TW385579B - Connector with integrated PCB assembly - Google Patents

Connector with integrated PCB assembly Download PDF

Info

Publication number: TW385579B
Authority: TW; Taiwan
Prior art keywords: module; circuit; item; patent application; scope
Prior art date: 1997-01-07

Application number

TW087100146A

Other languages

English (en)

Chinese (zh)

Inventor

Bernardus L F Paagman

Original Assignee

Berg Electronics Mfg

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-01-07

Filing date

1998-01-07

Publication date

2000-03-21

1997-01-16 Priority claimed from US08/784,743 external-priority patent/US6083047A/en

1998-01-07 Application filed by Berg Electronics Mfg filed Critical Berg Electronics Mfg

2000-03-21 Application granted granted Critical

2000-03-21 Publication of TW385579B publication Critical patent/TW385579B/zh

Links

239000004020 conductor Substances 0.000 claims abstract description 20
239000000758 substrate Substances 0.000 claims description 33
230000002079 cooperative effect Effects 0.000 claims description 11
239000002184 metal Substances 0.000 claims description 4
229910052751 metal Inorganic materials 0.000 claims description 4
241000269908 Platichthys flesus Species 0.000 claims 1
230000014759 maintenance of location Effects 0.000 abstract description 3
239000010410 layer Substances 0.000 description 17
238000004519 manufacturing process Methods 0.000 description 9
150000003071 polychlorinated biphenyls Chemical class 0.000 description 9
125000006850 spacer group Chemical group 0.000 description 9
VAHKBZSAUKPEOV-UHFFFAOYSA-N 1,4-dichloro-2-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=CC=C1Cl VAHKBZSAUKPEOV-UHFFFAOYSA-N 0.000 description 8
230000000875 corresponding effect Effects 0.000 description 8
238000000034 method Methods 0.000 description 8
230000013011 mating Effects 0.000 description 6
229910000679 solder Inorganic materials 0.000 description 6
238000009434 installation Methods 0.000 description 5
239000000853 adhesive Substances 0.000 description 4
230000001070 adhesive effect Effects 0.000 description 4
238000010586 diagram Methods 0.000 description 4
238000005516 engineering process Methods 0.000 description 4
238000003780 insertion Methods 0.000 description 4
230000037431 insertion Effects 0.000 description 4
230000036316 preload Effects 0.000 description 4
238000005476 soldering Methods 0.000 description 4
239000011810 insulating material Substances 0.000 description 3
239000000463 material Substances 0.000 description 3
238000010276 construction Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
230000004907 flux Effects 0.000 description 2
238000005192 partition Methods 0.000 description 2
230000000717 retained effect Effects 0.000 description 2
229910052710 silicon Inorganic materials 0.000 description 2
239000010703 silicon Substances 0.000 description 2
239000002689 soil Substances 0.000 description 2
238000003466 welding Methods 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000002313 adhesive film Substances 0.000 description 1
239000012790 adhesive layer Substances 0.000 description 1
230000000712 assembly Effects 0.000 description 1
238000000429 assembly Methods 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000013065 commercial product Substances 0.000 description 1
239000002131 composite material Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
238000002788 crimping Methods 0.000 description 1
239000002274 desiccant Substances 0.000 description 1
238000013461 design Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
238000009413 insulation Methods 0.000 description 1
208000030175 lameness Diseases 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
239000002991 molded plastic Substances 0.000 description 1
230000008520 organization Effects 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000007639 printing Methods 0.000 description 1
238000000926 separation method Methods 0.000 description 1
230000008054 signal transmission Effects 0.000 description 1
238000010561 standard procedure Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Details Of Connecting Devices For Male And Female Coupling (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)

TW087100146A 1997-01-07 1998-01-07 Connector with integrated PCB assembly TW385579B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US3469097P	1997-01-07	1997-01-07
US08/784,743 US6083047A (en)	1997-01-16	1997-01-16	Modular electrical PCB assembly connector

Publications (1)

Publication Number	Publication Date
TW385579B true TW385579B (en)	2000-03-21

Family

ID=26711259

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW087100146A TW385579B (en)	1997-01-07	1998-01-07	Connector with integrated PCB assembly

