JP4565673B2 - 一体化されたpcbアセンブリを有するコネクタ - Google Patents
一体化されたpcbアセンブリを有するコネクタ Download PDFInfo
- Publication number
- JP4565673B2 JP4565673B2 JP00177998A JP177998A JP4565673B2 JP 4565673 B2 JP4565673 B2 JP 4565673B2 JP 00177998 A JP00177998 A JP 00177998A JP 177998 A JP177998 A JP 177998A JP 4565673 B2 JP4565673 B2 JP 4565673B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- circuit
- pair
- disposed
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 18
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 210000002105 tongue Anatomy 0.000 description 10
- VAHKBZSAUKPEOV-UHFFFAOYSA-N 1,4-dichloro-2-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=CC=C1Cl VAHKBZSAUKPEOV-UHFFFAOYSA-N 0.000 description 9
- 230000000712 assembly Effects 0.000 description 9
- 238000000429 assembly Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 230000036316 preload Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- UNCGJRRROFURDV-UHFFFAOYSA-N 1,2-dichloro-3-(3,4-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl UNCGJRRROFURDV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3469097P | 1997-01-07 | 1997-01-07 | |
| US034690 | 1997-01-16 | ||
| US08/784,743 US6083047A (en) | 1997-01-16 | 1997-01-16 | Modular electrical PCB assembly connector |
| US784743 | 1997-01-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10270133A JPH10270133A (ja) | 1998-10-09 |
| JP4565673B2 true JP4565673B2 (ja) | 2010-10-20 |
Family
ID=26711259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00177998A Expired - Fee Related JP4565673B2 (ja) | 1997-01-07 | 1998-01-07 | 一体化されたpcbアセンブリを有するコネクタ |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0852414B1 (fr) |
| JP (1) | JP4565673B2 (fr) |
| CN (1) | CN1190807A (fr) |
| CA (1) | CA2225151C (fr) |
| DE (1) | DE69731719T2 (fr) |
| SG (1) | SG71746A1 (fr) |
| TW (1) | TW385579B (fr) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6530790B1 (en) * | 1998-11-24 | 2003-03-11 | Teradyne, Inc. | Electrical connector |
| EP1190470A2 (fr) | 1999-06-16 | 2002-03-27 | FCI 's-Hertogenbosch B.V. | Ensemble connecteur blinde et element de contact utilise dans cet ensemble connecteur |
| NL1012357C2 (nl) * | 1999-06-16 | 2000-12-19 | Berg Electronics Mfg | Afgeschermd connectorsamenstel. |
| NL1012345C2 (nl) * | 1999-06-16 | 2000-12-19 | Berg Electronics Mfg | Connector and method for manufacturing such a connector. |
| WO2000077887A1 (fr) * | 1999-06-16 | 2000-12-21 | Fci 's-Hertogenbosch B.V. | Connecteur, procede de fabrication d'un tel connecteur, et element de contact pour un connecteur |
| NL1012361C2 (nl) * | 1999-06-16 | 2000-12-19 | Berg Electronics Mfg | Connector and contact elements for the same. |
| DE19938782A1 (de) * | 1999-08-16 | 2001-03-22 | Tyco Electronics Logistics Ag | Geschirmter elektrischer Steckverbinder |
| AU6911500A (en) * | 1999-08-17 | 2001-03-13 | Litton Systems, Incorporated | High density electrical interconnect system having enhanced grounding and cross-talk reduction capability |
| US6824391B2 (en) | 2000-02-03 | 2004-11-30 | Tyco Electronics Corporation | Electrical connector having customizable circuit board wafers |
| US6267604B1 (en) * | 2000-02-03 | 2001-07-31 | Tyco Electronics Corporation | Electrical connector including a housing that holds parallel circuit boards |
| CN2419700Y (zh) * | 2000-03-29 | 2001-02-14 | 杨泰和 | 具有与电磁波隔离壳体隔离结构的导电连接接口装置、 |
| US6491545B1 (en) | 2000-05-05 | 2002-12-10 | Molex Incorporated | Modular shielded coaxial cable connector |
| NL1018175C2 (nl) | 2001-05-30 | 2002-12-03 | Fci Mechelen N V | Stekkerblok en kabelconnector. |
| WO2003012928A1 (fr) * | 2001-08-01 | 2003-02-13 | Molex Incorporated | Ensemble connecteur electrique avec modules de bornes a garniture moulee |
| US6979215B2 (en) * | 2001-11-28 | 2005-12-27 | Molex Incorporated | High-density connector assembly with flexural capabilities |
| US7285018B2 (en) | 2004-06-23 | 2007-10-23 | Amphenol Corporation | Electrical connector incorporating passive circuit elements |
| CN101185205B (zh) * | 2005-03-31 | 2011-08-03 | 莫莱克斯公司 | 具有电介质插入件的高密度稳固连接器 |
| CN101335409B (zh) * | 2007-06-29 | 2011-04-27 | 贵州航天电器股份有限公司 | 一种带电路板的高速背板连接器 |
