JP3924751B2 - 有機電界発光膜蒸着用蒸着源 - Google Patents
有機電界発光膜蒸着用蒸着源 Download PDFInfo
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- JP3924751B2 JP3924751B2 JP2003277602A JP2003277602A JP3924751B2 JP 3924751 B2 JP3924751 B2 JP 3924751B2 JP 2003277602 A JP2003277602 A JP 2003277602A JP 2003277602 A JP2003277602 A JP 2003277602A JP 3924751 B2 JP3924751 B2 JP 3924751B2
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- 230000008021 deposition Effects 0.000 title claims abstract description 69
- 238000007740 vapor deposition Methods 0.000 claims abstract description 254
- 239000000463 material Substances 0.000 claims abstract description 167
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 230000005684 electric field Effects 0.000 claims 2
- 238000000151 deposition Methods 0.000 description 54
- 230000008859 change Effects 0.000 description 19
- 238000005019 vapor deposition process Methods 0.000 description 17
- 230000008016 vaporization Effects 0.000 description 12
- 238000009834 vaporization Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 7
- 238000005137 deposition process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- -1 aluminum (Al) Chemical class 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
前記側壁の内面には、上下方向に複数の溝が形成され、これに対応する前記上部プレートの外面には、前記側壁の前記各溝に収容され得る大きさの複数の突起部が形成され、前記上部プレートの上下移動のときに、上部プレートの前記各突起部が前記側壁の前記各溝に沿って移動することを特徴とする。
前記側壁の内面には、上下方向に複数の溝が形成され、これに対応する前記底部材の外面には、前記側壁の前記各溝に収容され得る大きさの複数の突起部が形成され、前記底部材の上下移動のときに、底部材の前記各突起部が前記側壁の前記各溝に沿って移動することを特徴とする。
<第1の実施形態>
図3aは本発明の第1の実施形態における蒸着源の断面図である。本実施形態における蒸着源100は、上部プレート101、側壁102、及び底部材103からなる容器であり、その内部には、有機電界発光素子の固体蒸着材料(以下、“蒸着材料”と称する)20が収容されている。上部プレート101には、気化された蒸着材料の蒸気を蒸着源100から放出するための蒸気放出開口101A(以下、便宜上“開口”と称する)が形成され、上部プレート101の下面に固定された遮蔽板104は、開口101Aに対応する。
図4は、本発明の第2の実施形態における蒸着源の断面図である。本実施形態における蒸着源200の全体的な構成は、図3a及び図3cに図示された蒸着源100の構成と同一である。また、蒸着源200の上部プレート201を蒸着材料20に熱を供給するための加熱手段(ヒーター)として作用させることも、またはその上部(または下部)に別体の加熱手段を設けることもできる。以下の説明では、上部プレート201が加熱手段として作用する場合を例に挙げて説明する。
図5は、本発明の第3の実施形態における蒸着源の断面図であり、本実施形態における蒸着源300も、やはり加熱手段として作用する上部プレート301、側壁302、及び底部材303からなる。開口301Aが形成され、遮蔽板304が固定された上部プレート301の構成は、前述した第1及び第2の実施形態における蒸着源100及び200の上部プレート101及び201と同一であるため、その説明は省略する。
図7は、本発明の第4の実施形態における蒸着源と基板との関係を概略的に図示した斜視図であり、便宜上、蒸着源400の内部構成は図示しない。
12 基板
13 チャンバー
14 熱絶縁構造体
20 蒸着材料
11A、101,201,301,401 上部プレート
11D、102,202,302 側壁
11E,103,203,303 底部材
101A,201A,301A,401A 蒸気放出開口
101−1 突起部
102−1,303A 溝
104,204,304 遮蔽板
C1,C2,...Cn コイル
Claims (6)
- チャンバー内に設けられ、供給される電力によって加熱され、内部に収納された蒸着材料に熱を伝達し、内部で生成された蒸着材料の蒸気を噴射させて基板表面に蒸着膜を形成する有機電界発光膜蒸着用蒸着源において、
底部材、該底部材の周縁上に立設する側壁、及び該側壁に沿って上下移動可能に配置され、蒸気放出開口を有する上部プレートからなる容器と、
前記上部プレートに設けられ、前記容器内に収容された蒸着材料の表面に熱を供給する加熱手段と、