Country Status (7)

Country	Link
EP (1)	EP0852414B1 (fr)
JP (1)	JP4565673B2 (fr)
CN (1)	CN1190807A (fr)
CA (1)	CA2225151C (fr)
DE (1)	DE69731719T2 (fr)
SG (1)	SG71746A1 (fr)
TW (1)	TW385579B (fr)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6530790B1 (en) *	1998-11-24	2003-03-11	Teradyne, Inc.	Electrical connector
NL1012357C2 (nl) *	1999-06-16	2000-12-19	Berg Electronics Mfg	Afgeschermd connectorsamenstel.
WO2000077887A1 (fr) *	1999-06-16	2000-12-21	Fci 's-Hertogenbosch B.V.	Connecteur, procede de fabrication d'un tel connecteur, et element de contact pour un connecteur
NL1012361C2 (nl) *	1999-06-16	2000-12-19	Berg Electronics Mfg	Connector and contact elements for the same.
WO2001001524A2 (fr) *	1999-06-16	2001-01-04	Fci 's-Hertogenbosch B.V.	Ensemble connecteur blinde et element de contact utilise dans cet ensemble connecteur
NL1012345C2 (nl) *	1999-06-16	2000-12-19	Berg Electronics Mfg	Connector and method for manufacturing such a connector.
DE19938782A1 (de)	1999-08-16	2001-03-22	Tyco Electronics Logistics Ag	Geschirmter elektrischer Steckverbinder
WO2001013468A2 (fr) *	1999-08-17	2001-02-22	Litton Systems, Inc.	Systeme d'interconnexion electrique haute densite dote de possibilites accrues de mise a la masse et de reduction de la diaphonie
US6824391B2 (en) *	2000-02-03	2004-11-30	Tyco Electronics Corporation	Electrical connector having customizable circuit board wafers
US6267604B1 (en) *	2000-02-03	2001-07-31	Tyco Electronics Corporation	Electrical connector including a housing that holds parallel circuit boards
CN2419700Y (zh) *	2000-03-29	2001-02-14	杨泰和	具有与电磁波隔离壳体隔离结构的导电连接接口装置、
US6491545B1 (en)	2000-05-05	2002-12-10	Molex Incorporated	Modular shielded coaxial cable connector
NL1018175C2 (nl)	2001-05-30	2002-12-03	Fci Mechelen N V	Stekkerblok en kabelconnector.
CN1269261C (zh) *	2001-08-01	2006-08-09	莫莱克斯公司	具有嵌模端子模块的电连接器组件
US6979215B2 (en) *	2001-11-28	2005-12-27	Molex Incorporated	High-density connector assembly with flexural capabilities
US7285018B2 (en)	2004-06-23	2007-10-23	Amphenol Corporation	Electrical connector incorporating passive circuit elements
KR20070119717A (ko) *	2005-03-31	2007-12-20	몰렉스 인코포레이티드	유전성 삽입체를 구비한 고밀도 강성 커넥터
CN101335409B (zh) *	2007-06-29	2011-04-27	贵州航天电器股份有限公司	一种带电路板的高速背板连接器
CN101911396B (zh) *	2007-12-28	2013-09-04	Fci公司	模块连接器
US8449312B2 (en) *	2008-09-09	2013-05-28	Molex Incorporated	Housing with a plurality of wafers and having a nose portion with engagement members
US20110287663A1 (en)	2010-05-21	2011-11-24	Gailus Mark W	Electrical connector incorporating circuit elements
US8382524B2 (en)	2010-05-21	2013-02-26	Amphenol Corporation	Electrical connector having thick film layers
CN102694308B (zh) *	2011-03-22	2014-09-24	富士康(昆山)电脑接插件有限公司	电连接器
US10561351B2 (en)	2011-07-26	2020-02-18	Glysens Incorporated	Tissue implantable sensor with hermetically sealed housing
US9022812B2 (en)	2011-11-02	2015-05-05	Fci Americas Technology Llc	Electrical connector with reduced normal force
US8591257B2 (en)	2011-11-17	2013-11-26	Amphenol Corporation	Electrical connector having impedance matched intermediate connection points
KR101332810B1 (ko) *	2011-12-28	2013-11-27	삼성전자주식회사	프로브용 커넥터 및 이를 채용한 초음파 진단 장치
US10660550B2 (en)	2015-12-29	2020-05-26	Glysens Incorporated	Implantable sensor apparatus and methods
US10561353B2 (en)	2016-06-01	2020-02-18	Glysens Incorporated	Biocompatible implantable sensor apparatus and methods
US10638962B2 (en)	2016-06-29	2020-05-05	Glysens Incorporated	Bio-adaptable implantable sensor apparatus and methods
US10638979B2 (en)	2017-07-10	2020-05-05	Glysens Incorporated	Analyte sensor data evaluation and error reduction apparatus and methods
CN107369932A (zh) *	2017-08-08	2017-11-21	四川华丰企业集团有限公司	具有多层布线印制板的高速背板连接器
US11278668B2 (en)	2017-12-22	2022-03-22	Glysens Incorporated	Analyte sensor and medicant delivery data evaluation and error reduction apparatus and methods
US11255839B2 (en)	2018-01-04	2022-02-22	Glysens Incorporated	Apparatus and methods for analyte sensor mismatch correction
CN112292787A (zh) *	2018-05-16	2021-01-29	雷莫股份公司	高密度连接器
CN109546459B (zh) *	2019-01-09	2023-10-10	四川华丰科技股份有限公司	带金属屏蔽板的母端信号传输模块
CN112909661B (zh) *	2021-01-20	2023-04-18	中航光电科技股份有限公司	一种端子模块及使用该端子模块的连接器
CN115332841B (zh) *	2022-10-14	2022-12-30	深圳市爱特姆科技有限公司	一种便于制造的高频大电流btb连接器

