 2019-03-14 2020-10-28 株式会社スクウェア・エニックス リズムゲームプログラム及びゲームシステム

Also Published As

Publication number Publication date
JP2000340616A (ja) 2000-12-08

Similar Documents

Publication Publication Date Title
JP4255433B2 (ja) 枚葉体の貼合せ方法およびこれを用いた装置
CN101916001B (zh) Acf粘贴方法以及acf粘贴装置
JP4311522B2 (ja) 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
JP3880397B2 (ja) 保護テープの貼付・剥離方法
JP5096835B2 (ja) Ａｃｆ貼付け装置及びフラットパネルディスプレイの製造装置
JP3956084B2 (ja) 半導体ウェーハへのダイボンドテープ貼り付け方法及び装置
CN102948021A (zh) 带贴附装置和带贴附方法
CN103545168A (zh) 粘合带、粘合带的粘贴方法及粘合带粘贴装置
CN100460998C (zh) 粘着标签、粘着标签卷、感光卷筒纸状件单元和用于制造感光层叠体的装置和方法
JP3738603B2 (ja) Ａｃｆ貼着装置
JPH08133560A (ja) 粘着性テープ片の貼着装置および貼着方法
CN218366490U (zh) 一种微小膜料贴合设备
JP2019145569A (ja) シート貼付装置およびシート貼付方法
KR20030060471A (ko) 반도체 팩키지 제조용 테이프 커버 박리 장치 및, 테이프커버 박리 방법
JP3852378B2 (ja) Ａｃｆ供給装置及びａｃｆ供給方法
JP2001294361A (ja) 粘着テープ貼付装置及び部品実装機とディスプレイパネル
JP2011014790A (ja) Ａｃｆ貼付装置及び貼付方法
JP2013035685A (ja) 粘着テープの貼着装置及び貼着方法
JPS6054641B2 (ja) 粘着偏光板のセルへの自動的連続貼着方法
WO2007141966A1 (ja) 電子部品の実装装置
CN101373285B (zh) Acf粘贴装置以及平板显示器的制造装置
JPH0926594A (ja) Ａｃｆテープのカッタ装置
JP2006186151A (ja) テープ剥離方法と装置
JP2955398B2 (ja) 離型紙剥離装置及び離型紙剥離方法
JP2007057957A (ja) Ａｃｆ貼り付け方法及びａｃｆ貼り付け装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040914

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040914

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050419

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050426

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050623

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050719

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20051011

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20051024

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081111

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091111

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101111

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111111

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111111

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121111

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131111

Year of fee payment: 8

LAPS Cancellation because of no payment of annual fees