前記上部プレートに設けられ、前記蒸着材料表面との間隔に関する信号を発生する検知手段と、
前記検知手段の信号に応じて前記上部プレートを上下移動させ、該上部プレートと前記蒸着材料表面との間の間隔を一定に維持させる移動手段と、を含み、
前記側壁の内面には、上下方向に複数の溝が形成され、これに対応する前記上部プレートの外面には、前記側壁の前記各溝に収容され得る大きさの複数の突起部が形成され、前記上部プレートの上下移動のときに、上部プレートの前記各突起部が前記側壁の前記各溝に沿って移動することを特徴とする有機電界発光膜蒸着用蒸着源。 - 前記上部プレートと前記蒸着材料表面との間の間隔が設定された間隔よりも大きい場合、前記上部プレートを下向きに移動するように前記移動手段を作動させる制御手段を、さらに含む請求項1に記載の有機電界発光膜蒸着用蒸着源。
- 前記移動手段は、前記上部プレートに形成された前記蒸気放出開口を通じて噴射される前記蒸着材料の蒸気流れに影響を与えないように、前記蒸気放出開口と対応しない外側に設けられたシリンダーである請求項1に記載の有機電界発光膜蒸着用蒸着源。
- チャンバー内に設けられ、供給される電力によって加熱され、内部に収容された蒸着材料に熱を伝達し、内部で生成された蒸着材料の蒸気を噴射させて基板表面に蒸着膜を形成する有機電界発光膜蒸着用蒸着源において、
蒸気放出開口が形成された上部プレート、該上部プレートの周縁上に立設する側壁、及び該側壁に沿って上下移動可能に配置される底部材からなる容器と、
前記上部プレートに設けられ、前記容器内に収容された蒸着材料の表面に熱を供給する加熱手段と、
前記上部プレートに設けられ、前記蒸着材料表面との間隔に関する信号を発生する検知手段と、
前記検知手段の信号に応じて前記底部材を上下移動させ、前記上部プレートと前記蒸着材料表面との間の間隔を一定に維持させる移動手段と、を含み、
前記側壁の内面には、上下方向に複数の溝が形成され、これに対応する前記底部材の外面には、前記側壁の前記各溝に収容され得る大きさの複数の突起部が形成され、前記底部材の上下移動のときに、底部材の前記各突起部が前記側壁の前記各溝に沿って移動することを特徴とする有機電界発光膜蒸着用蒸着源。 - 前記上部プレートと前記蒸着材料表面との間の間隔が設定された間隔よりも大きい場合、前記底部材を上向きに移動するように前記移動手段を作動させる制御手段を、さらに含む請求項4に記載の有機電界発光膜蒸着用蒸着源。
- 前記検知手段は、光センサーである請求項1または請求項4に記載の有機電界発光膜蒸着用蒸着源。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0042271A KR100471358B1 (ko) | 2002-07-19 | 2002-07-19 | 유기 전자 발광층의 증착 장치 |
| KR10-2002-0058116A KR100471361B1 (ko) | 2002-09-25 | 2002-09-25 | 유기 전계 발광 소자 증착 장치 |
| KR1020020059786A KR100669194B1 (ko) | 2002-10-01 | 2002-10-01 | 유기 전계 발광 소자 증발원 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006343450A Division JP4429305B2 (ja) | 2002-07-19 | 2006-12-20 | 有機電界発光膜蒸着用蒸着源 |
| JP2006343506A Division JP2007123285A (ja) | 2002-07-19 | 2006-12-20 | 有機電界発光膜蒸着用蒸着源 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004095542A JP2004095542A (ja) | 2004-03-25 |
| JP3924751B2 true JP3924751B2 (ja) | 2007-06-06 |
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003277602A Expired - Lifetime JP3924751B2 (ja) | 2002-07-19 | 2003-07-22 | 有機電界発光膜蒸着用蒸着源 |
| JP2006343450A Expired - Lifetime JP4429305B2 (ja) | 2002-07-19 | 2006-12-20 | 有機電界発光膜蒸着用蒸着源 |
| JP2006343506A Pending JP2007123285A (ja) | 2002-07-19 | 2006-12-20 | 有機電界発光膜蒸着用蒸着源 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2006343450A Expired - Lifetime JP4429305B2 (ja) | 2002-07-19 | 2006-12-20 | 有機電界発光膜蒸着用蒸着源 |
| JP2006343506A Pending JP2007123285A (ja) | 2002-07-19 | 2006-12-20 | 有機電界発光膜蒸着用蒸着源 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7025832B2 (ja) |
| EP (3) | EP1560468B1 (ja) |
| JP (3) | JP3924751B2 (ja) |
| CN (1) | CN1226448C (ja) |
| AT (1) | ATE326555T1 (ja) |