| US8210877B2 (en) * | 2007-12-28 | 2012-07-03 | Fci | Modular connector |
| WO2010030620A2 (fr) * | 2008-09-09 | 2010-03-18 | Molex Incorporated | Blindage de connecteur à aménagement de fixation intégré |
| US20110287663A1 (en) | 2010-05-21 | 2011-11-24 | Gailus Mark W | Electrical connector incorporating circuit elements |
| US8382524B2 (en) | 2010-05-21 | 2013-02-26 | Amphenol Corporation | Electrical connector having thick film layers |
| CN102694308B (zh) * | 2011-03-22 | 2014-09-24 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| AU2012286753A1 (en) | 2011-07-26 | 2014-02-06 | Glysens Incorporated | Tissue implantable sensor with hermetically sealed housing |
| US9022812B2 (en) * | 2011-11-02 | 2015-05-05 | Fci Americas Technology Llc | Electrical connector with reduced normal force |
| US8591257B2 (en) | 2011-11-17 | 2013-11-26 | Amphenol Corporation | Electrical connector having impedance matched intermediate connection points |
| KR101332810B1 (ko) * | 2011-12-28 | 2013-11-27 | 삼성전자주식회사 | 프로브용 커넥터 및 이를 채용한 초음파 진단 장치 |
| US10561353B2 (en) | 2016-06-01 | 2020-02-18 | Glysens Incorporated | Biocompatible implantable sensor apparatus and methods |
| US10660550B2 (en) | 2015-12-29 | 2020-05-26 | Glysens Incorporated | Implantable sensor apparatus and methods |
| US10638962B2 (en) | 2016-06-29 | 2020-05-05 | Glysens Incorporated | Bio-adaptable implantable sensor apparatus and methods |
| US10638979B2 (en) | 2017-07-10 | 2020-05-05 | Glysens Incorporated | Analyte sensor data evaluation and error reduction apparatus and methods |
| CN107369932A (zh) * | 2017-08-08 | 2017-11-21 | 四川华丰企业集团有限公司 | 具有多层布线印制板的高速背板连接器 |
| US11278668B2 (en) | 2017-12-22 | 2022-03-22 | Glysens Incorporated | Analyte sensor and medicant delivery data evaluation and error reduction apparatus and methods |
| US11255839B2 (en) | 2018-01-04 | 2022-02-22 | Glysens Incorporated | Apparatus and methods for analyte sensor mismatch correction |
| WO2019219847A1 (fr) * | 2018-05-16 | 2019-11-21 | Interlemo Holding S.A. | Connecteur à haute densité |
| CN109546459B (zh) * | 2019-01-09 | 2023-10-10 | 四川华丰科技股份有限公司 | 带金属屏蔽板的母端信号传输模块 |
| CN112909661B (zh) * | 2021-01-20 | 2023-04-18 | 中航光电科技股份有限公司 | 一种端子模块及使用该端子模块的连接器 |
| CN115332841B (zh) * | 2022-10-14 | 2022-12-30 | 深圳市爱特姆科技有限公司 | 一种便于制造的高频大电流btb连接器 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338717A (en) * | 1980-09-02 | 1982-07-13 | Augat Inc. | Method for fabricating a light emitting diode display socket |
| US4705332A (en) * | 1985-08-05 | 1987-11-10 | Criton Technologies | High density, controlled impedance connectors |
| DE3938964A1 (de) * | 1988-11-24 | 1990-05-31 | Yazaki Corp | Mehrfachstufenverbinder |
| GB9003241D0 (en) * | 1990-02-13 | 1990-04-11 | Gore W L & Ass Uk | Shielded connector |
| US5122065A (en) * | 1991-08-12 | 1992-06-16 | International Business Machines Corp. | Input output connector with coaxial shielding and strain relief |
| JP2728372B2 (ja) * | 1994-12-15 | 1998-03-18 | ケル株式会社 | 電気コネクタ |
| EP0752739B1 (fr) * | 1995-07-03 | 2000-10-25 | Berg Electronics Manufacturing B.V. | Connecteur avec assemblage intégré de circuit imprimé |
-
1997
- 1997-12-17 CA CA002225151A patent/CA2225151C/fr not_active Expired - Fee Related
- 1997-12-29 EP EP97122940A patent/EP0852414B1/fr not_active Expired - Lifetime
- 1997-12-29 DE DE69731719T patent/DE69731719T2/de not_active Expired - Fee Related
-
1998
- 1998-01-02 SG SG1998000014A patent/SG71746A1/en unknown
- 1998-01-06 CN CN98104204A patent/CN1190807A/zh active Pending
- 1998-01-07 JP JP00177998A patent/JP4565673B2/ja not_active Expired - Fee Related
- 1998-01-07 TW TW087100146A patent/TW385579B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10270133A (ja) | 1998-10-09 |
| SG71746A1 (en) | 2000-04-18 |
| CN1190807A (zh) | 1998-08-19 |
| CA2225151A1 (fr) | 1998-07-07 |
| EP0852414A3 (fr) | 1999-10-27 |
| DE69731719T2 (de) | 2005-09-01 |
| CA2225151C (fr) | 2001-02-27 |
| DE69731719D1 (de) | 2004-12-30 |
| EP0852414B1 (fr) | 2004-11-24 |
| EP0852414A2 (fr) | 1998-07-08 |
| TW385579B (en) | 2000-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
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