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4338717A (en) *	1980-09-02	1982-07-13	Augat Inc.	Method for fabricating a light emitting diode display socket
US4705332A (en) *	1985-08-05	1987-11-10	Criton Technologies	High density, controlled impedance connectors
DE3938964A1 (de) *	1988-11-24	1990-05-31	Yazaki Corp	Mehrfachstufenverbinder
GB9003241D0 (en) *	1990-02-13	1990-04-11	Gore W L & Ass Uk	Shielded connector
US5122065A (en) *	1991-08-12	1992-06-16	International Business Machines Corp.	Input output connector with coaxial shielding and strain relief
JP2728372B2 (ja) *	1994-12-15	1998-03-18	ケル株式会社	電気コネクタ
DE69519226T2 (de) *	1995-07-03	2001-08-23	Berg Electronics Manufacturing B.V., S'-Hertogenbosch	Verbinder mit integrierter Flachbaugruppe

1997
- 1997-12-17 CA CA002225151A patent/CA2225151C/fr not_active Expired - Fee Related
- 1997-12-29 DE DE69731719T patent/DE69731719T2/de not_active Expired - Fee Related
- 1997-12-29 EP EP97122940A patent/EP0852414B1/fr not_active Expired - Lifetime
1998
- 1998-01-02 SG SG1998000014A patent/SG71746A1/en unknown
- 1998-01-06 CN CN98104204A patent/CN1190807A/zh active Pending
- 1998-01-07 JP JP00177998A patent/JP4565673B2/ja not_active Expired - Fee Related
- 1998-01-07 TW TW087100146A patent/TW385579B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
CA2225151A1 (fr)	1998-07-07
DE69731719D1 (de)	2004-12-30
EP0852414A2 (fr)	1998-07-08
EP0852414B1 (fr)	2004-11-24
EP0852414A3 (fr)	1999-10-27
CA2225151C (fr)	2001-02-27
JPH10270133A (ja)	1998-10-09
CN1190807A (zh)	1998-08-19
DE69731719T2 (de)	2005-09-01
JP4565673B2 (ja)	2010-10-20
SG71746A1 (en)	2000-04-18

Legal Events

Date	Code	Title	Description
2000-07-17	GD4A	Issue of patent certificate for granted invention patent
2010-01-01	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
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