| DE (1) | DE60305246T2 (ja) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040144321A1 (en) * | 2003-01-28 | 2004-07-29 | Eastman Kodak Company | Method of designing a thermal physical vapor deposition system |
| US7232588B2 (en) * | 2004-02-23 | 2007-06-19 | Eastman Kodak Company | Device and method for vaporizing temperature sensitive materials |
| US6893939B1 (en) * | 2004-02-25 | 2005-05-17 | Eastman Kodak Company | Thermal physical vapor deposition source with minimized internal condensation effects |
| US20060099344A1 (en) * | 2004-11-09 | 2006-05-11 | Eastman Kodak Company | Controlling the vaporization of organic material |
| US7399422B2 (en) * | 2005-11-29 | 2008-07-15 | Asml Holding N.V. | System and method for forming nanodisks used in imprint lithography and nanodisk and memory disk formed thereby |
| MX2007014483A (es) * | 2005-05-31 | 2008-02-05 | Corus Technology Bv | Aparato y metodo para revestir un sustrato. |
| JP4001296B2 (ja) * | 2005-08-25 | 2007-10-31 | トッキ株式会社 | 有機材料の真空蒸着方法およびその装置 |
| DE102005049906B4 (de) * | 2005-10-17 | 2009-12-03 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Vorrichtung zur Verdampfung von Verdampfungsmaterial |
| US20070178225A1 (en) * | 2005-12-14 | 2007-08-02 | Keiji Takanosu | Vapor deposition crucible, thin-film forming apparatus comprising the same, and method of producing display device |
| JP4847365B2 (ja) * | 2006-03-22 | 2011-12-28 | キヤノン株式会社 | 蒸着源および蒸着装置 |
| JP2007291506A (ja) * | 2006-03-31 | 2007-11-08 | Canon Inc | 成膜方法 |
| KR101106289B1 (ko) * | 2006-08-04 | 2012-01-18 | 순천향대학교 산학협력단 | 증착 공정을 위한 선형 증착 소스 |
| CN101522943B (zh) * | 2006-10-10 | 2013-04-24 | Asm美国公司 | 前体输送系统 |
| DE102008016619B3 (de) * | 2008-04-01 | 2009-11-05 | Kennametal Sintec Keramik Gmbh | Verdampferkörper |
| JP5226773B2 (ja) * | 2008-04-11 | 2013-07-03 | 東芝三菱電機産業システム株式会社 | 均熱装置 |
| US20100189929A1 (en) * | 2009-01-28 | 2010-07-29 | Neal James W | Coating device and deposition apparatus |
| JP5421619B2 (ja) | 2009-03-06 | 2014-02-19 | レオン自動機株式会社 | 食品生地の折り畳み積載方法及び装置 |
| US20120006809A1 (en) * | 2010-06-23 | 2012-01-12 | Colorado State University Research Foundation | Sublimation crucible with embedded heater element |
| TW201200614A (en) * | 2010-06-29 | 2012-01-01 | Hon Hai Prec Ind Co Ltd | Coating device |
| CN102312200B (zh) * | 2010-06-30 | 2014-04-23 | 鸿富锦精密工业(深圳)有限公司 | 蒸镀机 |
| JP5557633B2 (ja) * | 2010-07-15 | 2014-07-23 | 日立造船株式会社 | 蒸着装置 |
| JP5674431B2 (ja) * | 2010-11-17 | 2015-02-25 | 株式会社アルバック | 薄膜形成装置 |
| CN102485952B (zh) * | 2010-12-06 | 2015-09-23 | 理想能源设备有限公司 | 汽化装置以及汽化方法 |
| JP2012132049A (ja) * | 2010-12-20 | 2012-07-12 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置及び真空蒸着方法 |
| DE102010055285A1 (de) * | 2010-12-21 | 2012-06-21 | Solarion Ag Photovoltaik | Verdampferquelle, Verdampferkammer und Beschichtungsverfahren |
| KR101233629B1 (ko) * | 2011-04-13 | 2013-02-15 | 에스엔유 프리시젼 주식회사 | 대용량 박막형성용 증착장치 |
| KR101052435B1 (ko) * | 2011-04-13 | 2011-07-28 | 에스엔유 프리시젼 주식회사 | 박막형성용 증착장치 |
| KR20120116720A (ko) * | 2011-04-13 | 2012-10-23 | 에스엔유 프리시젼 주식회사 | 원료물질 공급장치 |
| KR101252756B1 (ko) * | 2011-08-08 | 2013-04-09 | 공주대학교 산학협력단 | 복수의 증발특성을 갖는 점증발원의 노즐 |
| EP2859053B1 (en) * | 2012-06-08 | 2019-12-25 | University Of Houston | Self-cleaning coatings and methods for making same |
| FR2992976B1 (fr) * | 2012-07-04 | 2014-07-18 | Riber | Dispositif d'evaporation pour appareil de depot sous vide et appareil de depot sous vide comprenant un tel dispositif d'evaporation |
| KR101433901B1 (ko) | 2012-10-25 | 2014-09-01 | 지제이엠 주식회사 | 유기물질의 증착장치 및 방법 |
| CN104099571A (zh) * | 2013-04-01 | 2014-10-15 | 上海和辉光电有限公司 | 蒸发源组件和薄膜沉积装置和薄膜沉积方法 |
| KR102098619B1 (ko) * | 2013-05-31 | 2020-05-25 | 삼성디스플레이 주식회사 | 도가니 장치 및 이를 포함하는 증착 장치 |
| CN105177510B (zh) * | 2015-10-21 | 2018-04-03 | 京东方科技集团股份有限公司 | 蒸镀设备及蒸镀方法 |
| US10876205B2 (en) | 2016-09-30 | 2020-12-29 | Asm Ip Holding B.V. | Reactant vaporizer and related systems and methods |
| US11926894B2 (en) | 2016-09-30 | 2024-03-12 | Asm Ip Holding B.V. | Reactant vaporizer and related systems and methods |
| CN106906445B (zh) * | 2017-03-29 | 2019-02-12 | 武汉华星光电技术有限公司 | 一种蒸发源 |
| CN107805782B (zh) * | 2017-11-27 | 2019-09-20 | 深圳市华星光电半导体显示技术有限公司 | 一种蒸镀装置 |
| WO2019239192A1 (en) * | 2018-06-15 | 2019-12-19 | Arcelormittal | Vacuum deposition facility and method for coating a substrate |
| KR20200020608A (ko) | 2018-08-16 | 2020-02-26 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 승화기 |
| DE102018131905B4 (de) * | 2018-12-12 | 2024-04-25 | VON ARDENNE Asset GmbH & Co. KG | Verdampfungsanordnung und Verfahren |
| KR102221960B1 (ko) * | 2019-03-25 | 2021-03-04 | 엘지전자 주식회사 | 증착 장치 |
| JP7303031B2 (ja) * | 2019-06-07 | 2023-07-04 | 株式会社アルバック | 真空蒸着装置用の蒸着源 |
| CN110344004A (zh) * | 2019-08-29 | 2019-10-18 | 上海天马有机发光显示技术有限公司 | 一种蒸镀坩埚和蒸镀设备 |
| US11624113B2 (en) | 2019-09-13 | 2023-04-11 | Asm Ip Holding B.V. | Heating zone separation for reactant evaporation system |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1556930A (en) * | 1924-07-15 | 1925-10-13 | Grau Hans | Electrical heater |
| US2440135A (en) | 1944-08-04 | 1948-04-20 | Alexander Paul | Method of and apparatus for depositing substances by thermal evaporation in vacuum chambers |
| US2793609A (en) * | 1953-01-26 | 1957-05-28 | British Dielectric Res Ltd | Means for the deposition of materials by evaporation in a vacuum |
| US2955190A (en) * | 1957-07-01 | 1960-10-04 | Ferro Corp | Circuitous resistance plate type electric heater |
| US3904392A (en) * | 1973-03-16 | 1975-09-09 | Eastman Kodak Co | Method of and apparatus for debubbling liquids |
| US3971334A (en) * | 1975-03-04 | 1976-07-27 | Xerox Corporation | Coating device |
| JPS56108286A (en) | 1979-11-01 | 1981-08-27 | Xerox Corp | Method of manufacturing photoreceptor |
| US4440803A (en) * | 1979-11-01 | 1984-04-03 | Xerox Corporation | Process for preparing arsenic-selenium photoreceptors |
| JPS59107075A (ja) * | 1982-12-13 | 1984-06-21 | Mitsubishi Heavy Ind Ltd | 蒸発速度制御方法 |
| JPS6026660A (ja) | 1983-07-26 | 1985-02-09 | Ulvac Corp | 蒸発源の溶融面制御装置 |
| JPS60181267A (ja) * | 1984-02-28 | 1985-09-14 | Mitsubishi Electric Corp | 金属溶融装置 |
| JPS6086270A (ja) | 1984-06-01 | 1985-05-15 | Denki Kagaku Kogyo Kk | 抵抗加熱器の製法 |
| JPH0238559B2 (ja) * | 1984-11-16 | 1990-08-30 | Hitachi Ltd | Bunshisenjochakusochi |
| US4695316A (en) * | 1986-06-27 | 1987-09-22 | Inductotherm Corporation | Multiple induction furnace system using single power supply |
| JPS6314861A (ja) | 1986-07-08 | 1988-01-22 | Nippon Kokan Kk <Nkk> | 真空蒸着装置 |
| JPH02122068A (ja) * | 1988-10-31 | 1990-05-09 | Kawasaki Steel Corp | ドライプレーティング処理における蒸発原料供給方法およびその装置 |
| US4914275A (en) * | 1988-11-08 | 1990-04-03 | Northern Indiana Public Service Company | Regasifier |
| JPH03134159A (ja) * | 1989-10-19 | 1991-06-07 | Matsushita Electric Ind Co Ltd | 真空蒸着源 |
| JPH05139882A (ja) * | 1991-11-20 | 1993-06-08 | Hitachi Ltd | 分子線源 |
| JPH05182196A (ja) * | 1991-12-27 | 1993-07-23 | Sony Corp | 薄膜形成方法及びその装置と真空蒸着用るつぼ |
| JPH0572965U (ja) * | 1992-03-11 | 1993-10-05 | 住友電気工業株式会社 | るつぼ |
| JPH06228740A (ja) * | 1993-01-29 | 1994-08-16 | Sony Corp | 真空蒸着装置 |
| JPH0770739A (ja) * | 1993-09-07 | 1995-03-14 | Mitsubishi Heavy Ind Ltd | 蒸着用るつぼの温度制御装置 |
| US5803976A (en) * | 1993-11-09 | 1998-09-08 | Imperial Chemical Industries Plc | Vacuum web coating |
| JPH07268613A (ja) * | 1994-03-31 | 1995-10-17 | Eiko Eng:Kk | 分子線セル |
| DE4422697C1 (de) | 1994-06-29 | 1996-01-25 | Zsw | Verdampferquelle für eine Aufdampfanlage und ihre Verwendung |
| US5532102A (en) * | 1995-03-30 | 1996-07-02 | Xerox Corporation | Apparatus and process for preparation of migration imaging members |
| DE19605335C1 (de) * | 1996-02-14 | 1997-04-03 | Fraunhofer Ges Forschung | Verfahren und Einrichtung zur Regelung eines Vakuumbedampfungsprozesses |
| EP0826434B1 (en) | 1996-07-31 | 2004-06-16 | Istituto Nazionale Di Fisica Nucleare | Process and apparatus for preparing thin films of polymers and composite materials on different kind of substrates |
| JPH10124869A (ja) * | 1996-10-14 | 1998-05-15 | Fuji Photo Film Co Ltd | 磁気記録媒体の製造装置 |
| US6173609B1 (en) * | 1997-06-20 | 2001-01-16 | Optical Sensor Consultants, Inc. | Optical level sensor |
| CA2237534A1 (en) | 1997-06-23 | 1998-12-23 | P.A. Joel Smith | Rod-fed source pool height monitor |
| JPH1161386A (ja) | 1997-08-22 | 1999-03-05 | Fuji Electric Co Ltd | 有機薄膜発光素子の成膜装置 |
| US20030164225A1 (en) * | 1998-04-20 | 2003-09-04 | Tadashi Sawayama | Processing apparatus, exhaust processing process and plasma processing |
| JP2000012218A (ja) * | 1998-06-23 | 2000-01-14 | Tdk Corp | 有機el素子の製造装置および製造方法 |
| US6251233B1 (en) * | 1998-08-03 | 2001-06-26 | The Coca-Cola Company | Plasma-enhanced vacuum vapor deposition system including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation |
| JP2000138095A (ja) * | 1998-08-26 | 2000-05-16 | Toray Ind Inc | 発光素子の製造方法 |
| US6202591B1 (en) * | 1998-11-12 | 2001-03-20 | Flex Products, Inc. | Linear aperture deposition apparatus and coating process |
| JP2000248358A (ja) * | 1999-03-01 | 2000-09-12 | Casio Comput Co Ltd | 蒸着装置および蒸着方法 |
| JP3095740B2 (ja) * | 1999-05-19 | 2000-10-10 | 福島県 | 有機化合物用蒸発装置 |
| US6464795B1 (en) * | 1999-05-21 | 2002-10-15 | Applied Materials, Inc. | Substrate support member for a processing chamber |
| JP2001052862A (ja) * | 1999-08-04 | 2001-02-23 | Hokuriku Electric Ind Co Ltd | 有機el素子の製造方法と装置 |
| JP2001057289A (ja) | 1999-08-20 | 2001-02-27 | Tdk Corp | 有機el表示装置の製造装置および製造方法 |
| JP4187367B2 (ja) * | 1999-09-28 | 2008-11-26 | 三洋電機株式会社 | 有機発光素子、その製造装置およびその製造方法 |
| TW490714B (en) | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
| US6237529B1 (en) * | 2000-03-03 | 2001-05-29 | Eastman Kodak Company | Source for thermal physical vapor deposition of organic electroluminescent layers |
| JP4785269B2 (ja) * | 2000-05-02 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法及び成膜装置のクリーニング方法 |
| ATE497028T1 (de) | 2000-06-22 | 2011-02-15 | Panasonic Elec Works Co Ltd | Vorrichtung und verfahren zum vakuum-ausdampfen |
| JP3497450B2 (ja) * | 2000-07-06 | 2004-02-16 | 東京エレクトロン株式会社 | バッチ式熱処理装置及びその制御方法 |
| JP2002175878A (ja) * | 2000-09-28 | 2002-06-21 | Sanyo Electric Co Ltd | 層の形成方法及びカラー発光装置の製造方法 |
| US20030015140A1 (en) * | 2001-04-26 | 2003-01-23 | Eastman Kodak Company | Physical vapor deposition of organic layers using tubular sources for making organic light-emitting devices |
| JP4704605B2 (ja) * | 2001-05-23 | 2011-06-15 | 淳二 城戸 | 連続蒸着装置、蒸着装置及び蒸着方法 |
| JP2003002778A (ja) * | 2001-06-26 | 2003-01-08 | International Manufacturing & Engineering Services Co Ltd | 薄膜堆積用分子線セル |
| JP3712646B2 (ja) * | 2001-08-03 | 2005-11-02 | 株式会社エイコー・エンジニアリング | 薄膜堆積用分子線セル |
| US20030101937A1 (en) * | 2001-11-28 | 2003-06-05 | Eastman Kodak Company | Thermal physical vapor deposition source for making an organic light-emitting device |
| US20030168013A1 (en) * | 2002-03-08 | 2003-09-11 | Eastman Kodak Company | Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device |
| US20040007183A1 (en) * | 2002-07-11 | 2004-01-15 | Ulvac, Inc. | Apparatus and method for the formation of thin films |
| US6837939B1 (en) * | 2003-07-22 | 2005-01-04 | Eastman Kodak Company | Thermal physical vapor deposition source using pellets of organic material for making OLED displays |
-
2003
- 2003-07-18 EP EP05003606.0A patent/EP1560468B1/en not_active Expired - Lifetime
- 2003-07-18 US US10/621,471 patent/US7025832B2/en not_active Expired - Lifetime
- 2003-07-18 EP EP05003605.2A patent/EP1560467B1/en not_active Expired - Lifetime
- 2003-07-18 DE DE60305246T patent/DE60305246T2/de not_active Expired - Lifetime
- 2003-07-18 EP EP03016305A patent/EP1382713B1/en not_active Expired - Lifetime
- 2003-07-18 CN CNB031787649A patent/CN1226448C/zh not_active Expired - Lifetime
- 2003-07-18 AT AT03016305T patent/ATE326555T1/de not_active IP Right Cessation
- 2003-07-22 JP JP2003277602A patent/JP3924751B2/ja not_active Expired - Lifetime
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- 2005-11-04 US US11/266,366 patent/US20060070576A1/en not_active Abandoned
- 2005-11-04 US US11/266,365 patent/US7815737B2/en not_active Expired - Lifetime
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- 2006-12-20 JP JP2006343450A patent/JP4429305B2/ja not_active Expired - Lifetime
- 2006-12-20 JP JP2006343506A patent/JP2007123285A/ja active Pending
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| Publication number | Publication date |
|---|---|
| US20060070576A1 (en) | 2006-04-06 |
| CN1487116A (zh) | 2004-04-07 |
| ATE326555T1 (de) | 2006-06-15 |
| EP1382713B1 (en) | 2006-05-17 |
| DE60305246D1 (de) | 2006-06-22 |
| US7815737B2 (en) | 2010-10-19 |
| US20060054089A1 (en) | 2006-03-16 |
| EP1560468B1 (en) | 2018-03-21 |
| JP2004095542A (ja) | 2004-03-25 |
| DE60305246T2 (de) | 2006-09-14 |
| US20040016400A1 (en) | 2004-01-29 |
| JP4429305B2 (ja) | 2010-03-10 |
| EP1560468A1 (en) | 2005-08-03 |
| CN1226448C (zh) | 2005-11-09 |
| JP2007123285A (ja) | 2007-05-17 |
| EP1382713A2 (en) | 2004-01-21 |
| JP2007128898A (ja) | 2007-05-24 |
| EP1560467A1 (en) | 2005-08-03 |
| US7025832B2 (en) | 2006-04-11 |
| EP1382713A3 (en) | 2004-06-02 |
| EP1560467B1 (en) | 2014-02-26 |
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